DE68925396D1 - Automatische Hochgeschwindigkeits-Laminier-Vorrichtung - Google Patents

Automatische Hochgeschwindigkeits-Laminier-Vorrichtung

Info

Publication number
DE68925396D1
DE68925396D1 DE68925396T DE68925396T DE68925396D1 DE 68925396 D1 DE68925396 D1 DE 68925396D1 DE 68925396 T DE68925396 T DE 68925396T DE 68925396 T DE68925396 T DE 68925396T DE 68925396 D1 DE68925396 D1 DE 68925396D1
Authority
DE
Germany
Prior art keywords
tacking
lamination
rolls
high speed
control unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68925396T
Other languages
English (en)
Other versions
DE68925396T2 (de
Inventor
Amedeo Candore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Chemicals LLC
Original Assignee
Morton International LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morton International LLC filed Critical Morton International LLC
Publication of DE68925396D1 publication Critical patent/DE68925396D1/de
Application granted granted Critical
Publication of DE68925396T2 publication Critical patent/DE68925396T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • B32B38/185—Positioning, e.g. registration or centering during laying up combined with the cutting of one or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y10T156/1339—Delivering cut part in sequence to serially conveyed articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1343—Cutting indefinite length web after assembly with discrete article

Landscapes

  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Inorganic Insulating Materials (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
DE68925396T 1988-08-26 1989-08-23 Automatische Hochgeschwindigkeits-Laminier-Vorrichtung Expired - Fee Related DE68925396T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8848305A IT1224722B (it) 1988-08-26 1988-08-26 Laminatore automatico ad elevata velocita' di laminazione per laproduzione di pannelli per circuiti stampati

Publications (2)

Publication Number Publication Date
DE68925396D1 true DE68925396D1 (de) 1996-02-22
DE68925396T2 DE68925396T2 (de) 1996-05-15

Family

ID=11265781

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68925396T Expired - Fee Related DE68925396T2 (de) 1988-08-26 1989-08-23 Automatische Hochgeschwindigkeits-Laminier-Vorrichtung

Country Status (11)

Country Link
US (3) US4961808A (de)
EP (1) EP0356221B1 (de)
JP (2) JPH02196657A (de)
KR (1) KR940000625B1 (de)
AT (1) ATE132801T1 (de)
AU (1) AU3821589A (de)
CA (2) CA1299476C (de)
DE (1) DE68925396T2 (de)
DK (1) DK421289A (de)
IT (1) IT1224722B (de)
NO (1) NO893030L (de)

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US4946524A (en) * 1989-03-02 1990-08-07 Morton International, Inc. Applicator and method for applying dry film solder mask on a board
JPH088432B2 (ja) * 1990-06-01 1996-01-29 ソマール株式会社 基板搬送装置
DE4134418C2 (de) * 1990-10-17 2002-02-07 Somar Corp Vorrichtung zum Transportieren von plattenförmigen Gegenständen
ES2070659B1 (es) * 1991-04-10 1997-02-16 Comecal S A Maquina de plastificar con polipropileno por laminacion termica.
US5653846A (en) * 1991-11-11 1997-08-05 Canon Aptex Inc. Laminating apparatus
JPH05154918A (ja) * 1991-12-03 1993-06-22 Hakutou Kk 基板にフィルムをラミネートする方法およびラミネータ
US5443667A (en) * 1992-03-11 1995-08-22 Bridgestone/Firestone, Inc. Device and method for splicing tire tread strip edges using traversing ultrasonic transducers
DE4216691A1 (de) * 1992-05-20 1993-11-25 Dieffenbacher Gmbh Maschf Vorrichtung zum Belegen von Platten
FR2703299B1 (fr) * 1993-04-02 1995-05-24 Idmatics Sa Dispositif de prescellage d'un document sur une bande plastique.
US5456789A (en) * 1994-04-07 1995-10-10 Crathern Engineering Co., Inc. Apparatus for and method of wrapping boards
DE60218836T2 (de) * 2001-05-16 2007-12-06 Xyron, Inc., Scottsdale Laminiervorrichtung mit einer verbesserten schneideinrichtung
EP1414434A4 (de) * 2001-08-07 2006-04-19 Univ Pennsylvania Verbindungen, welche die chemischen und biologischen eigenschaften von discodermolid nachahmen
KR200287509Y1 (ko) 2002-05-21 2002-09-05 로얄소브린 주식회사 라미네이터 정.역회전 제어장치
US20040069401A1 (en) * 2002-07-11 2004-04-15 Wurdell Grant H. Wasteless laminator
US7361249B2 (en) * 2002-12-05 2008-04-22 Multimedia Games, Inc. Apparatus for applying a removable cover to a ticket substrate
EP1737957A1 (de) * 2004-04-22 2007-01-03 Yissum Research Development Company Of The Hebrew University Of Jerusalem UNIVERSELLE ZIELSEQUENZEN FÜR siRNA-GEN-SILENCING
TWI318600B (en) * 2007-10-26 2009-12-21 Primax Electronics Ltd Laminator with jam-detecting mechanism
JP4209458B1 (ja) * 2008-04-01 2009-01-14 日清紡績株式会社 ラミネート装置
KR101511584B1 (ko) * 2008-09-25 2015-04-13 해성디에스 주식회사 롤 투 롤 반도체부품 제조장치 및 그에 적용되는 이송방법
TWI515120B (zh) 2010-09-22 2016-01-01 巴柏斯特合資公司 包含平板壓機的打印機
KR101138737B1 (ko) * 2011-11-01 2012-04-25 현대다이모스(주) 연질 슬라브재와 피복의 부착장치
CN110341286A (zh) * 2019-08-09 2019-10-18 天津比朗德机械制造有限公司 一种布卷自动接驳装置
CN114567977B (zh) * 2022-03-31 2023-06-06 重庆市和鑫达电子有限公司 Pcb板压合装置
CN115253904B (zh) * 2022-07-29 2023-03-21 浙江铁狮高温材料有限公司 一种致密氧化锆水口芯生产设备

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US2032407A (en) * 1933-10-02 1936-03-03 Welding Service Inc Temperature measuring apparatus
US3191437A (en) * 1962-11-26 1965-06-29 Western Electric Co Device for measuring the temperature of a continuously advancing strand
US3464864A (en) * 1968-06-04 1969-09-02 Us Army Button for holding thermocouples to the skin surface of subjects
US3658629A (en) * 1970-02-27 1972-04-25 Ibm Photopolymer resist sheet laminator
US3934477A (en) * 1973-08-15 1976-01-27 Xerox Corporation Temperature sensing device
JPS5258578A (en) * 1975-11-08 1977-05-14 Konishiroku Photo Ind Co Ltd Temperature measuring device in roller fixing device
JPS5643817Y2 (de) * 1977-12-30 1981-10-14
JPS5551709U (de) * 1978-09-30 1980-04-05
US4343961A (en) * 1980-03-31 1982-08-10 Ppg Industries, Inc. Temperature sensing device having a rotating reference member
US4441827A (en) * 1980-10-14 1984-04-10 Andre Coderre Travelling surface temperature probe
US4396791A (en) * 1981-06-01 1983-08-02 Mobay Chemical Corporation Laminator thermocouple
EP0222446A3 (de) * 1982-02-10 1989-04-12 MORTON THIOKOL S.p.A. Verfahren um einen Teil eines photoempfindlichen Films auf wenigstens eine Seite einer flachen Platte aufzutragen, die eine grössere Oberfläche besitzt als der besagte Teil
US4491492A (en) * 1982-10-28 1985-01-01 At&T Technologies, Inc. Methods of and apparatus for applying a sheet to a rigid board
NL8303102A (nl) * 1983-09-07 1985-04-01 Het Noorden Ingbureau Lamineerinrichting.
US4667809A (en) * 1983-10-19 1987-05-26 Trimmer Machine Co., Inc. Apparatus for aligning signatures
CA1226454A (en) * 1985-04-23 1987-09-08 Frank Kitzinger Metal surface temperature monitor
WO1986007302A1 (en) * 1985-06-07 1986-12-18 Somar Corporation Method and device for boring films for film pasting apparatuses
JPS6299045A (ja) * 1985-10-22 1987-05-08 Somar Corp 基板送り装置
JPS62259833A (ja) * 1986-05-07 1987-11-12 Somar Corp 薄膜張付装置
US4728175A (en) * 1986-10-09 1988-03-01 Ovonic Imaging Systems, Inc. Liquid crystal display having pixels with auxiliary capacitance
JPS63200991A (ja) * 1987-02-12 1988-08-19 ソマ−ル株式会社 薄膜張付装置
DE3734018A1 (de) * 1987-10-08 1989-04-27 Kuesters Eduard Maschf Vorrichtung zur messung der temperatur der oberflaeche einer umlaufenden walze
US4855607A (en) * 1987-12-30 1989-08-08 Pitney Bowes, Inc. Apparatus for aligning a moving substrate and a read or write head
CH674508A5 (de) * 1988-01-20 1990-06-15 Bobst Sa
US4895224A (en) * 1988-03-14 1990-01-23 Masanobu Sugihara Brake device for bicycles
US4907894A (en) * 1988-12-20 1990-03-13 Bnf Metals Technology Centre Surface-temperature sensing method and apparatus

Also Published As

Publication number Publication date
NO893030D0 (no) 1989-07-25
KR900003404A (ko) 1990-03-26
CA1320550C (en) 1993-07-20
DK421289A (da) 1990-02-27
IT8848305A0 (it) 1988-08-26
DK421289D0 (da) 1989-08-25
NO893030L (no) 1990-02-27
JPH02196657A (ja) 1990-08-03
ATE132801T1 (de) 1996-01-15
JP2531272Y2 (ja) 1997-04-02
EP0356221A2 (de) 1990-02-28
AU3821589A (en) 1990-03-01
JPH0743646U (ja) 1995-09-05
IT1224722B (it) 1990-10-18
KR940000625B1 (en) 1994-01-26
EP0356221A3 (de) 1991-11-06
US4961808A (en) 1990-10-09
CA1299476C (en) 1992-04-28
US5026172A (en) 1991-06-25
DE68925396T2 (de) 1996-05-15
US5010999A (en) 1991-04-30
EP0356221B1 (de) 1996-01-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ROHM AND HAAS CHEMICALS LLC, PHILADELPHIA, PA., US

8339 Ceased/non-payment of the annual fee