US20070032176A1 - Method for polishing diamond wafers - Google Patents

Method for polishing diamond wafers Download PDF

Info

Publication number
US20070032176A1
US20070032176A1 US11/196,346 US19634605A US2007032176A1 US 20070032176 A1 US20070032176 A1 US 20070032176A1 US 19634605 A US19634605 A US 19634605A US 2007032176 A1 US2007032176 A1 US 2007032176A1
Authority
US
United States
Prior art keywords
transmission device
metal disc
plate
recited
driven
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/196,346
Inventor
Chih-Ming Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arrow International Ltd
Cleavage Enterprise Co Ltd
Original Assignee
Arrow International Ltd
Cleavage Enterprise Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arrow International Ltd, Cleavage Enterprise Co Ltd filed Critical Arrow International Ltd
Priority to US11/196,346 priority Critical patent/US20070032176A1/en
Assigned to ARROW INTERNATIONAL LIMITED reassignment ARROW INTERNATIONAL LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MCAFFER, IAN GARDNER CAMERON, TASKO, PETER ERNEST
Assigned to CLEAVAGE ENTERPRISE CO., LTD. reassignment CLEAVAGE ENTERPRISE CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSU, CHIH-MING
Publication of US20070032176A1 publication Critical patent/US20070032176A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/16—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Definitions

  • the present invention generally relates to a method for polishing diamond wafers and, more particularly, to a method using a metal disc so as to polish diamond wafers.
  • CMP chemical mechanical polishing
  • FIG. 1 is a schematic diagram illustrating a conventional CMP process.
  • a polishing head 10 uses the atmosphere pressure to suck a wafer 12 on the backside such that the surface of the wafer 12 faces a polishing pad 14 and is polished.
  • a buffer pad 16 comprising a plurality of vent holes is disposed between the polishing head 10 and the wafer 12 .
  • a slurry 20 ejected from a slurry supply 18 is used when the wafer 12 is being polished.
  • the present invention provides a method for polishing diamond wafers, comprising steps of: providing at least a diamond wafer fixed on a plate; fixing the plate onto a first transmission device of a polishing machine such that a surface of the diamond wafer faces a metal disc fixed onto a second transmission device of the polishing machine; and rotating the metal disc driven by the second transmission device and rotating the plate driven by the first transmission device to move towards the metal disc so as to polish the diamond wafer fixed on the plate.
  • FIG. 1 is a schematic diagram illustrating a conventional chemical mechanical polishing (CMP) process
  • FIG. 2 is a schematic diagram illustrating the step of coating wax on the diamond wafers in the present invention.
  • FIG. 3 is a schematic diagram illustrating a method for polishing diamond wafers in accordance with the present invention.
  • the present invention providing a method for polishing diamond wafers can be exemplified by the preferred embodiment as described hereinafter.
  • the method for polishing diamond wafers starts with providing at least a diamond wafer 30 on a plate 32 with wax disposed therebetween and fixing the diamond wafer 30 onto the plate 32 using a pressure.
  • the plate 32 mounted with the diamond wafer 30 is fixed on a first transmission device 36 of a polishing machine 34 using a vacuum.
  • the first transmission device 36 is controlled by a control unit 38 so as to drive the plate 32 and the diamond wafer 30 to rotate, move back and forth and move perpendicularly to a direction towards a metal disc 40 driven by a second transmission device 42 to rotate unmoved.
  • the control unit 38 has input polishing parameters so as to control the first transmission device 36 and the second transmission device 42 for determining the wafer thickness and polishing time. Therefore, the diamond wafer 30 on the plate 32 is driven by the first transmission device 36 to move towards the metal disc 40 so as to polish the diamond wafer 30 . After a certain period of polishing time, the control unit 38 controls the first transmission device 36 to drive the diamond wafer 30 to move backwards, rotates and move perpendicularly to a direction towards the metal disc 40 . The first transmission device 36 repeats the aforementioned operation such that the metal disc 40 polishes the diamond wafer 30 until a determined of diamond wafer thickness is obtained.
  • the polishing machine 34 comprises at least a cooling liquid outlet 44 for ejecting a cooling liquid so as to rinse and cool down the metal disc 40 and the diamond wafer 30 .
  • the metal disc 40 is made of steel or an alloy thereof.
  • the plate 32 is made of ceramic of plastic materials. In addition to wax used as an adhesive between the diamond wafer 30 and the plate 32 , other adhesives or methods can be used to fix the diamond wafer 30 onto the plate 32 .
  • the control unit 38 controls the first transmission device 36 to stay unmoved and the second transmission device 42 to drive the metal disc 40 to rotate and move towards the diamond wafer 30 when the diamond wafer 30 is being polished. Similarly, the control unit 38 controls the first transmission device 36 and the second transmission device 42 to rotate, move back and forth and move perpendicularly to the direction towards each other according to the input polishing parameters.
  • the present invention discloses a method for polishing diamond wafers using a first transmission device to drive a diamond wafer moving towards a rotating metal disc such that the metal disc polishes the surface of the diamond wafer. Therefore, the present invention has been examined to be new, non-obvious and useful.

Abstract

A method for polishing diamond wafers. At least a diamond wafer is mounted onto a ceramic plate with wax disposed therebetween and is pressed onto the ceramic plate. The ceramic plate is fixed on a first transmission device of a polishing machine by a vacuum. The ceramic plate is driven by the first transmission device to rotate and move towards a metal disc fixed on a second transmission device driven to rotate unmoved such that the diamond wafer on the ceramic plate is being polished by the metal disc. The method for polishing diamond wafers of the present invention uses the metal disc so as to reduce cost, time and improve polishing efficiency.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention generally relates to a method for polishing diamond wafers and, more particularly, to a method using a metal disc so as to polish diamond wafers.
  • 2. Description of the Prior Art
  • In semiconductor manufacturing, surface flatness has become crucial because of the demand for high integrity of an integrated circuit (IC). More specifically, chemical mechanical polishing (CMP) is one of the most important techniques used for surface flatness of semiconductor wafers.
  • Please refer to FIG. 1, which is a schematic diagram illustrating a conventional CMP process. In FIG. 1, a polishing head 10 uses the atmosphere pressure to suck a wafer 12 on the backside such that the surface of the wafer 12 faces a polishing pad 14 and is polished. In order to avoid the polishing head 10 to contact the wafer 12 leading to the damage of the wafer 12, a buffer pad 16 comprising a plurality of vent holes is disposed between the polishing head 10 and the wafer 12. Moreover, a slurry 20 ejected from a slurry supply 18 is used when the wafer 12 is being polished.
  • However, for diamond wafers, i.e., wafers with a diamond film on the surface, conventional CMP is not capable of polishing the diamond film due to its physical and chemical properties. Therefore, diamond wafers with surface roughness of several micrometers are not applicable to compact micro-electronic devices. Even thought there have been some studies and research reports on surface flatness of diamond films, an effective method for polishing diamond wafers is still yet to come when manufacturing efficiency, cost and time are taken into account.
  • Therefore, there is need in providing a method for polishing diamond wafers so as to overcome the aforementioned problems.
    • SUMMARY OF THE INVENTION
  • It is the primary object of the present invention to provide a method for polishing diamond wafers, using a first transmission device to drive a diamond wafer moving towards a rotating metal disc such that the metal disc polishes the surface of the diamond wafer.
  • It is the secondary object of the present invention to provide a method for polishing diamond wafers so as to reduce cost and time.
  • In order to achieve the foregoing objects, the present invention provides a method for polishing diamond wafers, comprising steps of: providing at least a diamond wafer fixed on a plate; fixing the plate onto a first transmission device of a polishing machine such that a surface of the diamond wafer faces a metal disc fixed onto a second transmission device of the polishing machine; and rotating the metal disc driven by the second transmission device and rotating the plate driven by the first transmission device to move towards the metal disc so as to polish the diamond wafer fixed on the plate.
  • Other and further features, advantages and benefits of the invention will become apparent in the following description taken in conjunction with the following drawings. It is to be understood that the foregoing general description and following detailed description are exemplary and explanatory but are not to be restrictive of the invention. The accompanying drawings are incorporated in and constitute a part of this application and, together with the description, serve to explain the principles of the invention in general terms.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The objects, spirits and advantages of the preferred embodiment of the present invention will be readily understood by the accompanying drawings and detailed descriptions:
  • FIG. 1 is a schematic diagram illustrating a conventional chemical mechanical polishing (CMP) process;
  • FIG. 2 is a schematic diagram illustrating the step of coating wax on the diamond wafers in the present invention; and
  • FIG. 3 is a schematic diagram illustrating a method for polishing diamond wafers in accordance with the present invention.
    • DETAILED DESCRIPTION OF THE INVENTION
  • The present invention providing a method for polishing diamond wafers can be exemplified by the preferred embodiment as described hereinafter.
  • As shown in FIG. 2, the method for polishing diamond wafers according to the present invention starts with providing at least a diamond wafer 30 on a plate 32 with wax disposed therebetween and fixing the diamond wafer 30 onto the plate 32 using a pressure. Referring to FIG. 3, the plate 32 mounted with the diamond wafer 30 is fixed on a first transmission device 36 of a polishing machine 34 using a vacuum. The first transmission device 36 is controlled by a control unit 38 so as to drive the plate 32 and the diamond wafer 30 to rotate, move back and forth and move perpendicularly to a direction towards a metal disc 40 driven by a second transmission device 42 to rotate unmoved. The control unit 38 has input polishing parameters so as to control the first transmission device 36 and the second transmission device 42 for determining the wafer thickness and polishing time. Therefore, the diamond wafer 30 on the plate 32 is driven by the first transmission device 36 to move towards the metal disc 40 so as to polish the diamond wafer 30. After a certain period of polishing time, the control unit 38 controls the first transmission device 36 to drive the diamond wafer 30 to move backwards, rotates and move perpendicularly to a direction towards the metal disc 40. The first transmission device 36 repeats the aforementioned operation such that the metal disc 40 polishes the diamond wafer 30 until a determined of diamond wafer thickness is obtained.
  • Furthermore, as shown in FIG. 3, the polishing machine 34 comprises at least a cooling liquid outlet 44 for ejecting a cooling liquid so as to rinse and cool down the metal disc 40 and the diamond wafer 30. The metal disc 40 is made of steel or an alloy thereof. The plate 32 is made of ceramic of plastic materials. In addition to wax used as an adhesive between the diamond wafer 30 and the plate 32, other adhesives or methods can be used to fix the diamond wafer 30 onto the plate 32. In order to improve flexibility in using the present invention, the control unit 38 controls the first transmission device 36 to stay unmoved and the second transmission device 42 to drive the metal disc 40 to rotate and move towards the diamond wafer 30 when the diamond wafer 30 is being polished. Similarly, the control unit 38 controls the first transmission device 36 and the second transmission device 42 to rotate, move back and forth and move perpendicularly to the direction towards each other according to the input polishing parameters.
  • According to the above discussion, the present invention discloses a method for polishing diamond wafers using a first transmission device to drive a diamond wafer moving towards a rotating metal disc such that the metal disc polishes the surface of the diamond wafer. Therefore, the present invention has been examined to be new, non-obvious and useful.
  • Although this invention has been disclosed and illustrated with reference to particular embodiments, the principles involved are susceptible for use in numerous other embodiments that will be apparent to persons skilled in the art. This invention is, therefore, to be limited only as indicated by the scope of the appended claims.

Claims (13)

1. A method for polishing diamond wafers, comprising steps of:
providing at least a diamond wafer fixed on a plate;
fixing said plate onto a first transmission device of a polishing machine such that a surface of said diamond wafer faces a metal disc fixed onto a second transmission device of said polishing machine; and
rotating said metal disc driven by said second transmission device and rotating said plate driven by said first transmission device to move towards said metal disc so as to polish said diamond wafer fixed on said plate.
2. The method as recited in claim 1, wherein said plate is a ceramic plate.
3. The method as recited in claim 1, wherein said diamond wafer is mounted on said plate with wax disposed therebetween and is pressed to be fixed on said plate.
4. The method as recited in claim 1, wherein said plate is fixed on said transmission device by a vacuum.
5. The method as recited in claim 1, wherein said metal disc is made of steel or an alloy thereof.
6. The method as recited in claim 1, wherein said polishing machine comprising a control unit with input polishing parameters so as to control said first transmission device and said second transmission device for determining the wafer thickness and polishing time.
7. The method as recited in claim 1, wherein said metal disc is driven and controlled by said second transmission device to rotate unmoved and said plate is driven and controlled by said first transmission device to rotate moving towards said metal disc so as to polish said diamond wafer.
8. The method as recited in claim 1, wherein said plate is driven and controlled by said first transmission device to rotate moving towards said metal disc for a first interval of time and moving away from said metal disc for a second interval of time.
9. The method as recited in claim 1, wherein said plate is driven and controlled by said first transmission device to repeat moving towards said metal disc and moving away from said metal disc.
10. The method as recited in claim 1, wherein said plate is driven and controlled by said first transmission device to move towards said metal disc and move perpendicularly to a direction towards said metal disc.
11. The method as recited in claim 1, wherein said plate is driven and controlled by said first transmission device to rotate and move towards said metal disc.
12. The method as recited in claim 1, wherein said metal disc is driven by said second transmission device controlled by said control unit to move back and forth and move perpendicularly to a direction towards said plate.
13. The method as recited in claim 1, wherein said polishing machine comprises at least a cooling liquid outlet for ejecting a cooling liquid so as to rinse and cool down said metal disc and said diamond wafer.
US11/196,346 2005-08-04 2005-08-04 Method for polishing diamond wafers Abandoned US20070032176A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/196,346 US20070032176A1 (en) 2005-08-04 2005-08-04 Method for polishing diamond wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/196,346 US20070032176A1 (en) 2005-08-04 2005-08-04 Method for polishing diamond wafers

Publications (1)

Publication Number Publication Date
US20070032176A1 true US20070032176A1 (en) 2007-02-08

Family

ID=37718224

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/196,346 Abandoned US20070032176A1 (en) 2005-08-04 2005-08-04 Method for polishing diamond wafers

Country Status (1)

Country Link
US (1) US20070032176A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010058204A (en) * 2008-09-02 2010-03-18 Osg Corp Lapping device for single-crystalline diamond

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2371303A (en) * 1944-03-29 1945-03-13 Method and apparatus tor grinding
US2381449A (en) * 1942-11-14 1945-08-07 Arthur J Holman Spherical surface generating device
US3141265A (en) * 1962-12-07 1964-07-21 James P Charlton Optical grinding and polishing machine
US3167886A (en) * 1961-12-22 1965-02-02 Gen Dynamics Corp Lapping device
US3349520A (en) * 1965-02-15 1967-10-31 John E P Pickett Glass hone plate resurfacing apparatus
US4018008A (en) * 1973-06-04 1977-04-19 Young Francis M Lapping device
US5116391A (en) * 1989-05-31 1992-05-26 Maruma Jyusharyo Kabushiki Kaisha Curved surface rubbing apparatus
US5725413A (en) * 1994-05-06 1998-03-10 Board Of Trustees Of The University Of Arkansas Apparatus for and method of polishing and planarizing polycrystalline diamonds, and polished and planarized polycrystalline diamonds and products made therefrom
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5951373A (en) * 1995-10-27 1999-09-14 Applied Materials, Inc. Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning
US6197375B1 (en) * 1992-01-17 2001-03-06 Lucent Technologies Inc. Method comprising removal of material from a diamond film
US6284315B1 (en) * 1996-07-29 2001-09-04 Aurburn University Method of polishing diamond films
US6428399B1 (en) * 1994-05-23 2002-08-06 Sumitomo Electric Industries, Ltd. Polishing apparatus for polishing a hard material-coated wafer
US6572440B2 (en) * 1999-08-31 2003-06-03 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6575818B2 (en) * 2001-06-27 2003-06-10 Oriol Inc. Apparatus and method for polishing multiple semiconductor wafers in parallel
US6860803B2 (en) * 2001-10-15 2005-03-01 Shin-Etsu Chemical Co., Ltd. Polishing plate
US7108579B2 (en) * 2002-02-20 2006-09-19 Ebara Corporation Method and device for polishing

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2381449A (en) * 1942-11-14 1945-08-07 Arthur J Holman Spherical surface generating device
US2371303A (en) * 1944-03-29 1945-03-13 Method and apparatus tor grinding
US3167886A (en) * 1961-12-22 1965-02-02 Gen Dynamics Corp Lapping device
US3141265A (en) * 1962-12-07 1964-07-21 James P Charlton Optical grinding and polishing machine
US3349520A (en) * 1965-02-15 1967-10-31 John E P Pickett Glass hone plate resurfacing apparatus
US4018008A (en) * 1973-06-04 1977-04-19 Young Francis M Lapping device
US5116391A (en) * 1989-05-31 1992-05-26 Maruma Jyusharyo Kabushiki Kaisha Curved surface rubbing apparatus
US6197375B1 (en) * 1992-01-17 2001-03-06 Lucent Technologies Inc. Method comprising removal of material from a diamond film
US5725413A (en) * 1994-05-06 1998-03-10 Board Of Trustees Of The University Of Arkansas Apparatus for and method of polishing and planarizing polycrystalline diamonds, and polished and planarized polycrystalline diamonds and products made therefrom
US6428399B1 (en) * 1994-05-23 2002-08-06 Sumitomo Electric Industries, Ltd. Polishing apparatus for polishing a hard material-coated wafer
US5951373A (en) * 1995-10-27 1999-09-14 Applied Materials, Inc. Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6284315B1 (en) * 1996-07-29 2001-09-04 Aurburn University Method of polishing diamond films
US6572440B2 (en) * 1999-08-31 2003-06-03 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6575818B2 (en) * 2001-06-27 2003-06-10 Oriol Inc. Apparatus and method for polishing multiple semiconductor wafers in parallel
US6860803B2 (en) * 2001-10-15 2005-03-01 Shin-Etsu Chemical Co., Ltd. Polishing plate
US7108579B2 (en) * 2002-02-20 2006-09-19 Ebara Corporation Method and device for polishing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010058204A (en) * 2008-09-02 2010-03-18 Osg Corp Lapping device for single-crystalline diamond

Similar Documents

Publication Publication Date Title
US10189142B2 (en) Method for polishing a semiconductor wafer
JP5207909B2 (en) Carrier, method for coating carrier, and processing method for simultaneously removing material on both sides of semiconductor wafer
WO1997010613A1 (en) Grinding method of grinding device
JPH11219873A (en) Improvement of single crystal silicon wafer in mechanical resistance
US6764392B2 (en) Wafer polishing method and wafer polishing device
US20190193245A1 (en) Chemical-mechanical planarization (cmp) pad conditioner brush-and-abrasive hybrid for multi-step, preparation- and restoration-conditioning process of cmp pad
JP2001291690A (en) Apparatus and method for polishing
JP2007012918A (en) Polishing head
JP2004189846A (en) Pressure sensitive double-sided adhesive tape for fixing abrasive
US20070032176A1 (en) Method for polishing diamond wafers
US20010039167A1 (en) Sample polishing apparatus and sample polishing method
US7198549B2 (en) Continuous contour polishing of a multi-material surface
JP2013129023A (en) Method for manufacturing sapphire substrate, and sapphire substrate
JP2006074060A (en) Polishing method
JP7353715B2 (en) Grinding method of workpiece
JP3528501B2 (en) Semiconductor manufacturing method
US7854644B2 (en) Systems and methods for removing microfeature workpiece surface defects
JPH1034522A (en) Polishing device for cmp and cmp device system
JP2006237445A (en) Manufacturing method of semiconductor device, and polishing device
TW559580B (en) Polishing device
US6129610A (en) Polish pressure modulation in CMP to preferentially polish raised features
KR20070077979A (en) Chemical mechanical polishing apparatus and method for polishing wafer using the same
JP2007005515A (en) Wafer edge polishing holder
KR100901982B1 (en) Apparatus for Testing Adhesive Strength
JP2002355756A (en) Backing material for holding polished object

Legal Events

Date Code Title Description
AS Assignment

Owner name: ARROW INTERNATIONAL LIMITED, MALTA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MCAFFER, IAN GARDNER CAMERON;TASKO, PETER ERNEST;REEL/FRAME:016861/0422;SIGNING DATES FROM 20050704 TO 20050722

AS Assignment

Owner name: CLEAVAGE ENTERPRISE CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HSU, CHIH-MING;REEL/FRAME:016639/0246

Effective date: 20050722

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION