GB201200482D0 - Improvements in coating technology - Google Patents
Improvements in coating technologyInfo
- Publication number
- GB201200482D0 GB201200482D0 GB201200482A GB201200482A GB201200482D0 GB 201200482 D0 GB201200482 D0 GB 201200482D0 GB 201200482 A GB201200482 A GB 201200482A GB 201200482 A GB201200482 A GB 201200482A GB 201200482 D0 GB201200482 D0 GB 201200482D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- coating technology
- coating
- technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB201200482A GB201200482D0 (en) | 2012-01-12 | 2012-01-12 | Improvements in coating technology |
EP12735613.7A EP2802687A1 (en) | 2012-01-12 | 2012-07-06 | Improvements in coating technology |
SG11201403144XA SG11201403144XA (en) | 2012-01-12 | 2012-07-06 | Improvements in coating technology |
PCT/GB2012/051599 WO2013104877A1 (en) | 2012-01-12 | 2012-07-06 | Improvements in coating technology |
US14/362,982 US20150047984A1 (en) | 2012-01-12 | 2012-07-06 | Coating technology |
CN201280066761.6A CN104040032B (en) | 2012-01-12 | 2012-07-06 | Paint-on technique improves |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB201200482A GB201200482D0 (en) | 2012-01-12 | 2012-01-12 | Improvements in coating technology |
Publications (1)
Publication Number | Publication Date |
---|---|
GB201200482D0 true GB201200482D0 (en) | 2012-02-22 |
Family
ID=45788823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB201200482A Ceased GB201200482D0 (en) | 2012-01-12 | 2012-01-12 | Improvements in coating technology |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150047984A1 (en) |
EP (1) | EP2802687A1 (en) |
CN (1) | CN104040032B (en) |
GB (1) | GB201200482D0 (en) |
SG (1) | SG11201403144XA (en) |
WO (1) | WO2013104877A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114182315A (en) * | 2022-02-14 | 2022-03-15 | 深圳市顺信精细化工有限公司 | Corrosion-resistant combined electroplated layer and electroplating method |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106435666B (en) * | 2016-11-22 | 2018-12-18 | 中国科学院金属研究所 | A method of high-temperature alloy surface deposition layer is prepared using neutral platinum plating solution |
GB202020071D0 (en) | 2020-12-18 | 2021-02-03 | Johnson Matthey Plc | Electroplating solutions |
DE102020007789A1 (en) | 2020-12-18 | 2022-06-23 | Umicore Galvanotechnik Gmbh | Stabilization of the deposition rate of platinum electrolytes |
DE102021107826A1 (en) | 2021-03-29 | 2022-09-29 | Umicore Galvanotechnik Gmbh | platinum electrolyte |
CN113430608A (en) * | 2021-07-21 | 2021-09-24 | 深圳市永达锐国际科技有限公司 | Novel process for electroforming jewelry by using platinum |
GB202217304D0 (en) * | 2022-11-18 | 2023-01-04 | Johnson Matthey Plc | High efficiency platinum electroplating solutions |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1356353A (en) * | 1963-02-12 | 1964-03-27 | Louyot Comptoir Lyon Alemand | Process for the electrolytic deposition of a layer of platinum and electrolyte for carrying out the process |
US3865697A (en) * | 1973-05-25 | 1975-02-11 | Robert Suggs | Platinum plating process |
JPS54142136A (en) * | 1978-04-28 | 1979-11-06 | Tanaka Precious Metal Ind | Platinum plating solution |
SE8106867L (en) * | 1980-12-11 | 1982-06-12 | Hooker Chemicals Plastics Corp | ELECTROLYTIC PROPOSAL OF PALLADIUM AND PALLADIUM ALLOYS |
US4427502A (en) * | 1981-11-16 | 1984-01-24 | Bell Telephone Laboratories, Incorporated | Platinum and platinum alloy electroplating baths and processes |
GB8821005D0 (en) | 1988-09-07 | 1988-10-05 | Johnson Matthey Plc | Improvements in plating |
JP2899333B2 (en) * | 1989-12-05 | 1999-06-02 | 田中貴金属工業株式会社 | Platinum alloy plating bath and platinum alloy plating method |
AU648316B2 (en) * | 1990-06-29 | 1994-04-21 | Electroplating Engineers Of Japan, Limited | Platinum electoforming and platinum electroplating |
DE69220519T2 (en) * | 1991-03-04 | 1998-02-19 | Toda Kogyo Corp | Process for plating a bonded magnet and bonded magnet with a metal coating |
EP0737760B1 (en) * | 1995-04-15 | 2000-04-19 | Degussa-Hüls Aktiengesellschaft | Platinum electroplating bath |
JP3201737B2 (en) * | 1997-06-04 | 2001-08-27 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Platinum plating bath and plating method |
DE19906417C1 (en) * | 1999-02-16 | 2000-06-29 | Heraeus Gmbh W C | Passage opening support structure, especially a medical stent, has a gold layer between a special steel substrate and a platinum surface layer to avoid platinum cracking |
DE19928047A1 (en) * | 1999-06-19 | 2000-12-21 | Gerhard Hoffacker | Use of pollutant-deficient to pollutant-rich aqueous systems for the galvanic deposition of precious metals and precious metal alloys |
CN1249270C (en) * | 1999-10-27 | 2006-04-05 | 小岛化学药品株式会社 | Palladium plating solution |
US6306277B1 (en) * | 2000-01-14 | 2001-10-23 | Honeywell International Inc. | Platinum electrolyte for use in electrolytic plating |
US7628903B1 (en) * | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
JP2002038293A (en) * | 2000-07-25 | 2002-02-06 | Tanaka Kikinzoku Kogyo Kk | Platinum plating solution and plating method therewith |
JP4392640B2 (en) * | 2000-10-11 | 2010-01-06 | 石原薬品株式会社 | Non-cyanide gold-tin alloy plating bath |
KR100363011B1 (en) * | 2002-03-28 | 2002-11-30 | Hanwha Chemical Corp | Electrolyte composition for electrolysis of brine and electrolysis method of brine using the same |
JP4190973B2 (en) * | 2003-07-28 | 2008-12-03 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Method for producing cobalt-platinum alloy magnetic film by electrodeposition |
US7604726B2 (en) * | 2004-01-07 | 2009-10-20 | Honeywell International Inc. | Platinum aluminide coating and method thereof |
TW200613586A (en) * | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
US20060042932A1 (en) * | 2004-08-25 | 2006-03-02 | Rosenzweig Mark A | Apparatus and method for electroplating a workpiece |
JP2006118023A (en) * | 2004-10-25 | 2006-05-11 | Tosoh Corp | Method for manufacturing electrode for generating hydrogen |
JP2007327127A (en) * | 2006-06-09 | 2007-12-20 | Daiwa Fine Chemicals Co Ltd (Laboratory) | Silver plating method |
TWI398402B (en) * | 2008-11-28 | 2013-06-11 | Nat Univ Tsing Hua | Electroplating solution for manufacturing nanometer platinum and platinum based alloy particles and method thereof |
DE102009033930B8 (en) * | 2009-07-20 | 2013-10-31 | György Bernitz | A method of applying a resistive layer in the form of a noble metal thin film to a substrate and a method of making a temperature sensor |
CN101791886B (en) * | 2010-02-25 | 2012-11-21 | 北京航空航天大学 | Ni-Pt-Ru-Al composite coating and method for preparing same |
JP5522788B2 (en) * | 2010-06-07 | 2014-06-18 | 武海 秋元 | Plating solution for preventing sulfur discoloration on silver surface |
-
2012
- 2012-01-12 GB GB201200482A patent/GB201200482D0/en not_active Ceased
- 2012-07-06 EP EP12735613.7A patent/EP2802687A1/en not_active Withdrawn
- 2012-07-06 CN CN201280066761.6A patent/CN104040032B/en active Active
- 2012-07-06 WO PCT/GB2012/051599 patent/WO2013104877A1/en active Application Filing
- 2012-07-06 SG SG11201403144XA patent/SG11201403144XA/en unknown
- 2012-07-06 US US14/362,982 patent/US20150047984A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114182315A (en) * | 2022-02-14 | 2022-03-15 | 深圳市顺信精细化工有限公司 | Corrosion-resistant combined electroplated layer and electroplating method |
CN114182315B (en) * | 2022-02-14 | 2022-05-17 | 深圳市顺信精细化工有限公司 | Corrosion-resistant combined electroplated layer and electroplating method |
Also Published As
Publication number | Publication date |
---|---|
US20150047984A1 (en) | 2015-02-19 |
CN104040032A (en) | 2014-09-10 |
SG11201403144XA (en) | 2014-09-26 |
CN104040032B (en) | 2017-12-22 |
WO2013104877A1 (en) | 2013-07-18 |
EP2802687A1 (en) | 2014-11-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |