DE60234281D1 - Mehrschichtige Leiterplatte - Google Patents
Mehrschichtige LeiterplatteInfo
- Publication number
- DE60234281D1 DE60234281D1 DE60234281T DE60234281T DE60234281D1 DE 60234281 D1 DE60234281 D1 DE 60234281D1 DE 60234281 T DE60234281 T DE 60234281T DE 60234281 T DE60234281 T DE 60234281T DE 60234281 D1 DE60234281 D1 DE 60234281D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- multilayer printed
- multilayer
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001073066A JP4817516B2 (ja) | 2001-03-14 | 2001-03-14 | 多層プリント配線板 |
JP2001075856A JP4817517B2 (ja) | 2001-03-16 | 2001-03-16 | 多層プリント配線板 |
JP2001209953A JP2003023251A (ja) | 2001-07-10 | 2001-07-10 | 多層プリント配線板 |
JP2001209954A JP2003023252A (ja) | 2001-07-10 | 2001-07-10 | 多層プリント配線板 |
JP2001209955A JP5191074B2 (ja) | 2001-07-10 | 2001-07-10 | 多層プリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60234281D1 true DE60234281D1 (de) | 2009-12-17 |
Family
ID=27531832
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60232383T Expired - Lifetime DE60232383D1 (de) | 2001-03-14 | 2002-03-13 | Mehrschichtige Leiterplatte |
DE60232473T Expired - Lifetime DE60232473D1 (de) | 2001-03-14 | 2002-03-13 | Mehrschichtige Leiterplatte |
DE60234281T Expired - Lifetime DE60234281D1 (de) | 2001-03-14 | 2002-03-13 | Mehrschichtige Leiterplatte |
DE60228030T Expired - Lifetime DE60228030D1 (de) | 2001-03-14 | 2002-03-13 | Mehrschichtige leiterplatte |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60232383T Expired - Lifetime DE60232383D1 (de) | 2001-03-14 | 2002-03-13 | Mehrschichtige Leiterplatte |
DE60232473T Expired - Lifetime DE60232473D1 (de) | 2001-03-14 | 2002-03-13 | Mehrschichtige Leiterplatte |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60228030T Expired - Lifetime DE60228030D1 (de) | 2001-03-14 | 2002-03-13 | Mehrschichtige leiterplatte |
Country Status (6)
Country | Link |
---|---|
US (4) | US7371974B2 (de) |
EP (4) | EP1286579B1 (de) |
KR (5) | KR100882664B1 (de) |
CN (3) | CN102523677B (de) |
DE (4) | DE60232383D1 (de) |
WO (1) | WO2002074029A1 (de) |
Families Citing this family (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60232383D1 (de) * | 2001-03-14 | 2009-06-25 | Ibiden Co Ltd | Mehrschichtige Leiterplatte |
EP1473977A3 (de) * | 2003-04-28 | 2007-12-19 | Endicott Interconnect Technologies, Inc. | Elektronisches Gehäuse mit verstärkten leitenden Kontaktflächen |
JP4203435B2 (ja) * | 2003-05-16 | 2009-01-07 | 日本特殊陶業株式会社 | 多層樹脂配線基板 |
KR100547833B1 (ko) * | 2003-07-03 | 2006-01-31 | 삼성전자주식회사 | 단위 플라즈마 소스 및 이를 이용한 플라즈마 발생 장치 |
JP4647241B2 (ja) * | 2003-08-04 | 2011-03-09 | シャープ株式会社 | 光記録媒体原盤の製造方法、光記録媒体スタンパの製造方法、及び光記録媒体の製造方法 |
US20050057906A1 (en) * | 2003-09-12 | 2005-03-17 | Seiichi Nakatani | Connector sheet and wiring board, and production processes of the same |
JP2005150553A (ja) * | 2003-11-18 | 2005-06-09 | Ngk Spark Plug Co Ltd | 配線基板およびその製造方法 |
TW200602427A (en) * | 2004-03-30 | 2006-01-16 | Taiyo Ink Mfg Co Ltd | Thermosetting resin composition and multilayered printed wiring board comprising the same |
JP4020891B2 (ja) * | 2004-06-14 | 2007-12-12 | 三洋電機株式会社 | 素子搭載基板の製造方法 |
JP4359257B2 (ja) * | 2004-07-06 | 2009-11-04 | 三星電機株式会社 | Bgaパッケージおよびその製造方法 |
FI20045412A (fi) * | 2004-11-01 | 2006-05-02 | Aspocomp Technology Oy | Piirilevy, menetelmä sen valmistamiseksi ja elektroniikkalaite |
KR100645625B1 (ko) * | 2004-12-01 | 2006-11-15 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조방법 |
KR100601493B1 (ko) * | 2004-12-30 | 2006-07-18 | 삼성전기주식회사 | 하프에칭된 본딩 패드 및 절단된 도금 라인을 구비한bga 패키지 및 그 제조 방법 |
CN101826496B (zh) * | 2005-05-23 | 2015-03-18 | 揖斐电株式会社 | 印刷线路板及其制造方法 |
CN100562214C (zh) * | 2005-07-02 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | 具有改良过孔的印刷电路板 |
US7312523B2 (en) * | 2005-07-28 | 2007-12-25 | International Business Machines Corporation | Enhanced via structure for organic module performance |
KR100752672B1 (ko) * | 2006-09-06 | 2007-08-29 | 삼성전자주식회사 | 신뢰성 있는 범프 접속 구조를 갖는 인쇄 회로 기판 및 그제조방법, 및 이를 이용한 반도체 패키지 |
US8319111B2 (en) | 2006-10-04 | 2012-11-27 | Ngk Spark Plug Co., Ltd. | Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers |
WO2008053833A1 (fr) * | 2006-11-03 | 2008-05-08 | Ibiden Co., Ltd. | Tableau de câblage imprimé multicouche |
TWI353661B (en) * | 2007-04-09 | 2011-12-01 | Unimicron Technology Corp | Circuit board structure capable of embedding semic |
US7982137B2 (en) * | 2007-06-27 | 2011-07-19 | Hamilton Sundstrand Corporation | Circuit board with an attached die and intermediate interposer |
US8440916B2 (en) * | 2007-06-28 | 2013-05-14 | Intel Corporation | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
US8877565B2 (en) * | 2007-06-28 | 2014-11-04 | Intel Corporation | Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method |
US8309856B2 (en) * | 2007-11-06 | 2012-11-13 | Ibiden Co., Ltd. | Circuit board and manufacturing method thereof |
JP4431628B1 (ja) * | 2008-06-05 | 2010-03-17 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
JP5344394B2 (ja) * | 2008-07-10 | 2013-11-20 | 山栄化学株式会社 | 硬化性樹脂組成物、並びにハロゲンフリー樹脂基板及びハロゲンフリービルドアッププリント配線板 |
CN101657072B (zh) * | 2008-08-19 | 2011-12-21 | 富葵精密组件(深圳)有限公司 | 电路板制作方法 |
US8188380B2 (en) * | 2008-12-29 | 2012-05-29 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing printed wiring board |
US8592691B2 (en) * | 2009-02-27 | 2013-11-26 | Ibiden Co., Ltd. | Printed wiring board |
CN101861049B (zh) * | 2009-04-08 | 2012-03-07 | 昆山市华升电路板有限公司 | 厚铜线路板的线路蚀刻和阻焊制作方法 |
KR101067199B1 (ko) * | 2009-07-07 | 2011-09-22 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP5428667B2 (ja) * | 2009-09-07 | 2014-02-26 | 日立化成株式会社 | 半導体チップ搭載用基板の製造方法 |
JP2011060887A (ja) * | 2009-09-08 | 2011-03-24 | Renesas Electronics Corp | 電子装置、電子装置の製造方法 |
KR101153675B1 (ko) * | 2009-09-14 | 2012-06-18 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 제조 방법 |
US8445329B2 (en) * | 2009-09-30 | 2013-05-21 | Ati Technologies Ulc | Circuit board with oval micro via |
TW201114347A (en) * | 2009-10-09 | 2011-04-16 | Kinsus Interconnect Tech Corp | Method for fabricating high alignment interlayer conducting structure of embedded circuitry |
JP5427632B2 (ja) * | 2010-02-08 | 2014-02-26 | 太陽ホールディングス株式会社 | 積層構造体及びそれに用いる感光性ドライフィルム |
JP5422427B2 (ja) * | 2010-02-08 | 2014-02-19 | 太陽ホールディングス株式会社 | 積層構造体及びそれに用いる感光性ドライフィルム |
JP5566720B2 (ja) * | 2010-02-16 | 2014-08-06 | 日本特殊陶業株式会社 | 多層配線基板及びその製造方法 |
US8624127B2 (en) * | 2010-02-26 | 2014-01-07 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
JP5479233B2 (ja) * | 2010-06-04 | 2014-04-23 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
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