DE60305006D1 - Schaltungsmodul mit miteinander verschalteten gruppen von überlappenden halbleiterchips - Google Patents

Schaltungsmodul mit miteinander verschalteten gruppen von überlappenden halbleiterchips

Info

Publication number
DE60305006D1
DE60305006D1 DE60305006T DE60305006T DE60305006D1 DE 60305006 D1 DE60305006 D1 DE 60305006D1 DE 60305006 T DE60305006 T DE 60305006T DE 60305006 T DE60305006 T DE 60305006T DE 60305006 D1 DE60305006 D1 DE 60305006D1
Authority
DE
Germany
Prior art keywords
circuit module
semiconductor chips
closed groups
overlapping semiconductor
overlapping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60305006T
Other languages
English (en)
Other versions
DE60305006T2 (de
Inventor
Siva Chennupati
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qimonda AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of DE60305006D1 publication Critical patent/DE60305006D1/de
Application granted granted Critical
Publication of DE60305006T2 publication Critical patent/DE60305006T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/50—Peripheral circuit region structures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
DE60305006T 2003-05-08 2003-05-08 Schaltungsmodul mit miteinander verschalteten gruppen von überlappenden halbleiterchips Expired - Lifetime DE60305006T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03010411A EP1475836B1 (de) 2003-05-08 2003-05-08 Schaltungsmodul mit miteinander verschalteten gruppen von überlappenden halbleiterchips

Publications (2)

Publication Number Publication Date
DE60305006D1 true DE60305006D1 (de) 2006-06-08
DE60305006T2 DE60305006T2 (de) 2006-11-02

Family

ID=32981841

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60305006T Expired - Lifetime DE60305006T2 (de) 2003-05-08 2003-05-08 Schaltungsmodul mit miteinander verschalteten gruppen von überlappenden halbleiterchips

Country Status (4)

Country Link
US (1) US6917100B2 (de)
EP (1) EP1475836B1 (de)
CN (1) CN100382199C (de)
DE (1) DE60305006T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005018001A1 (ja) * 2003-08-18 2005-02-24 Sanken Electric Co., Ltd. 半導体装置
US20080123305A1 (en) * 2006-11-28 2008-05-29 Smart Modular Technologies, Inc. Multi-channel memory modules for computing devices
TWI470762B (zh) 2007-07-27 2015-01-21 尼康股份有限公司 Laminated semiconductor device
US8174103B2 (en) * 2008-05-01 2012-05-08 International Business Machines Corporation Enhanced architectural interconnect options enabled with flipped die on a multi-chip package
US8816494B2 (en) 2012-07-12 2014-08-26 Micron Technology, Inc. Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3321321A1 (de) * 1982-06-19 1983-12-22 Ferranti plc, Gatley, Cheadle, Cheshire Elektrische schaltungsanordnung
JPS59210668A (ja) * 1983-05-16 1984-11-29 Fujitsu Ltd 半導体装置
IN188196B (de) * 1995-05-15 2002-08-31 Silicon Graphics Inc
JP3914651B2 (ja) * 1999-02-26 2007-05-16 エルピーダメモリ株式会社 メモリモジュールおよびその製造方法
US6683372B1 (en) * 1999-11-18 2004-01-27 Sun Microsystems, Inc. Memory expansion module with stacked memory packages and a serial storage unit
CN1259200C (zh) * 2000-10-02 2006-06-14 松下电器产业株式会社 卡型记录媒体及其制造方法
KR100389920B1 (ko) * 2000-12-12 2003-07-04 삼성전자주식회사 열팽창에 의한 신뢰성 저하를 개선할 수 있는 반도체 모듈
US6774475B2 (en) * 2002-01-24 2004-08-10 International Business Machines Corporation Vertically stacked memory chips in FBGA packages
US6542393B1 (en) * 2002-04-24 2003-04-01 Ma Laboratories, Inc. Dual-bank memory module with stacked DRAM chips having a concave-shaped re-route PCB in-between

Also Published As

Publication number Publication date
US6917100B2 (en) 2005-07-12
CN1551221A (zh) 2004-12-01
EP1475836A1 (de) 2004-11-10
DE60305006T2 (de) 2006-11-02
US20040222507A1 (en) 2004-11-11
EP1475836B1 (de) 2006-05-03
CN100382199C (zh) 2008-04-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: QIMONDA AG, 81739 MUENCHEN, DE