DE68920783D1 - Verfahren zur Erzeugung einer Dickschicht. - Google Patents
Verfahren zur Erzeugung einer Dickschicht.Info
- Publication number
- DE68920783D1 DE68920783D1 DE68920783T DE68920783T DE68920783D1 DE 68920783 D1 DE68920783 D1 DE 68920783D1 DE 68920783 T DE68920783 T DE 68920783T DE 68920783 T DE68920783 T DE 68920783T DE 68920783 D1 DE68920783 D1 DE 68920783D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- thick layer
- thick
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63153739A JPH01319990A (ja) | 1988-06-22 | 1988-06-22 | 厚膜形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68920783D1 true DE68920783D1 (de) | 1995-03-09 |
DE68920783T2 DE68920783T2 (de) | 1995-09-21 |
Family
ID=15569045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68920783T Expired - Fee Related DE68920783T2 (de) | 1988-06-22 | 1989-06-20 | Verfahren zur Erzeugung einer Dickschicht. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5116642A (de) |
EP (1) | EP0347824B1 (de) |
JP (1) | JPH01319990A (de) |
KR (1) | KR920004038B1 (de) |
CA (1) | CA1335772C (de) |
DE (1) | DE68920783T2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01319990A (ja) * | 1988-06-22 | 1989-12-26 | Sumitomo Electric Ind Ltd | 厚膜形成方法 |
JPH03283594A (ja) * | 1990-03-30 | 1991-12-13 | Toshiba Lighting & Technol Corp | 回路基板 |
US5521576A (en) * | 1993-10-06 | 1996-05-28 | Collins; Franklyn M. | Fine-line thick film resistors and resistor networks and method of making same |
US5819652A (en) * | 1994-12-14 | 1998-10-13 | International Business Machines Corporation | Reduced cavity depth screening stencil |
US5588359A (en) * | 1995-06-09 | 1996-12-31 | Micron Display Technology, Inc. | Method for forming a screen for screen printing a pattern of small closely spaced features onto a substrate |
DE10042312A1 (de) * | 2000-08-29 | 2002-03-14 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein |
US20040238202A1 (en) * | 2003-06-02 | 2004-12-02 | Ohmcraft Inc. | Method of making an inductor with written wire and an inductor made therefrom |
DE102007063282A1 (de) * | 2007-12-27 | 2009-07-02 | Robert Bosch Gmbh | Verfahren zur Herstellung eines elektrischen Leiters durch Auftragen zumindest einer Paste, insbesondere Dickschichtpaste |
US9623951B2 (en) | 2013-08-21 | 2017-04-18 | Goodrich Corporation | Heating elements for aircraft heated floor panels |
BR102014025627A2 (pt) * | 2013-10-15 | 2015-11-10 | Goodrich Corp | método para dar forma a um elemento aquecedor, e, painel de piso aquecido de aeronave |
CN107660066B (zh) * | 2017-10-31 | 2024-05-14 | 北京京东方显示技术有限公司 | 一种柔性电路板、其制作方法及显示装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3798059A (en) * | 1970-04-20 | 1974-03-19 | Rca Corp | Thick film inductor with ferromagnetic core |
US4324815A (en) * | 1978-01-24 | 1982-04-13 | Mitani Electronics Industry Corp. | Screen-printing mask and method |
US4457861A (en) * | 1979-12-13 | 1984-07-03 | Additive Technology Corporation | Method, materials and apparatus for manufacturing printed circuits |
US4486738A (en) * | 1982-02-16 | 1984-12-04 | General Electric Ceramics, Inc. | High reliability electrical components |
DE3373380D1 (en) * | 1982-12-16 | 1987-10-08 | Matsushita Electric Ind Co Ltd | Method of forming thick film circuit patterns with a sufficiently wide and uniformly thick strip |
US4529477A (en) * | 1983-05-02 | 1985-07-16 | Kollmorgen Technologies Corporation | Process for the manufacture of printed circuit boards |
JPS59215763A (ja) * | 1983-05-23 | 1984-12-05 | Matsushita Electric Ind Co Ltd | 厚膜印刷装置 |
JPS6043894A (ja) * | 1983-08-19 | 1985-03-08 | 松下電器産業株式会社 | 厚膜回路の形成方法 |
JPS60219793A (ja) * | 1984-04-17 | 1985-11-02 | 松下電器産業株式会社 | 厚膜回路描画方法 |
CA1260157A (en) * | 1985-07-26 | 1989-09-26 | Preleg, Inc. | Electrical circuit fabrication apparatus and method |
DE3532834A1 (de) * | 1985-09-12 | 1987-03-19 | Schering Ag | Verfahren zur integration von widerstaenden in chemisch abgeschiedene leiternetzwerke |
US4622239A (en) * | 1986-02-18 | 1986-11-11 | At&T Technologies, Inc. | Method and apparatus for dispensing viscous materials |
US4720402A (en) * | 1987-01-30 | 1988-01-19 | American Telephone And Telegraph Company | Method for dispensing viscous material |
US4808435A (en) * | 1987-04-06 | 1989-02-28 | International Business Machines Corporation | Screen printing method for producing lines of uniform width and height |
JPH01319990A (ja) * | 1988-06-22 | 1989-12-26 | Sumitomo Electric Ind Ltd | 厚膜形成方法 |
-
1988
- 1988-06-22 JP JP63153739A patent/JPH01319990A/ja active Pending
-
1989
- 1989-06-20 DE DE68920783T patent/DE68920783T2/de not_active Expired - Fee Related
- 1989-06-20 EP EP89111161A patent/EP0347824B1/de not_active Expired - Lifetime
- 1989-06-21 CA CA000603530A patent/CA1335772C/en not_active Expired - Fee Related
- 1989-06-21 KR KR1019890008561A patent/KR920004038B1/ko not_active IP Right Cessation
-
1990
- 1990-12-20 US US07/683,033 patent/US5116642A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH01319990A (ja) | 1989-12-26 |
EP0347824A3 (de) | 1991-03-20 |
KR910002030A (ko) | 1991-01-31 |
EP0347824B1 (de) | 1995-01-25 |
CA1335772C (en) | 1995-06-06 |
US5116642A (en) | 1992-05-26 |
KR920004038B1 (ko) | 1992-05-22 |
EP0347824A2 (de) | 1989-12-27 |
DE68920783T2 (de) | 1995-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |