DE60330892D1 - Lichtemissionsbauelement, leuchtstoff und verfahren zur herstellung eines leuchtstoffs - Google Patents

Lichtemissionsbauelement, leuchtstoff und verfahren zur herstellung eines leuchtstoffs

Info

Publication number
DE60330892D1
DE60330892D1 DE60330892T DE60330892T DE60330892D1 DE 60330892 D1 DE60330892 D1 DE 60330892D1 DE 60330892 T DE60330892 T DE 60330892T DE 60330892 T DE60330892 T DE 60330892T DE 60330892 D1 DE60330892 D1 DE 60330892D1
Authority
DE
Germany
Prior art keywords
phosphor
coating member
coating
alkaline
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60330892T
Other languages
English (en)
Inventor
Tadashi Maruta
Hiroto Tamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002326155A external-priority patent/JP4529349B2/ja
Priority claimed from JP2003319668A external-priority patent/JP4725008B2/ja
Application filed by Nichia Corp filed Critical Nichia Corp
Application granted granted Critical
Publication of DE60330892D1 publication Critical patent/DE60330892D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7734—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7735—Germanates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7792—Aluminates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Glass Compositions (AREA)
DE60330892T 2002-11-08 2003-11-07 Lichtemissionsbauelement, leuchtstoff und verfahren zur herstellung eines leuchtstoffs Expired - Lifetime DE60330892D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002326155A JP4529349B2 (ja) 2002-11-08 2002-11-08 窒化物系蛍光体および発光装置
JP2003319668A JP4725008B2 (ja) 2003-09-11 2003-09-11 発光装置、発光素子用蛍光体および発光素子用蛍光体の製造方法
PCT/JP2003/014233 WO2004042834A1 (ja) 2002-11-08 2003-11-07 発光装置、蛍光体および蛍光体の製造方法

Publications (1)

Publication Number Publication Date
DE60330892D1 true DE60330892D1 (de) 2010-02-25

Family

ID=32314072

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60330892T Expired - Lifetime DE60330892D1 (de) 2002-11-08 2003-11-07 Lichtemissionsbauelement, leuchtstoff und verfahren zur herstellung eines leuchtstoffs

Country Status (6)

Country Link
US (1) US7511411B2 (de)
EP (1) EP1560274B1 (de)
AT (1) ATE454718T1 (de)
AU (1) AU2003277627A1 (de)
DE (1) DE60330892D1 (de)
WO (1) WO2004042834A1 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070040502A1 (en) * 2004-04-20 2007-02-22 Gelcore Llc High CRI LED lamps utilizing single phosphor
WO2006059260A1 (en) * 2004-12-03 2006-06-08 Philips Intellectual Property & Standards Gmbh Illumination system comprising a radiation source and a fluorescent material
US7671529B2 (en) 2004-12-10 2010-03-02 Philips Lumileds Lighting Company, Llc Phosphor converted light emitting device
TWI249861B (en) * 2005-01-12 2006-02-21 Lighthouse Technology Co Ltd Wavelength converting substance and light emitting device and encapsulating material comprising the same
KR100678285B1 (ko) 2005-01-20 2007-02-02 삼성전자주식회사 발광 다이오드용 양자점 형광체 및 그의 제조방법
CN101712868A (zh) * 2005-02-28 2010-05-26 电气化学工业株式会社 荧光体及其制造方法及使用了该荧光体的发光元件
KR101201266B1 (ko) * 2005-06-14 2012-11-14 덴끼 가가꾸 고교 가부시키가이샤 형광체 함유 수지 조성물 및 시트, 그것들을 사용한 발광소자
US8012371B2 (en) 2005-08-24 2011-09-06 Koninklijke Philips Electronics N.V. Luminescent material
DE102005041153A1 (de) 2005-08-30 2007-03-01 Leuchtstoffwerk Breitungen Gmbh Nitridocarbid-Leuchtstoffe
JP4529846B2 (ja) * 2005-09-06 2010-08-25 日立電線株式会社 Ｉｉｉ−ｖ族窒化物系半導体基板及びその製造方法
DE102005059521A1 (de) 2005-12-13 2007-06-14 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Rot emittierender Leuchtstoff und Lichtquelle mit einem derartigen Leuchtstoff
KR100735320B1 (ko) * 2005-12-27 2007-07-04 삼성전기주식회사 형광체막 형성방법 및 이를 이용한 발광다이오드 패키지제조방법
CN101379163B (zh) * 2006-02-02 2013-01-02 三菱化学株式会社 复合氧氮化物荧光体、使用该荧光体的发光装置、图像显示装置、照明装置、含荧光体的组合物以及复合氧氮化物
US20070215837A1 (en) * 2006-03-16 2007-09-20 Shivkumar Chiruvolu Highly crystalline nanoscale phosphor particles and composite materials incorporating the particles
CN101426883B (zh) * 2006-04-19 2013-01-02 西巴控股有限公司 无机荧光增白剂
TWI357435B (en) * 2006-05-12 2012-02-01 Lextar Electronics Corp Light emitting diode and wavelength converting mat
JP2007324475A (ja) * 2006-06-02 2007-12-13 Sharp Corp 波長変換部材および発光装置
KR20090034897A (ko) * 2006-06-22 2009-04-08 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 저압 가스 방전 램프, 백라이팅 시스템, 및 디스플레이 시스템
US20080029720A1 (en) 2006-08-03 2008-02-07 Intematix Corporation LED lighting arrangement including light emitting phosphor
WO2008020541A1 (fr) * 2006-08-14 2008-02-21 Fujikura Ltd. Dispositif électroluminescent et dispositif d'éclairage
CN101605866B (zh) * 2007-02-07 2013-01-02 皇家飞利浦电子股份有限公司 包含复合物单片陶瓷发光转换器的照明***
CN101157854B (zh) * 2007-07-02 2010-10-13 北京宇极科技发展有限公司 一种氮氧化合物发光材料、其制备方法及其应用
JP2009263610A (ja) * 2007-08-01 2009-11-12 Mitsubishi Chemicals Corp 蛍光体及びその製造方法、結晶性窒化珪素及びその製造方法、蛍光体含有組成物、並びに、該蛍光体を用いた発光装置、画像表示装置及び照明装置
US8163202B2 (en) * 2007-08-21 2012-04-24 Samsung Electro-Mechanics Co., Ltd. (Oxy) nitride phosphor, white light-emitting device including the (oxy) nitride phosphor, method of preparing phosphor, and nitride phosphor prepared by the method
EP2212400B9 (de) * 2007-10-15 2014-04-16 Leuchtstoffwerk Breitungen GmbH Se-dotierter erdalkalisiliciumnitridleuchtstoff, verfahren zur herstellung und einen derartigen leuchtstoff umfassende strahlungskonvertierungsvorrichtung
DE102007053285A1 (de) * 2007-11-08 2009-05-14 Merck Patent Gmbh Verfahren zur Herstellung von beschichteten Leuchtstoffen
DE102007053770A1 (de) * 2007-11-12 2009-05-14 Merck Patent Gmbh Beschichtete Leuchtstoffpartikel mit Brechungsindex-Anpassung
US8040041B2 (en) * 2008-01-21 2011-10-18 Nichia Corporation Light emitting apparatus
KR101592836B1 (ko) 2008-02-07 2016-02-05 미쓰비시 가가꾸 가부시키가이샤 반도체 발광 장치, 백라이트, 컬러 화상 표시 장치, 및 그들에 사용하는 형광체
DE102008021662A1 (de) * 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh LED mit Mehrband-Leuchtstoffsystem
US9464225B2 (en) * 2008-11-17 2016-10-11 Cree, Inc. Luminescent particles, methods of identifying same and light emitting devices including the same
US8287759B2 (en) 2009-05-15 2012-10-16 Cree, Inc. Luminescent particles, methods and light emitting devices including the same
DE102009010705A1 (de) * 2009-02-27 2010-09-02 Merck Patent Gmbh Co-dotierte 2-5-8 Nitride
CN102725872A (zh) 2010-03-10 2012-10-10 松下电器产业株式会社 Led包封树脂体，led装置和led装置的制造方法
US8593062B2 (en) * 2010-04-29 2013-11-26 General Electric Company Color stable phosphors for LED lamps and methods for preparing them
WO2012018066A1 (ja) * 2010-08-04 2012-02-09 積水化学工業株式会社 表面処理蛍光体及び表面処理蛍光体の製造方法
KR101871524B1 (ko) 2010-09-28 2018-06-26 미쯔비시 케미컬 주식회사 형광체 및 그것을 이용한 발광 장치
US8604678B2 (en) 2010-10-05 2013-12-10 Intematix Corporation Wavelength conversion component with a diffusing layer
CN103155024B (zh) 2010-10-05 2016-09-14 英特曼帝克司公司 具光致发光波长转换的固态发光装置及标牌
US9546765B2 (en) 2010-10-05 2017-01-17 Intematix Corporation Diffuser component having scattering particles
US8957585B2 (en) 2010-10-05 2015-02-17 Intermatix Corporation Solid-state light emitting devices with photoluminescence wavelength conversion
US8610341B2 (en) 2010-10-05 2013-12-17 Intematix Corporation Wavelength conversion component
US8614539B2 (en) 2010-10-05 2013-12-24 Intematix Corporation Wavelength conversion component with scattering particles
JP5870611B2 (ja) * 2010-11-05 2016-03-01 日亜化学工業株式会社 発光装置及びその製造方法
JP5820606B2 (ja) * 2011-04-23 2015-11-24 株式会社日本セラテック 蛍光体材料の製造方法、蛍光体材料、及び発光装置
US9330911B2 (en) * 2011-08-22 2016-05-03 Invenlux Limited Light emitting device having group III-nitride current spreading layer doped with transition metal or comprising transition metal nitride
US20130092964A1 (en) * 2011-10-13 2013-04-18 Intematix Corporation Highly reliable photoluminescent materials having a thick and uniform titanium dioxide coating
CN102399552B (zh) * 2011-11-08 2014-07-30 杭州广陵科技开发有限公司 一种用于白光led的氮化物红色荧光粉及其制备方法
US9006966B2 (en) 2011-11-08 2015-04-14 Intematix Corporation Coatings for photoluminescent materials
TWI593780B (zh) * 2012-06-29 2017-08-01 呂宗昕 發光二極體之螢光材料及其製備方法
US20140185269A1 (en) 2012-12-28 2014-07-03 Intermatix Corporation Solid-state lamps utilizing photoluminescence wavelength conversion components
TWI627371B (zh) 2013-03-15 2018-06-21 英特曼帝克司公司 光致發光波長轉換組件
TWI527878B (zh) * 2013-04-26 2016-04-01 Taiwan Textile Res Inst Multi - light wavelength composite powder storage powder and its manufacturing method and application
CN104119886B (zh) * 2013-04-27 2016-08-10 财团法人纺织产业综合研究所 多光波长的复合蓄光粉体及其制造方法与应用
US10113111B2 (en) 2015-02-06 2018-10-30 Dow Silicones Corporation Treated fillers and uses thereof
US10253257B2 (en) 2015-11-25 2019-04-09 Intematix Corporation Coated narrow band red phosphor
KR20170089053A (ko) 2016-01-25 2017-08-03 삼성전자주식회사 수지 도포 장치 및 이를 사용한 발광소자 패키지 제조방법
CN105623658B (zh) * 2016-01-29 2017-04-12 江苏博睿光电有限公司 一种氮氧化物荧光粉及其制备方法、氮氧化物发光体和发光器件
CN106753325B (zh) * 2016-11-21 2019-08-20 东台市天源光电科技有限公司 一种高显色、低光衰红色荧光粉及其制备方法
CN110386822B (zh) * 2018-04-19 2021-02-26 深圳光峰科技股份有限公司 一种复相荧光陶瓷及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3578599D1 (de) 1984-05-07 1990-08-16 Gte Laboratories Inc Verfahren zur beschichtung von phosphorteilchen, phosphorteilchen, fluoreszente lampe und verfahren zur herstellung derselben.
US5418327A (en) 1993-01-04 1995-05-23 Actodyne General, Inc. Mounting assembly
JP3501498B2 (ja) 1994-05-20 2004-03-02 富士通株式会社 プラズマディスプレイパネル
JPH09104863A (ja) 1995-10-12 1997-04-22 Nec Kansai Ltd 被覆蛍光体および蛍光体の被覆処理方法および被覆蛍光体を用いた電界発光灯
JP3829464B2 (ja) * 1998-03-25 2006-10-04 双葉電子工業株式会社 蛍光体及び蛍光体の製造方法
US5985175A (en) 1998-08-19 1999-11-16 Osram Sylvania Inc. Boron oxide coated phosphor and method of making same
US6458512B1 (en) 1998-10-13 2002-10-01 3M Innovative Properties Company Oxynitride encapsulated electroluminescent phosphor particles
EP1104799A1 (de) * 1999-11-30 2001-06-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Rotstrahlendes lumineszentes Material
JP2002033521A (ja) * 2000-07-14 2002-01-31 Showa Denko Kk 白色発光素子およびその製造方法
JP2002076434A (ja) * 2000-08-28 2002-03-15 Toyoda Gosei Co Ltd 発光装置
DE10051242A1 (de) * 2000-10-17 2002-04-25 Philips Corp Intellectual Pty Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff
JP2002173675A (ja) 2000-12-06 2002-06-21 Sanken Electric Co Ltd 被覆層を有する蛍光粒子及びその製法
JP3954304B2 (ja) * 2000-12-20 2007-08-08 株式会社東芝 発光装置
US6417019B1 (en) 2001-04-04 2002-07-09 Lumileds Lighting, U.S., Llc Phosphor converted light emitting diode
US7001665B2 (en) 2001-04-06 2006-02-21 Osram Sylvania Inc. Electroluminescent phosphor with plural moisture resistant coatings thereon
US6686676B2 (en) 2001-04-30 2004-02-03 General Electric Company UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same
US6734466B2 (en) 2002-03-05 2004-05-11 Agilent Technologies, Inc. Coated phosphor filler and a method of forming the coated phosphor filler

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AU2003277627A1 (en) 2004-06-07
ATE454718T1 (de) 2010-01-15
EP1560274A1 (de) 2005-08-03
EP1560274A4 (de) 2007-03-28
US20060001352A1 (en) 2006-01-05
US7511411B2 (en) 2009-03-31
EP1560274B1 (de) 2010-01-06

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