DE60303686D1 - Bauelementeplazierungskopf und bauelementeplazierungsverfahren - Google Patents
Bauelementeplazierungskopf und bauelementeplazierungsverfahrenInfo
- Publication number
- DE60303686D1 DE60303686D1 DE60303686T DE60303686T DE60303686D1 DE 60303686 D1 DE60303686 D1 DE 60303686D1 DE 60303686 T DE60303686 T DE 60303686T DE 60303686 T DE60303686 T DE 60303686T DE 60303686 D1 DE60303686 D1 DE 60303686D1
- Authority
- DE
- Germany
- Prior art keywords
- separation method
- construction element
- component separation
- element head
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002266562 | 2002-09-12 | ||
JP2002266562 | 2002-09-12 | ||
JP2003134763 | 2003-05-13 | ||
JP2003134763A JP4041768B2 (ja) | 2002-09-12 | 2003-05-13 | 部品装着ヘッド |
PCT/JP2003/011558 WO2004026015A1 (en) | 2002-09-12 | 2003-09-10 | Component placing head and component placing method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60303686D1 true DE60303686D1 (de) | 2006-04-27 |
DE60303686T2 DE60303686T2 (de) | 2006-10-12 |
Family
ID=31996153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60303686T Expired - Lifetime DE60303686T2 (de) | 2002-09-12 | 2003-09-10 | Bauelementeplazierungskopf und bauelementeplazierungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US7617597B2 (de) |
EP (1) | EP1543708B1 (de) |
JP (1) | JP4041768B2 (de) |
CN (1) | CN1328939C (de) |
DE (1) | DE60303686T2 (de) |
WO (1) | WO2004026015A1 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4330512B2 (ja) | 2004-10-08 | 2009-09-16 | パナソニック株式会社 | 部品実装装置 |
WO2006095841A2 (en) * | 2005-03-10 | 2006-09-14 | Matsushita Electric Industrial Co., Ltd. | Component mounting method and mounter |
JP4459847B2 (ja) * | 2005-03-17 | 2010-04-28 | パナソニック株式会社 | 部品装着ヘッド及び部品装着方法 |
JP4360399B2 (ja) * | 2006-11-30 | 2009-11-11 | ソニー株式会社 | 撮像装置 |
KR101495231B1 (ko) * | 2006-12-28 | 2015-02-24 | 야마하하쓰도키 가부시키가이샤 | 부품 인식 장치, 표면 실장기, 및 부품 시험 장치 |
JP4939391B2 (ja) * | 2007-03-28 | 2012-05-23 | ヤマハ発動機株式会社 | 実装機 |
JP5041878B2 (ja) * | 2007-05-22 | 2012-10-03 | ヤマハ発動機株式会社 | 部品認識装置、表面実装機、及び部品試験装置 |
JP2008305963A (ja) * | 2007-06-07 | 2008-12-18 | Yamaha Motor Co Ltd | 部品認識装置、表面実装機及び部品試験機 |
JP4783335B2 (ja) * | 2007-06-19 | 2011-09-28 | ヤマハ発動機株式会社 | 部品認識装置、表面実装機 |
JP4539685B2 (ja) * | 2007-06-22 | 2010-09-08 | セイコーエプソン株式会社 | 部品搬送装置及びicハンドラ |
JP5005556B2 (ja) * | 2008-01-11 | 2012-08-22 | ヤマハ発動機株式会社 | 部品移載装置、部品実装装置及び部品試験装置 |
US20100122456A1 (en) * | 2008-11-17 | 2010-05-20 | Chen-Hua Yu | Integrated Alignment and Bonding System |
CN101844878B (zh) * | 2009-03-26 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 真空贴合设备 |
JP5385010B2 (ja) * | 2009-05-29 | 2014-01-08 | Juki株式会社 | 電子部品実装装置 |
JP5415349B2 (ja) * | 2010-04-22 | 2014-02-12 | ヒーハイスト精工株式会社 | 微小部品配置ユニット |
CN103098578A (zh) * | 2010-08-27 | 2013-05-08 | 松下电器产业株式会社 | 部件安装装置及部件安装方法 |
KR101311251B1 (ko) * | 2010-11-12 | 2013-09-25 | 주식회사 고영테크놀러지 | 검사장치 |
JP5746610B2 (ja) * | 2011-12-22 | 2015-07-08 | ヤマハ発動機株式会社 | 部品撮像装置および同装置を備えた部品実装装置 |
JP5600705B2 (ja) * | 2012-05-10 | 2014-10-01 | ヤマハ発動機株式会社 | 部品実装装置 |
JP2014038946A (ja) * | 2012-08-16 | 2014-02-27 | Sony Corp | 実装装置、部材の配置方法及び基板の製造方法 |
WO2014065058A1 (ja) * | 2012-10-26 | 2014-05-01 | シャープ株式会社 | 光学部材搬送装置 |
CN104320921B (zh) * | 2014-08-18 | 2017-12-19 | 浙江山川科技股份有限公司 | 一种设有视觉***的贴片机 |
JP6457245B2 (ja) * | 2014-11-11 | 2019-01-23 | Juki株式会社 | 電子部品実装装置 |
CN107079620B (zh) * | 2014-11-13 | 2020-03-31 | 株式会社富士 | 安装机及使用了安装机的电子元件的吸附姿势检查方法 |
US9525832B1 (en) * | 2015-06-16 | 2016-12-20 | Stmicroelectronics Pte Ltd | Image sensor device with an electromagnetic compatibility shield (EMC) and associated methods |
JP6484823B2 (ja) * | 2016-09-02 | 2019-03-20 | パナソニックIpマネジメント株式会社 | 部品移載機構及び部品搭載装置 |
TWI584408B (zh) * | 2016-09-06 | 2017-05-21 | Long turn nozzle device | |
WO2018173226A1 (ja) * | 2017-03-23 | 2018-09-27 | 株式会社Fuji | 実装装置及び実装方法 |
JP7265531B2 (ja) * | 2017-09-28 | 2023-04-26 | ユニヴァーサル インストゥルメンツ コーポレイション | 改良されたリード先端照明装置、システム、および方法関連技術の相互参照 |
KR102127462B1 (ko) * | 2018-05-09 | 2020-06-26 | 한화정밀기계 주식회사 | 부품 픽업 장치 |
US11428880B2 (en) * | 2020-07-31 | 2022-08-30 | Openlight Photonics, Inc. | Optical based placement of an optical compontent using a pick and place machine |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62193199A (ja) * | 1986-02-19 | 1987-08-25 | 株式会社日立製作所 | 物品搭載機の物品検出装置 |
JPS6354000A (ja) * | 1986-08-22 | 1988-03-08 | 三洋電機株式会社 | 電子部品の位置検出装置 |
US4959898A (en) * | 1990-05-22 | 1990-10-02 | Emhart Industries, Inc. | Surface mount machine with lead coplanarity verifier |
US5878484A (en) * | 1992-10-08 | 1999-03-09 | Tdk Corporation | Chip-type circuit element mounting apparatus |
SG52900A1 (en) * | 1996-01-08 | 1998-09-28 | Matsushita Electric Ind Co Ltd | Mounting apparatus of electronic components and mounting methods of the same |
JP3570815B2 (ja) * | 1996-04-26 | 2004-09-29 | 松下電器産業株式会社 | 部品実装機用画像撮像装置 |
JP2863731B2 (ja) * | 1996-05-14 | 1999-03-03 | 株式会社テンリュウテクニックス | 電子部品装着装置およびその方法 |
JP3647146B2 (ja) * | 1996-06-20 | 2005-05-11 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
JP3746127B2 (ja) * | 1997-01-20 | 2006-02-15 | Juki株式会社 | 部品搭載装置 |
JP3893184B2 (ja) * | 1997-03-12 | 2007-03-14 | 松下電器産業株式会社 | 電子部品実装装置 |
JP4197764B2 (ja) * | 1997-06-16 | 2008-12-17 | Juki株式会社 | 部品撮像装置 |
US6160906A (en) * | 1998-06-01 | 2000-12-12 | Motorola, Inc. | Method and apparatus for visually inspecting an object |
JP3398109B2 (ja) * | 2000-01-27 | 2003-04-21 | 三洋電機株式会社 | 電子部品装着装置 |
EP1168907A1 (de) * | 2000-06-22 | 2002-01-02 | ESEC Trading S.A. | Einrichtung zur Montage eines Flip-Chips auf einem Werkstück |
WO2002054139A2 (en) * | 2001-01-02 | 2002-07-11 | Robotic Vision Systems, Inc. | Lcc device inspection module |
-
2003
- 2003-05-13 JP JP2003134763A patent/JP4041768B2/ja not_active Expired - Lifetime
- 2003-09-10 DE DE60303686T patent/DE60303686T2/de not_active Expired - Lifetime
- 2003-09-10 US US10/524,853 patent/US7617597B2/en active Active
- 2003-09-10 WO PCT/JP2003/011558 patent/WO2004026015A1/en active IP Right Grant
- 2003-09-10 EP EP03795362A patent/EP1543708B1/de not_active Expired - Fee Related
- 2003-09-10 CN CNB038207540A patent/CN1328939C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2004158819A (ja) | 2004-06-03 |
WO2004026015A1 (en) | 2004-03-25 |
DE60303686T2 (de) | 2006-10-12 |
US20050235489A1 (en) | 2005-10-27 |
CN1328939C (zh) | 2007-07-25 |
US7617597B2 (en) | 2009-11-17 |
CN1679385A (zh) | 2005-10-05 |
EP1543708B1 (de) | 2006-02-22 |
JP4041768B2 (ja) | 2008-01-30 |
EP1543708A1 (de) | 2005-06-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |
|
8320 | Willingness to grant licences declared (paragraph 23) |