DE60325925D1 - Polierkissen - Google Patents

Polierkissen

Info

Publication number
DE60325925D1
DE60325925D1 DE60325925T DE60325925T DE60325925D1 DE 60325925 D1 DE60325925 D1 DE 60325925D1 DE 60325925 T DE60325925 T DE 60325925T DE 60325925 T DE60325925 T DE 60325925T DE 60325925 D1 DE60325925 D1 DE 60325925D1
Authority
DE
Germany
Prior art keywords
polishing pad
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60325925T
Other languages
English (en)
Inventor
Hiroshi Shiho
Hiromi Aoi
Kou Hasegawa
Nobuo Kawahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Application granted granted Critical
Publication of DE60325925D1 publication Critical patent/DE60325925D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE60325925T 2002-11-05 2003-11-04 Polierkissen Expired - Lifetime DE60325925D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002321856A JP4039214B2 (ja) 2002-11-05 2002-11-05 研磨パッド

Publications (1)

Publication Number Publication Date
DE60325925D1 true DE60325925D1 (de) 2009-03-12

Family

ID=32105440

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60325925T Expired - Lifetime DE60325925D1 (de) 2002-11-05 2003-11-04 Polierkissen

Country Status (7)

Country Link
US (1) US6992123B2 (de)
EP (1) EP1418021B1 (de)
JP (1) JP4039214B2 (de)
KR (1) KR100681980B1 (de)
CN (1) CN100443263C (de)
DE (1) DE60325925D1 (de)
TW (1) TWI264344B (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
DE10255652B4 (de) * 2002-11-28 2005-07-14 Infineon Technologies Ag Schleifkissen, Vorrichtung zum chemisch-mechanischen Polieren und Verfahren zum nasschemischen Schleifen einer Substratoberfläche
KR100590513B1 (ko) * 2002-12-30 2006-06-15 동부일렉트로닉스 주식회사 화학 기계적 연마 장치 및 방법
EP1466699A1 (de) * 2003-04-09 2004-10-13 JSR Corporation Polierkissen, Verfahren und Metallgiessform zur Herstellung desselben und Halbleiterscheibepolierverfahren
EP1739729B1 (de) * 2004-04-23 2012-03-28 JSR Corporation Polierstück für einen halbleiterwafer, polier-mehrschichtkörper für einen halbleiterwafer damit und verfahren zum polieren eines halbleiterwafers
JP2005340271A (ja) 2004-05-24 2005-12-08 Jsr Corp 化学機械研磨用パッド
US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
DE602005007125D1 (de) * 2004-09-17 2008-07-10 Jsr Corp Chemisch-mechanisches Polierkissen und chemisch-mechanisches Polierverfahren
US7316977B2 (en) * 2005-08-24 2008-01-08 Air Products And Chemicals, Inc. Chemical-mechanical planarization composition having ketooxime compounds and associated method for use
TWI409136B (zh) * 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊
US7985269B2 (en) * 2006-12-04 2011-07-26 3M Innovative Properties Company Nonwoven abrasive articles and methods of making the same
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
KR101232442B1 (ko) * 2007-09-21 2013-02-12 캐보트 마이크로일렉트로닉스 코포레이션 아미노실란으로 처리된 연마제 입자를 이용한 연마 조성물 및 방법
JP2009117815A (ja) * 2007-10-18 2009-05-28 Jsr Corp 化学機械研磨パッドの製造方法
WO2009088606A2 (en) 2007-12-31 2009-07-16 3M Innovative Properties Company Plasma treated abrasive article and method of making same
WO2009134775A1 (en) * 2008-04-29 2009-11-05 Semiquest, Inc. Polishing pad composition and method of manufacture and use
TWI520812B (zh) 2009-01-05 2016-02-11 音諾帕德股份有限公司 化學機械平面化墊體及其製造方法、以及拋光一基板之方法
WO2012053660A1 (ja) * 2010-10-21 2012-04-26 株式会社Moresco ガラス基板研磨用潤滑組成物及び研磨スラリー
KR101532896B1 (ko) * 2012-03-20 2015-06-30 제이에이치 로드스 컴퍼니, 인크 자가-컨디셔닝 연마 패드 및 이를 제조하는 방법
US9144880B2 (en) 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
JP2015185815A (ja) * 2014-03-26 2015-10-22 株式会社東芝 研磨パッド、研磨方法、及び半導体装置の製造方法
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
CN105802508B (zh) * 2014-12-29 2020-03-13 安集微电子（上海）有限公司 一种氮唑类化合物在提高化学机械抛光液稳定性中的应用
CN105802510A (zh) * 2014-12-29 2016-07-27 安集微电子（上海）有限公司 一种化学机械抛光液及其应用
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
JP6983179B2 (ja) * 2016-05-06 2021-12-17 スリーエム イノベイティブ プロパティズ カンパニー 硬化性組成物、研磨物品及びその製造方法
CN112243454B (zh) 2018-06-14 2022-03-22 3M创新有限公司 处理表面的方法、表面改性的磨料颗粒和树脂粘结磨具制品
CN112424300A (zh) 2018-06-14 2021-02-26 3M创新有限公司 用于可固化组合物的增粘剂

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5250085A (en) * 1993-01-15 1993-10-05 Minnesota Mining And Manufacturing Company Flexible bonded abrasive articles, methods of production and use
US5976000A (en) * 1996-05-28 1999-11-02 Micron Technology, Inc. Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
EP1017540B1 (de) * 1997-08-15 2002-06-12 Struers A/S Schleifprodukt und schleifverfahren
JP3668046B2 (ja) 1998-05-11 2005-07-06 株式会社東芝 研磨布及びこの研磨布を用いた半導体装置の製造方法
JP3918359B2 (ja) 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
US6390890B1 (en) * 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
JP3880028B2 (ja) * 1999-08-06 2007-02-14 Ｊｓｒ株式会社 研磨パッド用重合体組成物及びそれを用いた研磨パッド
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
JP3826702B2 (ja) * 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US20020098790A1 (en) * 2001-01-19 2002-07-25 Burke Peter A. Open structure polishing pad and methods for limiting pore depth
US6855034B2 (en) * 2001-04-25 2005-02-15 Jsr Corporation Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer

Also Published As

Publication number Publication date
US20040118051A1 (en) 2004-06-24
KR100681980B1 (ko) 2007-02-15
JP2004158581A (ja) 2004-06-03
TWI264344B (en) 2006-10-21
EP1418021B1 (de) 2009-01-21
JP4039214B2 (ja) 2008-01-30
CN100443263C (zh) 2008-12-17
KR20040040374A (ko) 2004-05-12
CN1498723A (zh) 2004-05-26
US6992123B2 (en) 2006-01-31
EP1418021A1 (de) 2004-05-12
TW200414967A (en) 2004-08-16

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Legal Events

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