DE60303686D1 - Bauelementeplazierungskopf und bauelementeplazierungsverfahren - Google Patents

Bauelementeplazierungskopf und bauelementeplazierungsverfahren

Info

Publication number
DE60303686D1
DE60303686D1 DE60303686T DE60303686T DE60303686D1 DE 60303686 D1 DE60303686 D1 DE 60303686D1 DE 60303686 T DE60303686 T DE 60303686T DE 60303686 T DE60303686 T DE 60303686T DE 60303686 D1 DE60303686 D1 DE 60303686D1
Authority
DE
Germany
Prior art keywords
separation method
construction element
component separation
element head
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60303686T
Other languages
English (en)
Other versions
DE60303686T2 (de
Inventor
Osamu Okuda
Youichi Tanaka
Hiroyoshi Saitoh
Haneo Iwamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60303686D1 publication Critical patent/DE60303686D1/de
Publication of DE60303686T2 publication Critical patent/DE60303686T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE60303686T 2002-09-12 2003-09-10 Bauelementeplazierungskopf und bauelementeplazierungsverfahren Expired - Lifetime DE60303686T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002266562 2002-09-12
JP2002266562 2002-09-12
JP2003134763 2003-05-13
JP2003134763A JP4041768B2 (ja) 2002-09-12 2003-05-13 部品装着ヘッド
PCT/JP2003/011558 WO2004026015A1 (en) 2002-09-12 2003-09-10 Component placing head and component placing method

Publications (2)

Publication Number Publication Date
DE60303686D1 true DE60303686D1 (de) 2006-04-27
DE60303686T2 DE60303686T2 (de) 2006-10-12

Family

ID=31996153

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60303686T Expired - Lifetime DE60303686T2 (de) 2002-09-12 2003-09-10 Bauelementeplazierungskopf und bauelementeplazierungsverfahren

Country Status (6)

Country Link
US (1) US7617597B2 (de)
EP (1) EP1543708B1 (de)
JP (1) JP4041768B2 (de)
CN (1) CN1328939C (de)
DE (1) DE60303686T2 (de)
WO (1) WO2004026015A1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4330512B2 (ja) 2004-10-08 2009-09-16 パナソニック株式会社 部品実装装置
WO2006095841A2 (en) * 2005-03-10 2006-09-14 Matsushita Electric Industrial Co., Ltd. Component mounting method and mounter
JP4459847B2 (ja) * 2005-03-17 2010-04-28 パナソニック株式会社 部品装着ヘッド及び部品装着方法
JP4360399B2 (ja) * 2006-11-30 2009-11-11 ソニー株式会社 撮像装置
KR101495231B1 (ko) * 2006-12-28 2015-02-24 야마하하쓰도키 가부시키가이샤 부품 인식 장치, 표면 실장기, 및 부품 시험 장치
JP4939391B2 (ja) * 2007-03-28 2012-05-23 ヤマハ発動機株式会社 実装機
JP5041878B2 (ja) * 2007-05-22 2012-10-03 ヤマハ発動機株式会社 部品認識装置、表面実装機、及び部品試験装置
JP2008305963A (ja) * 2007-06-07 2008-12-18 Yamaha Motor Co Ltd 部品認識装置、表面実装機及び部品試験機
JP4783335B2 (ja) * 2007-06-19 2011-09-28 ヤマハ発動機株式会社 部品認識装置、表面実装機
JP4539685B2 (ja) * 2007-06-22 2010-09-08 セイコーエプソン株式会社 部品搬送装置及びｉｃハンドラ
JP5005556B2 (ja) * 2008-01-11 2012-08-22 ヤマハ発動機株式会社 部品移載装置、部品実装装置及び部品試験装置
US20100122456A1 (en) * 2008-11-17 2010-05-20 Chen-Hua Yu Integrated Alignment and Bonding System
CN101844878B (zh) * 2009-03-26 2013-07-03 鸿富锦精密工业（深圳）有限公司 真空贴合设备
JP5385010B2 (ja) * 2009-05-29 2014-01-08 Ｊｕｋｉ株式会社 電子部品実装装置
JP5415349B2 (ja) * 2010-04-22 2014-02-12 ヒーハイスト精工株式会社 微小部品配置ユニット
CN103098578A (zh) * 2010-08-27 2013-05-08 松下电器产业株式会社 部件安装装置及部件安装方法
KR101311251B1 (ko) * 2010-11-12 2013-09-25 주식회사 고영테크놀러지 검사장치
JP5746610B2 (ja) * 2011-12-22 2015-07-08 ヤマハ発動機株式会社 部品撮像装置および同装置を備えた部品実装装置
JP5600705B2 (ja) * 2012-05-10 2014-10-01 ヤマハ発動機株式会社 部品実装装置
JP2014038946A (ja) * 2012-08-16 2014-02-27 Sony Corp 実装装置、部材の配置方法及び基板の製造方法
WO2014065058A1 (ja) * 2012-10-26 2014-05-01 シャープ株式会社 光学部材搬送装置
CN104320921B (zh) * 2014-08-18 2017-12-19 浙江山川科技股份有限公司 一种设有视觉***的贴片机
JP6457245B2 (ja) * 2014-11-11 2019-01-23 Juki株式会社 電子部品実装装置
CN107079620B (zh) * 2014-11-13 2020-03-31 株式会社富士 安装机及使用了安装机的电子元件的吸附姿势检查方法
US9525832B1 (en) * 2015-06-16 2016-12-20 Stmicroelectronics Pte Ltd Image sensor device with an electromagnetic compatibility shield (EMC) and associated methods
JP6484823B2 (ja) * 2016-09-02 2019-03-20 パナソニックＩｐマネジメント株式会社 部品移載機構及び部品搭載装置
TWI584408B (zh) * 2016-09-06 2017-05-21 Long turn nozzle device
WO2018173226A1 (ja) * 2017-03-23 2018-09-27 株式会社Ｆｕｊｉ 実装装置及び実装方法
JP7265531B2 (ja) * 2017-09-28 2023-04-26 ユニヴァーサル インストゥルメンツ コーポレイション 改良されたリード先端照明装置、システム、および方法関連技術の相互参照
KR102127462B1 (ko) * 2018-05-09 2020-06-26 한화정밀기계 주식회사 부품 픽업 장치
US11428880B2 (en) * 2020-07-31 2022-08-30 Openlight Photonics, Inc. Optical based placement of an optical compontent using a pick and place machine

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62193199A (ja) * 1986-02-19 1987-08-25 株式会社日立製作所 物品搭載機の物品検出装置
JPS6354000A (ja) * 1986-08-22 1988-03-08 三洋電機株式会社 電子部品の位置検出装置
US4959898A (en) * 1990-05-22 1990-10-02 Emhart Industries, Inc. Surface mount machine with lead coplanarity verifier
US5878484A (en) * 1992-10-08 1999-03-09 Tdk Corporation Chip-type circuit element mounting apparatus
SG52900A1 (en) * 1996-01-08 1998-09-28 Matsushita Electric Ind Co Ltd Mounting apparatus of electronic components and mounting methods of the same
JP3570815B2 (ja) * 1996-04-26 2004-09-29 松下電器産業株式会社 部品実装機用画像撮像装置
JP2863731B2 (ja) * 1996-05-14 1999-03-03 株式会社テンリュウテクニックス 電子部品装着装置およびその方法
JP3647146B2 (ja) * 1996-06-20 2005-05-11 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JP3746127B2 (ja) * 1997-01-20 2006-02-15 Ｊｕｋｉ株式会社 部品搭載装置
JP3893184B2 (ja) * 1997-03-12 2007-03-14 松下電器産業株式会社 電子部品実装装置
JP4197764B2 (ja) * 1997-06-16 2008-12-17 Ｊｕｋｉ株式会社 部品撮像装置
US6160906A (en) * 1998-06-01 2000-12-12 Motorola, Inc. Method and apparatus for visually inspecting an object
JP3398109B2 (ja) * 2000-01-27 2003-04-21 三洋電機株式会社 電子部品装着装置
EP1168907A1 (de) * 2000-06-22 2002-01-02 ESEC Trading S.A. Einrichtung zur Montage eines Flip-Chips auf einem Werkstück
WO2002054139A2 (en) * 2001-01-02 2002-07-11 Robotic Vision Systems, Inc. Lcc device inspection module

Also Published As

Publication number Publication date
JP2004158819A (ja) 2004-06-03
WO2004026015A1 (en) 2004-03-25
DE60303686T2 (de) 2006-10-12
US20050235489A1 (en) 2005-10-27
CN1328939C (zh) 2007-07-25
US7617597B2 (en) 2009-11-17
CN1679385A (zh) 2005-10-05
EP1543708B1 (de) 2006-02-22
JP4041768B2 (ja) 2008-01-30
EP1543708A1 (de) 2005-06-22

Similar Documents

Publication Publication Date Title
DE60303686D1 (de) Bauelementeplazierungskopf und bauelementeplazierungsverfahren
DE60332895D1 (de) Datentrenner und Datentrennungsverfahren
DE60319787D1 (de) Montageverfahren und -vorrichtung
DE60311063D1 (de) Ausziehleiter und zugehörige herstellungsverfahren
DE60319881D1 (de) Lösbare befestigungssysteme und -verfahren
DE60326611D1 (de) N und dergleichen
DE60303122D1 (de) Mikrofluidische trennungskollonen und deren herstellungsverfahren
BRPI0313238A2 (pt) método
DE60336567D1 (de) Piezoelektrischer d nnfilmoszillator, piezoelektrisches d nnfilmbauelement und herstellungsverfahren daf r
DE60321511D1 (de) Flüssigkeitsausstosskopf und dazugehöriges Herstellungsverfahren
DE60331729D1 (de) Audiocodierungsverfahren und audiocodierungseinrichtung
DE60307539D1 (de) Mikromechanische Vorrichtung und Herstellungsverfahren
DE60233444D1 (de) Teileanbringvorrichtung und teileanbringverfahren
DE60326702D1 (de) Polierverfahren und poliervorrichtung
DE602004012417D1 (de) Dekodierungsvorrichtung und dekodierungsverfahren
DE60309411D1 (de) Pollensensor und Verfahren
DE60319191D1 (de) Brückenvorrichtung und -verfahren
DE60319728D1 (de) Aufzeichnungsverfahren und aufzeichnungsvorrichtung
DE60326822D1 (de) Mehrschichtiges piezoelektrisches element und herstellungsverfahren dafür
DE60314268D1 (de) Aufzeichnungsverfahren und Aufzeichnungslegierung
DE60305874D1 (de) Trennungsverfahren und -vorrichtung von lötkrätzenmischungen
DE60336039D1 (de) Verstellbares Bohrgerät und assoziiertes Verfahren
DE60333155D1 (de) Simultandolmetschen- System und Verfahren
DE602004006036D1 (de) Keilverriegelungsvorrichtung und Montageverfahren
DE50305617D1 (de) Befestigungselement

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)