DE68925768D1 - Platin- oder Platinlegierung-Plattierungsbad - Google Patents
Platin- oder Platinlegierung-PlattierungsbadInfo
- Publication number
- DE68925768D1 DE68925768D1 DE68925768T DE68925768T DE68925768D1 DE 68925768 D1 DE68925768 D1 DE 68925768D1 DE 68925768 T DE68925768 T DE 68925768T DE 68925768 T DE68925768 T DE 68925768T DE 68925768 D1 DE68925768 D1 DE 68925768D1
- Authority
- DE
- Germany
- Prior art keywords
- platinum
- plating bath
- alloy plating
- bath
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Glass Compositions (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB888821005A GB8821005D0 (en) | 1988-09-07 | 1988-09-07 | Improvements in plating |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68925768D1 true DE68925768D1 (de) | 1996-04-04 |
DE68925768T2 DE68925768T2 (de) | 1996-07-25 |
Family
ID=10643207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68925768T Expired - Lifetime DE68925768T2 (de) | 1988-09-07 | 1989-08-23 | Platin- oder Platinlegierung-Plattierungsbad |
Country Status (9)
Country | Link |
---|---|
US (1) | US5102509A (de) |
EP (1) | EP0358375B1 (de) |
JP (1) | JP2859316B2 (de) |
AT (1) | ATE134726T1 (de) |
CA (1) | CA1339116C (de) |
DE (1) | DE68925768T2 (de) |
GB (1) | GB8821005D0 (de) |
IE (1) | IE75696B1 (de) |
ZA (1) | ZA896403B (de) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL98550A (en) * | 1990-06-29 | 1996-07-23 | Electroplating Eng | Baths for the investment of platinum and for the production of platinum products by electricity, methods for investing platinum and for the production of platinum products that use them and products produced by them |
GB9212831D0 (en) * | 1992-06-17 | 1992-07-29 | Johnson Matthey Plc | Improvements in plating baths |
US5639564A (en) * | 1993-02-05 | 1997-06-17 | Baldwin Hardware Corporation | Multi-layer coated article |
US5641579A (en) * | 1993-02-05 | 1997-06-24 | Baldwin Hardware Corporation | Article having a decorative and protective multilayer coating |
US5626972A (en) * | 1994-06-02 | 1997-05-06 | Baldwin Hardware Corporation | Article having a decorative and protective multilayer coating simulating brass |
US5413874A (en) * | 1994-06-02 | 1995-05-09 | Baldwin Hardware Corporation | Article having a decorative and protective multilayer coating simulating brass |
US5482788A (en) * | 1994-11-30 | 1996-01-09 | Baldwin Hardware Corporation | Article having a protective coating simulating brass |
US5478659A (en) * | 1994-11-30 | 1995-12-26 | Baldwin Hardware Corporation | Article having a decorative and protective coating simulating brass |
US5478660A (en) * | 1994-11-30 | 1995-12-26 | Baldwin Hardware Corporation | Article having a decorative and protective coating simulating brass |
US5484663A (en) * | 1994-11-30 | 1996-01-16 | Baldwin Hardware Corporation | Article having a coating simulating brass |
EP0737760B1 (de) * | 1995-04-15 | 2000-04-19 | Degussa-Hüls Aktiengesellschaft | Galvanisches Platinbad |
CA2176892C (en) * | 1995-05-22 | 2002-10-29 | Stephen R. Moysan, Iii | Article having a decorative and protective coating simulating brass |
US5552233A (en) * | 1995-05-22 | 1996-09-03 | Baldwin Hardware Corporation | Article having a decorative and protective multilayer coating simulating brass |
US5654108A (en) * | 1995-05-22 | 1997-08-05 | Baldwin Hardware Corporation | Article having a protective coating simulating brass |
US5667904A (en) * | 1995-05-22 | 1997-09-16 | Baldwin Hardware Corporation | Article having a decorative and protective coating simulating brass |
US5693427A (en) * | 1995-12-22 | 1997-12-02 | Baldwin Hardware Corporation | Article with protective coating thereon |
US5783313A (en) * | 1995-12-22 | 1998-07-21 | Baldwin Hardware Corporation | Coated Article |
US5788823A (en) * | 1996-07-23 | 1998-08-04 | Howmet Research Corporation | Platinum modified aluminide diffusion coating and method |
US6033790A (en) * | 1997-04-30 | 2000-03-07 | Masco Corporation | Article having a coating |
US5948548A (en) * | 1997-04-30 | 1999-09-07 | Masco Corporation | Coated article |
US5989730A (en) * | 1997-04-30 | 1999-11-23 | Masco Corporation | Article having a decorative and protective multi-layer coating |
US6106958A (en) * | 1997-04-30 | 2000-08-22 | Masco Corporation | Article having a coating |
US6004684A (en) * | 1997-04-30 | 1999-12-21 | Masco Corporation | Article having a protective and decorative multilayer coating |
US5985468A (en) * | 1997-04-30 | 1999-11-16 | Masco Corporation | Article having a multilayer protective and decorative coating |
US5952111A (en) * | 1997-04-30 | 1999-09-14 | Masco Corporation | Article having a coating thereon |
US5879532A (en) * | 1997-07-09 | 1999-03-09 | Masco Corporation Of Indiana | Process for applying protective and decorative coating on an article |
US6268060B1 (en) | 1997-08-01 | 2001-07-31 | Mascotech Coatings, Inc. | Chrome coating having a silicone top layer thereon |
DE19906417C1 (de) | 1999-02-16 | 2000-06-29 | Heraeus Gmbh W C | Stützstruktur |
US20020000380A1 (en) * | 1999-10-28 | 2002-01-03 | Lyndon W. Graham | Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece |
US6306277B1 (en) | 2000-01-14 | 2001-10-23 | Honeywell International Inc. | Platinum electrolyte for use in electrolytic plating |
US20040253386A1 (en) * | 2003-06-13 | 2004-12-16 | Sarojini Deevi | Preparation of intermetallics by metallo-organic decomposition |
JP4566667B2 (ja) * | 2004-01-16 | 2010-10-20 | キヤノン株式会社 | めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 |
US20050230262A1 (en) * | 2004-04-20 | 2005-10-20 | Semitool, Inc. | Electrochemical methods for the formation of protective features on metallized features |
US20060042932A1 (en) * | 2004-08-25 | 2006-03-02 | Rosenzweig Mark A | Apparatus and method for electroplating a workpiece |
US7494576B2 (en) * | 2004-08-26 | 2009-02-24 | General Electric Company | Electroplating apparatus and method for making an electroplating anode assembly |
DE102007050349B4 (de) | 2007-10-11 | 2018-06-07 | Kaco Gmbh + Co. Kg | Dichtungsanordnung für den Hochdruckbereich |
US20100055422A1 (en) * | 2008-08-28 | 2010-03-04 | Bob Kong | Electroless Deposition of Platinum on Copper |
FR2958300B1 (fr) * | 2010-03-31 | 2012-05-04 | Snecma | Dispositif pour controler des caracteristiques physiques d'un bain d'electrodeposition metallique. |
GB201100447D0 (en) * | 2011-01-12 | 2011-02-23 | Johnson Matthey Plc | Improvements in coating technology |
GB201200482D0 (en) | 2012-01-12 | 2012-02-22 | Johnson Matthey Plc | Improvements in coating technology |
FR2989694B1 (fr) * | 2012-04-19 | 2015-02-27 | Snecma | Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique |
ES2859572T3 (es) | 2013-04-26 | 2021-10-04 | Howmet Corp | Electrodeposición del componente del perfil alar interno |
CA2866479C (en) | 2013-12-20 | 2021-08-17 | Will N. Kirkendall | Internal turbine component electroplating |
CN104152953A (zh) * | 2014-08-29 | 2014-11-19 | 昆明贵金属研究所 | 磷酸槽电镀铂用的主盐及其合成方法 |
JP6336890B2 (ja) * | 2014-10-31 | 2018-06-06 | 石福金属興業株式会社 | 無電解白金めっき浴 |
GB202020071D0 (en) | 2020-12-18 | 2021-02-03 | Johnson Matthey Plc | Electroplating solutions |
IT202100003281A1 (it) | 2021-02-15 | 2022-08-15 | Bluclad S P A | Lega pt-ni elettrodepositata anallergica e relativi bagno e ciclo galvanico |
CN114182315B (zh) * | 2022-02-14 | 2022-05-17 | 深圳市顺信精细化工有限公司 | 一种耐腐蚀组合电镀层及电镀方法 |
GB202217304D0 (en) * | 2022-11-18 | 2023-01-04 | Johnson Matthey Plc | High efficiency platinum electroplating solutions |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE371542A (de) * | 1929-07-02 | |||
US1991995A (en) * | 1932-10-03 | 1935-02-19 | Int Nickel Co | Platinum metal ammino cyanide plating bath and process for electrodeposition of platinum metal therefrom |
NL123540C (de) * | 1958-08-06 | |||
GB897690A (en) * | 1959-09-30 | 1962-05-30 | Johnson Matthey Co Ltd | Improvements in and relating to the electrodeposition of platinum or palladium |
US4427502A (en) * | 1981-11-16 | 1984-01-24 | Bell Telephone Laboratories, Incorporated | Platinum and platinum alloy electroplating baths and processes |
JPS5967388A (ja) * | 1982-09-09 | 1984-04-17 | エンゲルハ−ド・コ−ポレ−シヨン | パラジウムメツキ浴 |
US4493754A (en) * | 1983-12-30 | 1985-01-15 | At&T Bell Laboratories | Electrodes for palladium electroplating process |
-
1988
- 1988-09-07 GB GB888821005A patent/GB8821005D0/en active Pending
-
1989
- 1989-03-22 ZA ZA896403A patent/ZA896403B/xx unknown
- 1989-08-23 EP EP89308558A patent/EP0358375B1/de not_active Expired - Lifetime
- 1989-08-23 AT AT89308558T patent/ATE134726T1/de not_active IP Right Cessation
- 1989-08-23 DE DE68925768T patent/DE68925768T2/de not_active Expired - Lifetime
- 1989-09-06 JP JP1229435A patent/JP2859316B2/ja not_active Expired - Lifetime
- 1989-09-06 CA CA000610461A patent/CA1339116C/en not_active Expired - Lifetime
- 1989-09-06 IE IE285789A patent/IE75696B1/en not_active IP Right Cessation
-
1990
- 1990-10-15 US US07/599,254 patent/US5102509A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0358375A1 (de) | 1990-03-14 |
JP2859316B2 (ja) | 1999-02-17 |
CA1339116C (en) | 1997-07-29 |
ATE134726T1 (de) | 1996-03-15 |
EP0358375B1 (de) | 1996-02-28 |
ZA896403B (en) | 1990-11-28 |
JPH02107794A (ja) | 1990-04-19 |
IE892857L (en) | 1990-03-07 |
GB8821005D0 (en) | 1988-10-05 |
US5102509A (en) | 1992-04-07 |
DE68925768T2 (de) | 1996-07-25 |
IE75696B1 (en) | 1997-09-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |