DE60306271D1 - Kontaktmodul und damit ausgerüsteter Verbinder - Google Patents

Kontaktmodul und damit ausgerüsteter Verbinder

Info

Publication number
DE60306271D1
DE60306271D1 DE60306271T DE60306271T DE60306271D1 DE 60306271 D1 DE60306271 D1 DE 60306271D1 DE 60306271 T DE60306271 T DE 60306271T DE 60306271 T DE60306271 T DE 60306271T DE 60306271 D1 DE60306271 D1 DE 60306271D1
Authority
DE
Germany
Prior art keywords
contact module
equipped connector
connector
module
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60306271T
Other languages
English (en)
Other versions
DE60306271T2 (de
Inventor
Shiho Sato
Takeshi Ito
Noboru Shimizu
Hideo Miyazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Component Ltd
Original Assignee
Fujitsu Component Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002193883A external-priority patent/JP2004039405A/ja
Priority claimed from JP2002193882A external-priority patent/JP2004039404A/ja
Application filed by Fujitsu Component Ltd filed Critical Fujitsu Component Ltd
Application granted granted Critical
Publication of DE60306271D1 publication Critical patent/DE60306271D1/de
Publication of DE60306271T2 publication Critical patent/DE60306271T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/87—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting automatically by insertion of rigid printed or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/193—Means for increasing contact pressure at the end of engagement of coupling part, e.g. zero insertion force or no friction
DE60306271T 2002-07-02 2003-04-01 Kontaktmodul und damit ausgerüsteter Verbinder Expired - Lifetime DE60306271T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002193883A JP2004039405A (ja) 2002-07-02 2002-07-02 コンタクトモジュール
JP2002193882A JP2004039404A (ja) 2002-07-02 2002-07-02 コネクタ
JP2002193883 2002-07-02
JP2002193882 2002-07-02

Publications (2)

Publication Number Publication Date
DE60306271D1 true DE60306271D1 (de) 2006-08-03
DE60306271T2 DE60306271T2 (de) 2006-10-12

Family

ID=29782038

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60306271T Expired - Lifetime DE60306271T2 (de) 2002-07-02 2003-04-01 Kontaktmodul und damit ausgerüsteter Verbinder

Country Status (3)

Country Link
US (1) US6796822B2 (de)
EP (1) EP1383204B1 (de)
DE (1) DE60306271T2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9691651B2 (en) 2005-01-28 2017-06-27 Brooks Automation, Inc. Substrate handling system for aligning and orienting substrates during a transfer operation
US7686521B2 (en) * 2003-11-10 2010-03-30 Finisar Corporation Zero force socket for laser / photodiode alignment
TWI245462B (en) * 2005-01-25 2005-12-11 Quanta Comp Inc Flexible flat cable
JP4819431B2 (ja) * 2005-07-29 2011-11-24 株式会社日本ディックス ハンダレス接続用のコネクタとこのコネクタに接続されるプラグ
JP4781237B2 (ja) * 2006-11-15 2011-09-28 モレックス インコーポレイテド エッジコネクタ
DE102007057444A1 (de) * 2007-11-29 2009-06-04 Robert Bosch Gmbh Verbindungsmittel zur flexiblen elektrischen Verbindung von Leiterplatten
TWI372978B (en) * 2008-03-17 2012-09-21 Nanya Technology Corp Connector socket for memory module
US8263879B2 (en) 2009-11-06 2012-09-11 International Business Machines Corporation Axiocentric scrubbing land grid array contacts and methods for fabrication
JP5531721B2 (ja) * 2010-03-30 2014-06-25 富士通株式会社 ピン配置決定プログラム、ピン配置決定装置及びピン配置決定方法
JP2015210886A (ja) * 2014-04-24 2015-11-24 富士通コンポーネント株式会社 コネクタ、及び、コンタクト
DE102016205476B4 (de) 2016-04-01 2019-08-01 Continental Automotive Gmbh Steckeraufnahme und Stecker für eine elektrische Steckverbindung und elektrische Steckverbindung
CN113690654A (zh) * 2016-06-15 2021-11-23 申泰公司 提供接触支持和阻抗匹配特性的包覆模制引线框架
TWI763704B (zh) 2016-08-30 2022-05-11 美商山姆科技公司 電連接器總成、將一電連接器總成安裝至一基板之方法
US10355383B2 (en) 2017-03-13 2019-07-16 Te Connectivity Corporation Circuit card assemblies for a communication system
US10553968B2 (en) * 2017-08-09 2020-02-04 Te Connectivity Corporation Electrical connector for a circuit card assembly of a communication system
US11025004B2 (en) 2017-08-09 2021-06-01 TE Connectivity Services Gmbh Circuit card assemblies for a communication system
US10411378B2 (en) 2017-08-09 2019-09-10 Te Connectivity Corporation Circuit card assemblies for a communication system
US10522925B2 (en) 2017-09-29 2019-12-31 Te Connectivity Corporation Circuit card assemblies for a communication system
US10381762B2 (en) 2017-09-29 2019-08-13 Te Connectivity Corporation Electrical connector for a circuit card assembly of a communication system
JP6372675B1 (ja) 2017-12-14 2018-08-15 Smk株式会社 カードエッジ接続装置
US10461470B2 (en) 2018-02-14 2019-10-29 Te Connectivity Corporation Circuit card assemblies for a communication system
US10587064B1 (en) 2019-01-23 2020-03-10 Te Connectivity Corporation Circuit card assemblies for a communication system
US10741950B1 (en) 2019-03-14 2020-08-11 Te Connectivity Corporation Circuit card assemblies for a communication system
US11063391B2 (en) 2019-10-11 2021-07-13 TE Connectivity Services Gmbh Circuit card assemblies for a communication system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4560221A (en) * 1984-05-14 1985-12-24 Amp Incorporated High density zero insertion force connector
JPS6243479U (de) * 1985-09-02 1987-03-16
NL9001347A (nl) * 1990-06-14 1992-01-02 Burndy Electra Nv Contactsamenstel.
US5575661A (en) * 1994-08-31 1996-11-19 The Whitaker Corporation Flexible film with circuitry thereon having improved local compliance and force distribution
US5993259A (en) * 1997-02-07 1999-11-30 Teradyne, Inc. High speed, high density electrical connector
EP1009068A1 (de) * 1998-10-16 2000-06-14 Molex Incorporated Leiterplatten-Randverbinder für flache Schaltungen

Also Published As

Publication number Publication date
DE60306271T2 (de) 2006-10-12
EP1383204B1 (de) 2006-06-21
US20040005816A1 (en) 2004-01-08
EP1383204A1 (de) 2004-01-21
US6796822B2 (en) 2004-09-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE