DE60229722D1 - Spannungsumsetzungsmodul - Google Patents

Spannungsumsetzungsmodul

Info

Publication number
DE60229722D1
DE60229722D1 DE60229722T DE60229722T DE60229722D1 DE 60229722 D1 DE60229722 D1 DE 60229722D1 DE 60229722 T DE60229722 T DE 60229722T DE 60229722 T DE60229722 T DE 60229722T DE 60229722 D1 DE60229722 D1 DE 60229722D1
Authority
DE
Germany
Prior art keywords
power module
module implementation
implementation
power
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60229722T
Other languages
English (en)
Inventor
Hiroshi Higashitani
Masaaki Hayama
Yuji Mido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60229722D1 publication Critical patent/DE60229722D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Capacitors (AREA)
DE60229722T 2001-10-05 2002-10-04 Spannungsumsetzungsmodul Expired - Lifetime DE60229722D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001309597A JP2003115664A (ja) 2001-10-05 2001-10-05 電圧変換モジュール
PCT/JP2002/010361 WO2003032389A1 (en) 2001-10-05 2002-10-04 Voltage conversion module

Publications (1)

Publication Number Publication Date
DE60229722D1 true DE60229722D1 (de) 2008-12-18

Family

ID=19128715

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60229722T Expired - Lifetime DE60229722D1 (de) 2001-10-05 2002-10-04 Spannungsumsetzungsmodul

Country Status (5)

Country Link
US (1) US6985364B2 (de)
EP (1) EP1357597B1 (de)
JP (1) JP2003115664A (de)
DE (1) DE60229722D1 (de)
WO (1) WO2003032389A1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7126443B2 (en) * 2003-03-28 2006-10-24 M/A-Com, Eurotec, B.V. Increasing performance of planar inductors used in broadband applications
US7205649B2 (en) * 2003-06-30 2007-04-17 Intel Corporation Ball grid array copper balancing
FI20031341A (fi) * 2003-09-18 2005-03-19 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
JP2006019340A (ja) * 2004-06-30 2006-01-19 Tdk Corp 半導体ｉｃ内蔵基板
US7154754B2 (en) * 2004-12-29 2006-12-26 Hewlett-Packard Development Company, L.P. Modular voltage regulator
US7235745B2 (en) * 2005-01-10 2007-06-26 Endicott Interconnect Technologies, Inc. Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate
JP4016039B2 (ja) * 2005-06-02 2007-12-05 新光電気工業株式会社 配線基板および配線基板の製造方法
DE102006008332B4 (de) 2005-07-11 2009-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit
KR100712549B1 (ko) 2006-01-31 2007-05-02 삼성전자주식회사 패키지 리드를 포함하는 멀티 스택 패키지
KR100789529B1 (ko) * 2006-11-13 2007-12-28 삼성전기주식회사 내장형 저항을 갖는 인쇄회로기판 및 그 제조방법
JP4807235B2 (ja) * 2006-11-17 2011-11-02 Ｔｄｋ株式会社 電子部品モジュール
US20080122061A1 (en) * 2006-11-29 2008-05-29 Texas Instruments Incorporated Semiconductor chip embedded in an insulator and having two-way heat extraction
JP5326269B2 (ja) * 2006-12-18 2013-10-30 大日本印刷株式会社 電子部品内蔵配線板、及び電子部品内蔵配線板の放熱方法
WO2008075135A1 (en) * 2006-12-19 2008-06-26 Nokia Corporation Power amplifier system
CN101690434B (zh) * 2007-06-26 2011-08-17 株式会社村田制作所 元器件内置基板的制造方法
US8310051B2 (en) 2008-05-27 2012-11-13 Mediatek Inc. Package-on-package with fan-out WLCSP
US8093722B2 (en) * 2008-05-27 2012-01-10 Mediatek Inc. System-in-package with fan-out WLCSP
JP4985852B2 (ja) 2008-11-04 2012-07-25 株式会社村田製作所 実装型電子回路モジュール
US20100213589A1 (en) * 2009-02-20 2010-08-26 Tung-Hsien Hsieh Multi-chip package
US20100213588A1 (en) * 2009-02-20 2010-08-26 Tung-Hsien Hsieh Wire bond chip package
JP4953034B2 (ja) * 2010-03-26 2012-06-13 Ｔｄｋ株式会社 電圧変換器
JP5494586B2 (ja) * 2010-09-30 2014-05-14 大日本印刷株式会社 電圧変換モジュール
JP2012146913A (ja) * 2011-01-14 2012-08-02 Dainippon Printing Co Ltd 電圧変換モジュール素子、及び電圧変換モジュール
TW201309122A (zh) * 2011-08-10 2013-02-16 Hon Hai Prec Ind Co Ltd 具有高速差分訊號佈線結構的印刷電路板
US9852941B2 (en) * 2014-10-03 2017-12-26 Analog Devices, Inc. Stacked conductor structure and methods for manufacture of same
JP6048481B2 (ja) * 2014-11-27 2016-12-21 株式会社豊田自動織機 電子機器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0888474A (ja) * 1994-09-16 1996-04-02 Taiyo Yuden Co Ltd 積層混成集積回路素子
US5841193A (en) * 1996-05-20 1998-11-24 Epic Technologies, Inc. Single chip modules, repairable multichip modules, and methods of fabrication thereof
JP3322575B2 (ja) * 1996-07-31 2002-09-09 太陽誘電株式会社 ハイブリッドモジュールとその製造方法
US6038133A (en) * 1997-11-25 2000-03-14 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method for producing the same
DE19808986A1 (de) * 1998-03-03 1999-09-09 Siemens Ag Halbleiterbauelement mit mehreren Halbleiterchips
US6538210B2 (en) * 1999-12-20 2003-03-25 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module, radio device having the same, and method for producing the same
US6366467B1 (en) * 2000-03-31 2002-04-02 Intel Corporation Dual-socket interposer and method of fabrication therefor
TW511405B (en) * 2000-12-27 2002-11-21 Matsushita Electric Ind Co Ltd Device built-in module and manufacturing method thereof
JP2002233140A (ja) * 2001-01-30 2002-08-16 Fuji Electric Co Ltd 超小型電力変換装置
US20030057544A1 (en) * 2001-09-13 2003-03-27 Nathan Richard J. Integrated assembly protocol

Also Published As

Publication number Publication date
JP2003115664A (ja) 2003-04-18
EP1357597A1 (de) 2003-10-29
US6985364B2 (en) 2006-01-10
EP1357597B1 (de) 2008-11-05
US20040070950A1 (en) 2004-04-15
EP1357597A4 (de) 2007-09-26
WO2003032389A1 (en) 2003-04-17

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)