JP4566667B2 - めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 - Google Patents
めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 Download PDFInfo
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- JP4566667B2 JP4566667B2 JP2004271466A JP2004271466A JP4566667B2 JP 4566667 B2 JP4566667 B2 JP 4566667B2 JP 2004271466 A JP2004271466 A JP 2004271466A JP 2004271466 A JP2004271466 A JP 2004271466A JP 4566667 B2 JP4566667 B2 JP 4566667B2
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- Prior art keywords
- plating solution
- plating
- fept
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- ions
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/001—Magnets
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/858—Producing a magnetic layer by electro-plating or electroless plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
- H01F10/123—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys having a L10 crystallographic structure, e.g. [Co,Fe][Pt,Pd] thin films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
- H01F41/26—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents, e.g. electroplating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
- H01F10/14—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing iron or nickel
- H01F10/147—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing iron or nickel with lattice under strain, e.g. expanded by interstitial nitrogen
Description
図1は本発明の磁性体を細孔に充填した磁気記録媒体の構成を示す模式図である。
本実施例においては、FePtめっき液の作成に関する。
本実施例においては、安定なFePtめっき液を用いたFePt磁性体に関する。
本実施例では、本発明の磁性体を用いた磁気記録媒体に関する。
本実施例では、Fe50Pt50の組成を有するFePt磁性体を水素1気圧存在下350℃にて熱処理することにより、規則合金であるL10構造を形成し、4000 Oe以上の保持力を得ることができた。
11 下地電極層
12 記録層
13 保護層
14 潤滑層
15 磁性体
20 微細なホール
21 構造体の母材
22 ホールの直径
23 ホール間の間隔
Claims (4)
- Feイオンと、ヘキサクロロ白金(IV)酸塩由来のPtイオンと、錯化剤と、塩化物イオンとを含み、前記Feイオン濃度と前記Ptイオン濃度のモル比(Fe/Pt)が0.75≦Fe/Pt≦3であるめっき液であり、
ヘキサクロロ白金(IV)酸塩水溶液と、該ヘキサクロロ白金(IV)酸塩水溶液と等モル濃度以上の塩化物水溶液とを用いて作製されることを特徴とするめっき液。 - 前記錯化剤が、酒石酸又はクエン酸のいずれかである請求項1記載のめっき液。
- 前記Feイオン濃度が、0.005mol/L以上で0.1mol/L以下である請求項1又は2のいずれか記載のめっき液。
- 前記めっき液のpHが、5.0以上10.5以下である請求項1から3のいずれか記載のめっき液。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004271466A JP4566667B2 (ja) | 2004-01-16 | 2004-09-17 | めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 |
PCT/JP2005/000732 WO2005068688A2 (en) | 2004-01-16 | 2005-01-14 | Plating solution, process for producing a structure with the plating solution, and apparatus employing the plating solution |
US10/566,949 US7641783B2 (en) | 2004-01-16 | 2005-01-14 | Plating solution, process for producing a structure with the plating solution, and apparatus employing the plating solution |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004009238 | 2004-01-16 | ||
JP2004271466A JP4566667B2 (ja) | 2004-01-16 | 2004-09-17 | めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005226156A JP2005226156A (ja) | 2005-08-25 |
JP2005226156A5 JP2005226156A5 (ja) | 2007-11-01 |
JP4566667B2 true JP4566667B2 (ja) | 2010-10-20 |
Family
ID=34797752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004271466A Expired - Fee Related JP4566667B2 (ja) | 2004-01-16 | 2004-09-17 | めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7641783B2 (ja) |
JP (1) | JP4566667B2 (ja) |
WO (1) | WO2005068688A2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7327540B2 (en) * | 2004-06-01 | 2008-02-05 | Headway Technologies, Inc. | Hard biased materials for recording head applications |
JP2007154285A (ja) * | 2005-12-07 | 2007-06-21 | Electroplating Eng Of Japan Co | コバルト−白金合金磁性膜の製造方法 |
JP4673735B2 (ja) * | 2005-12-09 | 2011-04-20 | 日立マクセル株式会社 | 磁気記録媒体及びその製造方法 |
CH714243B1 (fr) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Procédé d'électroformage et pièce ou couche obtenue par ce procédé. |
CH710184B1 (fr) * | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
KR100947645B1 (ko) * | 2008-02-28 | 2010-03-12 | 창원대학교 산학협력단 | FePt 자성박막의 제조방법 |
US9011706B2 (en) * | 2008-12-16 | 2015-04-21 | City University Of Hong Kong | Method of making foraminous microstructures |
JP5334118B2 (ja) * | 2009-09-16 | 2013-11-06 | 国立大学法人信州大学 | Fe‐Pt合金めっき方法およびFe‐Pt合金めっき液 |
EP2312021B1 (fr) * | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52108341A (en) * | 1976-03-09 | 1977-09-10 | Kosaku Kk | Noble metal plating bath |
JPH02107794A (ja) * | 1988-09-07 | 1990-04-19 | Johnson Matthey Plc | 白金または白金合金の電気めっき浴および電気めっき方法 |
JPH0885896A (ja) * | 1994-09-17 | 1996-04-02 | Tanaka Kikinzoku Kogyo Kk | 白金−タングステン合金めっき浴 |
JP2002216330A (ja) * | 2001-01-19 | 2002-08-02 | Toshiba Corp | 磁気記録媒体 |
JP2003085738A (ja) * | 2001-09-14 | 2003-03-20 | Toshiba Corp | 磁気記録媒体および磁気記録装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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NL243931A (ja) * | 1958-10-01 | |||
BR8805772A (pt) * | 1988-11-01 | 1990-06-12 | Metal Leve Sa | Processo de formacao de camada de deslizamento de mancal |
US5435898A (en) * | 1994-10-25 | 1995-07-25 | Enthone-Omi Inc. | Alkaline zinc and zinc alloy electroplating baths and processes |
JPH10212592A (ja) * | 1997-01-28 | 1998-08-11 | Tanaka Kikinzoku Kogyo Kk | 白金合金メッキ浴 |
JP3886082B2 (ja) | 1997-11-12 | 2007-02-28 | キヤノン株式会社 | ナノ構造体及びその製造方法 |
JP2002180259A (ja) | 2000-12-12 | 2002-06-26 | Shipley Co Llc | めっき液における金属析出促進化合物および該化合物を含むめっき液 |
US6875253B2 (en) * | 2001-02-08 | 2005-04-05 | Hitachi Maxell, Ltd. | Metal alloy fine particles and method for producing thereof |
WO2003078687A1 (fr) * | 2002-03-15 | 2003-09-25 | Canon Kabushiki Kaisha | Materiau poreux et son procede de production |
JP4035459B2 (ja) | 2002-03-15 | 2008-01-23 | キヤノン株式会社 | 酸化物多孔質体の製造方法 |
WO2003078685A1 (fr) * | 2002-03-15 | 2003-09-25 | Canon Kabushiki Kaisha | Dispositif fonctionnel et procede de fabrication du dispositif, support d'enregistrement magnetique vertical, dispositif d'enregistrement et de lecture magnetique, et dispositif de traitement d'information |
WO2003078688A1 (en) * | 2002-03-15 | 2003-09-25 | Canon Kabushiki Kaisha | Porous material and process for producing the same |
JP2004323948A (ja) * | 2003-04-28 | 2004-11-18 | Electroplating Eng Of Japan Co | 磁性膜形成用電析めっき浴及びそれを用いた電析めっき方法 |
JP4865240B2 (ja) * | 2004-03-23 | 2012-02-01 | キヤノン株式会社 | 構造体の製造方法、磁気記録媒体の製造方法、成型体の製造方法 |
-
2004
- 2004-09-17 JP JP2004271466A patent/JP4566667B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-14 WO PCT/JP2005/000732 patent/WO2005068688A2/en active Application Filing
- 2005-01-14 US US10/566,949 patent/US7641783B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52108341A (en) * | 1976-03-09 | 1977-09-10 | Kosaku Kk | Noble metal plating bath |
JPH02107794A (ja) * | 1988-09-07 | 1990-04-19 | Johnson Matthey Plc | 白金または白金合金の電気めっき浴および電気めっき方法 |
JPH0885896A (ja) * | 1994-09-17 | 1996-04-02 | Tanaka Kikinzoku Kogyo Kk | 白金−タングステン合金めっき浴 |
JP2002216330A (ja) * | 2001-01-19 | 2002-08-02 | Toshiba Corp | 磁気記録媒体 |
JP2003085738A (ja) * | 2001-09-14 | 2003-03-20 | Toshiba Corp | 磁気記録媒体および磁気記録装置 |
Also Published As
Publication number | Publication date |
---|---|
US20060254924A1 (en) | 2006-11-16 |
JP2005226156A (ja) | 2005-08-25 |
WO2005068688A3 (en) | 2006-03-02 |
WO2005068688A2 (en) | 2005-07-28 |
US7641783B2 (en) | 2010-01-05 |
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