DE69130434T2 - Platte zum Arbeiten unter Vakuum - Google Patents

Platte zum Arbeiten unter Vakuum

Info

Publication number
DE69130434T2
DE69130434T2 DE69130434T DE69130434T DE69130434T2 DE 69130434 T2 DE69130434 T2 DE 69130434T2 DE 69130434 T DE69130434 T DE 69130434T DE 69130434 T DE69130434 T DE 69130434T DE 69130434 T2 DE69130434 T2 DE 69130434T2
Authority
DE
Germany
Prior art keywords
plate
under vacuum
working under
working
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69130434T
Other languages
English (en)
Other versions
DE69130434D1 (de
Inventor
Tetsuzo Mori
Mitsuji Marumo
Kazunori Iwamoto
Yuji Chiba
Kazuyuki Kasumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP16993890A external-priority patent/JP2880262B2/ja
Priority claimed from JP18265690A external-priority patent/JP2880264B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69130434D1 publication Critical patent/DE69130434D1/de
Publication of DE69130434T2 publication Critical patent/DE69130434T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/907—Sensor controlled device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE69130434T 1990-06-29 1991-06-25 Platte zum Arbeiten unter Vakuum Expired - Fee Related DE69130434T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16993890A JP2880262B2 (ja) 1990-06-29 1990-06-29 ウエハ保持装置
JP18265690A JP2880264B2 (ja) 1990-07-12 1990-07-12 基板保持装置

Publications (2)

Publication Number Publication Date
DE69130434D1 DE69130434D1 (de) 1998-12-10
DE69130434T2 true DE69130434T2 (de) 1999-04-29

Family

ID=26493118

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69130434T Expired - Fee Related DE69130434T2 (de) 1990-06-29 1991-06-25 Platte zum Arbeiten unter Vakuum

Country Status (3)

Country Link
US (1) US5191218A (de)
EP (1) EP0463853B1 (de)
DE (1) DE69130434T2 (de)

Families Citing this family (92)

* Cited by examiner, † Cited by third party
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JP2919158B2 (ja) * 1992-02-10 1999-07-12 キヤノン株式会社 基板保持装置
JPH06244269A (ja) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法
JP3173928B2 (ja) * 1992-09-25 2001-06-04 キヤノン株式会社 基板保持装置、基板保持方法および露光装置
JP3332425B2 (ja) * 1992-11-10 2002-10-07 キヤノン株式会社 基板保持装置、並びにこれを用いた露光装置と半導体デバイス製造方法
EP0677787B1 (de) * 1994-03-15 1998-10-21 Canon Kabushiki Kaisha Maske und Maskenträger
JP3208000B2 (ja) * 1994-03-28 2001-09-10 キヤノン株式会社 基板保持システム
JP3247554B2 (ja) * 1994-07-19 2002-01-15 キヤノン株式会社 基板搬送装置およびこれを用いた露光装置
JP2590759B2 (ja) * 1994-10-13 1997-03-12 日本電気株式会社 偏光板貼付装置
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JPH09326385A (ja) * 1996-06-04 1997-12-16 Tokyo Electron Ltd 基板冷却方法
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JP3178517B2 (ja) * 1998-03-05 2001-06-18 日本電気株式会社 パターン露光装置用試料台
US6887431B1 (en) * 1999-02-16 2005-05-03 Applera Corporation Bead dispensing system
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JP4230642B2 (ja) * 1999-07-08 2009-02-25 株式会社荏原製作所 基板搬送治具及び基板搬送装置
KR20010030213A (ko) * 1999-09-02 2001-04-16 아끼모토 유미 연마 헤드, 이것을 이용한 연마 장치, 및 연마 상태 검출방법
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US20230176487A1 (en) * 2001-02-19 2023-06-08 Asml Netherlands B.V. Substrate support system, lithographic apparatus and method of exposing a substrate
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US20050000449A1 (en) * 2001-12-21 2005-01-06 Masayuki Ishibashi Susceptor for epitaxial growth and epitaxial growth method
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DE10235482B3 (de) * 2002-08-02 2004-01-22 Süss Microtec Lithography Gmbh Vorrichtung zum Fixieren dünner und flexibler Substrate
JP2004165439A (ja) * 2002-11-13 2004-06-10 Canon Inc ステージ装置
JP4346912B2 (ja) * 2003-01-20 2009-10-21 株式会社 東京ウエルズ 真空吸引システムおよびその制御方法
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JP4600655B2 (ja) * 2004-12-15 2010-12-15 セイコーエプソン株式会社 基板保持方法
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CN105023860B (zh) * 2014-04-16 2017-10-03 北京中电科电子装备有限公司 一种芯片精密操作装置
CN104589239A (zh) * 2014-12-25 2015-05-06 江苏启澜激光科技有限公司 太阳能电池片定位机构
CN104570617B (zh) * 2014-12-25 2016-08-17 浙江大学 基于动态压力检测的浸没流场自适应密封方法
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CN107534011B (zh) * 2015-05-14 2021-01-15 盛美半导体设备(上海)股份有限公司 基板斜边和背面保护装置
KR20170036165A (ko) * 2015-09-23 2017-04-03 삼성전자주식회사 기판 지지 유닛 및 이를 포함하는 기판 처리 장치
EP3402908A1 (de) * 2016-01-13 2018-11-21 Applied Materials, Inc. Halteanordnung zum halten eines substrats, träger zum tragen eines substrats, vakuumbehandlungsanlage, verfahren zum halten eines substrats und verfahren zur freisetzung eines substrats
WO2017137129A1 (en) * 2016-02-08 2017-08-17 Asml Netherlands B.V. Lithographic apparatus, method for unloading a substrate and method for loading a substrate
JP6708455B2 (ja) * 2016-03-25 2020-06-10 キヤノン株式会社 保持装置、保持方法、リソグラフィ装置、および物品の製造方法
JP6833350B2 (ja) * 2016-06-01 2021-02-24 キヤノン株式会社 保持装置、搬送装置、リソグラフィ装置、および物品の製造方法
JP7184525B2 (ja) * 2018-03-08 2022-12-06 株式会社ディスコ チャックテーブルおよびチャックテーブルを備えた加工装置
KR102041044B1 (ko) * 2018-04-30 2019-11-05 피에스케이홀딩스 주식회사 기판 지지 유닛
CN108724234A (zh) * 2018-06-14 2018-11-02 芜湖易泽中小企业公共服务股份有限公司 一种机器人用吸盘装置
TWI701751B (zh) 2019-03-12 2020-08-11 力晶積成電子製造股份有限公司 晶圓夾盤裝置、晶圓形變量的量測方法及半導體製造方法
JP2022062986A (ja) * 2020-10-09 2022-04-21 富士電機株式会社 半導体検査装置および半導体ウエハの検査方法
US11851761B2 (en) * 2021-04-16 2023-12-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool
WO2024012768A1 (en) * 2022-07-11 2024-01-18 Asml Netherlands B.V. Substrate holder, lithographic apparatus, computer program and method

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Also Published As

Publication number Publication date
EP0463853B1 (de) 1998-11-04
EP0463853A1 (de) 1992-01-02
US5191218A (en) 1993-03-02
DE69130434D1 (de) 1998-12-10

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