KR910002030A - 후막형성방법 - Google Patents
후막형성방법 Download PDFInfo
- Publication number
- KR910002030A KR910002030A KR1019890008561A KR890008561A KR910002030A KR 910002030 A KR910002030 A KR 910002030A KR 1019890008561 A KR1019890008561 A KR 1019890008561A KR 890008561 A KR890008561 A KR 890008561A KR 910002030 A KR910002030 A KR 910002030A
- Authority
- KR
- South Korea
- Prior art keywords
- thick film
- film formation
- formation method
- substrate
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 본 발명의 후막(厚膜) 형성과정을 도시한 공정도,
제 2도는 직접묘화법에서 사용되는 노즐선단부의 사시도,
Claims (1)
- 기판상에 스크리인 인쇄법을 사용해서 소망패턴의 후막을 형성하는 제1의 공정과, 상기 제1의 공정에서 후막이 형성된 기판상에 직접묘화법을 사용해서 소망패턴의 후막을 형성하는 제2의 공정으로 이루어진 후막형성방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP88-153739 | 1988-06-22 | ||
JP63153739A JPH01319990A (ja) | 1988-06-22 | 1988-06-22 | 厚膜形成方法 |
JP263-153739 | 1988-06-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910002030A true KR910002030A (ko) | 1991-01-31 |
KR920004038B1 KR920004038B1 (ko) | 1992-05-22 |
Family
ID=15569045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890008561A KR920004038B1 (ko) | 1988-06-22 | 1989-06-21 | 후막형성방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5116642A (ko) |
EP (1) | EP0347824B1 (ko) |
JP (1) | JPH01319990A (ko) |
KR (1) | KR920004038B1 (ko) |
CA (1) | CA1335772C (ko) |
DE (1) | DE68920783T2 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01319990A (ja) * | 1988-06-22 | 1989-12-26 | Sumitomo Electric Ind Ltd | 厚膜形成方法 |
JPH03283594A (ja) * | 1990-03-30 | 1991-12-13 | Toshiba Lighting & Technol Corp | 回路基板 |
US5521576A (en) * | 1993-10-06 | 1996-05-28 | Collins; Franklyn M. | Fine-line thick film resistors and resistor networks and method of making same |
US5819652A (en) * | 1994-12-14 | 1998-10-13 | International Business Machines Corporation | Reduced cavity depth screening stencil |
US5588359A (en) * | 1995-06-09 | 1996-12-31 | Micron Display Technology, Inc. | Method for forming a screen for screen printing a pattern of small closely spaced features onto a substrate |
DE10042312A1 (de) * | 2000-08-29 | 2002-03-14 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein |
US20040238202A1 (en) * | 2003-06-02 | 2004-12-02 | Ohmcraft Inc. | Method of making an inductor with written wire and an inductor made therefrom |
DE102007063282A1 (de) * | 2007-12-27 | 2009-07-02 | Robert Bosch Gmbh | Verfahren zur Herstellung eines elektrischen Leiters durch Auftragen zumindest einer Paste, insbesondere Dickschichtpaste |
US9623951B2 (en) | 2013-08-21 | 2017-04-18 | Goodrich Corporation | Heating elements for aircraft heated floor panels |
BR102014025627A2 (pt) * | 2013-10-15 | 2015-11-10 | Goodrich Corp | método para dar forma a um elemento aquecedor, e, painel de piso aquecido de aeronave |
CN107660066B (zh) * | 2017-10-31 | 2024-05-14 | 北京京东方显示技术有限公司 | 一种柔性电路板、其制作方法及显示装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3798059A (en) * | 1970-04-20 | 1974-03-19 | Rca Corp | Thick film inductor with ferromagnetic core |
US4324815A (en) * | 1978-01-24 | 1982-04-13 | Mitani Electronics Industry Corp. | Screen-printing mask and method |
US4457861A (en) * | 1979-12-13 | 1984-07-03 | Additive Technology Corporation | Method, materials and apparatus for manufacturing printed circuits |
US4486738A (en) * | 1982-02-16 | 1984-12-04 | General Electric Ceramics, Inc. | High reliability electrical components |
DE3373380D1 (en) * | 1982-12-16 | 1987-10-08 | Matsushita Electric Ind Co Ltd | Method of forming thick film circuit patterns with a sufficiently wide and uniformly thick strip |
US4529477A (en) * | 1983-05-02 | 1985-07-16 | Kollmorgen Technologies Corporation | Process for the manufacture of printed circuit boards |
JPS59215763A (ja) * | 1983-05-23 | 1984-12-05 | Matsushita Electric Ind Co Ltd | 厚膜印刷装置 |
JPS6043894A (ja) * | 1983-08-19 | 1985-03-08 | 松下電器産業株式会社 | 厚膜回路の形成方法 |
JPS60219793A (ja) * | 1984-04-17 | 1985-11-02 | 松下電器産業株式会社 | 厚膜回路描画方法 |
CA1260157A (en) * | 1985-07-26 | 1989-09-26 | Preleg, Inc. | Electrical circuit fabrication apparatus and method |
DE3532834A1 (de) * | 1985-09-12 | 1987-03-19 | Schering Ag | Verfahren zur integration von widerstaenden in chemisch abgeschiedene leiternetzwerke |
US4622239A (en) * | 1986-02-18 | 1986-11-11 | At&T Technologies, Inc. | Method and apparatus for dispensing viscous materials |
US4720402A (en) * | 1987-01-30 | 1988-01-19 | American Telephone And Telegraph Company | Method for dispensing viscous material |
US4808435A (en) * | 1987-04-06 | 1989-02-28 | International Business Machines Corporation | Screen printing method for producing lines of uniform width and height |
JPH01319990A (ja) * | 1988-06-22 | 1989-12-26 | Sumitomo Electric Ind Ltd | 厚膜形成方法 |
-
1988
- 1988-06-22 JP JP63153739A patent/JPH01319990A/ja active Pending
-
1989
- 1989-06-20 DE DE68920783T patent/DE68920783T2/de not_active Expired - Fee Related
- 1989-06-20 EP EP89111161A patent/EP0347824B1/en not_active Expired - Lifetime
- 1989-06-21 CA CA000603530A patent/CA1335772C/en not_active Expired - Fee Related
- 1989-06-21 KR KR1019890008561A patent/KR920004038B1/ko not_active IP Right Cessation
-
1990
- 1990-12-20 US US07/683,033 patent/US5116642A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH01319990A (ja) | 1989-12-26 |
EP0347824A3 (en) | 1991-03-20 |
EP0347824B1 (en) | 1995-01-25 |
CA1335772C (en) | 1995-06-06 |
US5116642A (en) | 1992-05-26 |
KR920004038B1 (ko) | 1992-05-22 |
EP0347824A2 (en) | 1989-12-27 |
DE68920783T2 (de) | 1995-09-21 |
DE68920783D1 (de) | 1995-03-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19970513 Year of fee payment: 6 |
|
LAPS | Lapse due to unpaid annual fee |