DE60320227D1 - Verfahren und einrichtung zum polieren - Google Patents

Verfahren und einrichtung zum polieren

Info

Publication number
DE60320227D1
DE60320227D1 DE60320227T DE60320227T DE60320227D1 DE 60320227 D1 DE60320227 D1 DE 60320227D1 DE 60320227 T DE60320227 T DE 60320227T DE 60320227 T DE60320227 T DE 60320227T DE 60320227 D1 DE60320227 D1 DE 60320227D1
Authority
DE
Germany
Prior art keywords
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60320227T
Other languages
English (en)
Other versions
DE60320227T2 (de
Inventor
Yutaka Wada
Tomohiko Akatsuka
Tatsuya Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE60320227D1 publication Critical patent/DE60320227D1/de
Application granted granted Critical
Publication of DE60320227T2 publication Critical patent/DE60320227T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE60320227T 2002-02-20 2003-02-20 Verfahren und einrichtung zum polieren Expired - Fee Related DE60320227T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002043471 2002-02-20
JP2002043471 2002-02-20
PCT/JP2003/001869 WO2003071592A1 (fr) 2002-02-20 2003-02-20 Procede et dispositif de polissage

Publications (2)

Publication Number Publication Date
DE60320227D1 true DE60320227D1 (de) 2008-05-21
DE60320227T2 DE60320227T2 (de) 2009-05-20

Family

ID=27750526

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60315257T Expired - Fee Related DE60315257T2 (de) 2002-02-20 2003-02-20 Polierverfahren und polierflüssigkeit
DE60320227T Expired - Fee Related DE60320227T2 (de) 2002-02-20 2003-02-20 Verfahren und einrichtung zum polieren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60315257T Expired - Fee Related DE60315257T2 (de) 2002-02-20 2003-02-20 Polierverfahren und polierflüssigkeit

Country Status (6)

Country Link
US (2) US20040248415A1 (de)
EP (2) EP1478011B1 (de)
JP (2) JPWO2003071593A1 (de)
CN (2) CN100369210C (de)
DE (2) DE60315257T2 (de)
WO (2) WO2003071593A1 (de)

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US20050287932A1 (en) * 2004-06-25 2005-12-29 Basol Bulent M Article for polishin substrate surface
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US8506661B2 (en) * 2008-10-24 2013-08-13 Air Products & Chemicals, Inc. Polishing slurry for copper films
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JP5761943B2 (ja) * 2010-03-25 2015-08-12 株式会社東京精密 仕上研削装置および仕上研削方法
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US8602838B2 (en) * 2010-08-26 2013-12-10 Mcronix International Co., Ltd. Chemical mechanical polishing method and system
CN102528646A (zh) * 2010-12-31 2012-07-04 中芯国际集成电路制造(上海)有限公司 一种半导体研磨方法
US8211775B1 (en) 2011-03-09 2012-07-03 United Microelectronics Corp. Method of making transistor having metal gate
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SG10201810852TA (en) * 2014-10-03 2019-01-30 Ebara Corp Substrate processing apparatus and processing method
CN105619965A (zh) * 2014-11-28 2016-06-01 苏州力合光电薄膜科技有限公司 自润滑薄膜结构及其制造方法和应用
CN104493683B (zh) * 2014-11-28 2017-10-03 上海华力微电子有限公司 一种测定薄膜研磨速率的方法
CN104669075B (zh) * 2014-12-08 2017-08-04 沈阳工业大学 金刚石刀具光催化辅助刃磨方法及装置
JP6489973B2 (ja) * 2015-07-30 2019-03-27 株式会社ディスコ 研削装置
JP2017064899A (ja) * 2015-10-01 2017-04-06 株式会社荏原製作所 研磨装置
US9534148B1 (en) 2015-12-21 2017-01-03 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of polishing semiconductor substrate
JP7023455B2 (ja) * 2017-01-23 2022-02-22 不二越機械工業株式会社 ワーク研磨方法およびワーク研磨装置
CN107846656B (zh) * 2017-12-22 2024-01-12 镇江贝斯特新材料股份有限公司 用于受话器自动化柔性生产线的抛光装置
US10967480B2 (en) * 2018-10-29 2021-04-06 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing
JP7316785B2 (ja) 2018-12-26 2023-07-28 株式会社荏原製作所 光学式膜厚測定システムの洗浄方法
CN110039405B (zh) * 2019-03-20 2024-01-05 广东工业大学 一种增压雾化喷淋装置、抛光装置及抛光方法
JP6698921B1 (ja) * 2019-06-30 2020-05-27 株式会社西村ケミテック 研磨液供給装置
CN110517951B (zh) * 2019-08-29 2022-11-29 上海华力集成电路制造有限公司 一种改善sti研磨前晶圆微刮伤的清洗方法

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Also Published As

Publication number Publication date
CN1537324A (zh) 2004-10-13
US7108579B2 (en) 2006-09-19
EP1478011A1 (de) 2004-11-17
JPWO2003071592A1 (ja) 2005-06-16
JPWO2003071593A1 (ja) 2005-06-16
CN100369210C (zh) 2008-02-13
DE60315257D1 (de) 2007-09-13
US20040248415A1 (en) 2004-12-09
CN1533595A (zh) 2004-09-29
EP1478012A4 (de) 2005-06-01
EP1478011B1 (de) 2008-04-09
DE60320227T2 (de) 2009-05-20
CN100347827C (zh) 2007-11-07
DE60315257T2 (de) 2008-04-17
US20040235301A1 (en) 2004-11-25
WO2003071592A1 (fr) 2003-08-28
EP1478012A1 (de) 2004-11-17
EP1478012B1 (de) 2007-08-01
EP1478011A4 (de) 2005-06-01
WO2003071593A1 (fr) 2003-08-28

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