DE602004010116D1 - Verfahren und vorrichtung zum testen elektrischer eigenschaften eines zu prüfenden objekts - Google Patents
Verfahren und vorrichtung zum testen elektrischer eigenschaften eines zu prüfenden objektsInfo
- Publication number
- DE602004010116D1 DE602004010116D1 DE602004010116T DE602004010116T DE602004010116D1 DE 602004010116 D1 DE602004010116 D1 DE 602004010116D1 DE 602004010116 T DE602004010116 T DE 602004010116T DE 602004010116 T DE602004010116 T DE 602004010116T DE 602004010116 D1 DE602004010116 D1 DE 602004010116D1
- Authority
- DE
- Germany
- Prior art keywords
- tested
- electrical properties
- testing electrical
- testing
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007689 inspection Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003164349A JP4387125B2 (ja) | 2003-06-09 | 2003-06-09 | 検査方法及び検査装置 |
JP2003164349 | 2003-06-09 | ||
PCT/JP2004/008300 WO2004109306A1 (ja) | 2003-06-09 | 2004-06-08 | 被検査体の電気的特性を検査する検査方法及び検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602004010116D1 true DE602004010116D1 (de) | 2007-12-27 |
DE602004010116T2 DE602004010116T2 (de) | 2008-09-11 |
Family
ID=33508784
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004017655T Expired - Lifetime DE602004017655D1 (de) | 2003-06-09 | 2004-06-08 | Verfahren und Vorrichtung zum Testen elektrischer Eigenschaften eines zu prüfenden Objekts |
DE602004010116T Expired - Lifetime DE602004010116T2 (de) | 2003-06-09 | 2004-06-08 | Verfahren und vorrichtung zum testen elektrischer eigenschaften eines zu prüfenden objekts |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004017655T Expired - Lifetime DE602004017655D1 (de) | 2003-06-09 | 2004-06-08 | Verfahren und Vorrichtung zum Testen elektrischer Eigenschaften eines zu prüfenden Objekts |
Country Status (8)
Country | Link |
---|---|
US (3) | US7262613B2 (de) |
EP (2) | EP1637893B1 (de) |
JP (1) | JP4387125B2 (de) |
KR (1) | KR100810550B1 (de) |
CN (1) | CN100442068C (de) |
AT (2) | ATE413605T1 (de) |
DE (2) | DE602004017655D1 (de) |
WO (1) | WO2004109306A1 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4354988B2 (ja) | 2005-01-28 | 2009-10-28 | パナソニック株式会社 | 記録媒体、再生装置、プログラム、再生方法、記録方法 |
EP1870714A4 (de) * | 2005-03-31 | 2010-05-19 | Octec Inc | Mikrostruktur-sondenkarte und mikrostruktur-untersuchungseinrichtung, verfahren und computerprogramm |
JP2006319209A (ja) * | 2005-05-13 | 2006-11-24 | Tokyo Electron Ltd | パワーデバイス用の検査装置 |
JP5108238B2 (ja) * | 2006-02-24 | 2012-12-26 | 東京エレクトロン株式会社 | 検査方法、検査装置及び制御プログラム |
JP5016892B2 (ja) * | 2006-10-17 | 2012-09-05 | 東京エレクトロン株式会社 | 検査装置及び検査方法 |
JP2008157818A (ja) * | 2006-12-25 | 2008-07-10 | Tokyo Electron Ltd | 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体 |
US20100039130A1 (en) * | 2006-12-27 | 2010-02-18 | Tokyo Electron Limited | Inspecting method, inspecting apparatus and computer readable storage medium having program stored therein |
JP4664334B2 (ja) | 2007-07-20 | 2011-04-06 | 東京エレクトロン株式会社 | 検査方法 |
JP4991495B2 (ja) * | 2007-11-26 | 2012-08-01 | 東京エレクトロン株式会社 | 検査用保持部材及び検査用保持部材の製造方法 |
TWI362496B (en) * | 2008-03-05 | 2012-04-21 | Nanya Technology Corp | Apparatus for testing chip and circuit of probe card |
US8344746B2 (en) * | 2008-09-29 | 2013-01-01 | Thermo Fisher Scientific Inc. | Probe interface for electrostatic discharge testing of an integrated circuit |
CN101696992B (zh) * | 2009-10-28 | 2013-03-27 | 上海宏力半导体制造有限公司 | 双极型晶体管的基区电阻的测量方法 |
JP5296117B2 (ja) * | 2010-03-12 | 2013-09-25 | 東京エレクトロン株式会社 | プローブ装置 |
US8620724B2 (en) * | 2010-04-20 | 2013-12-31 | Accenture Global Services Limited | Integration framework for enterprise content management systems |
JP5291157B2 (ja) | 2011-08-01 | 2013-09-18 | 東京エレクトロン株式会社 | パワーデバイス用のプローブカード |
JP5265746B2 (ja) | 2011-09-22 | 2013-08-14 | 東京エレクトロン株式会社 | プローブ装置 |
CN103091514A (zh) * | 2011-10-27 | 2013-05-08 | 无锡华润上华科技有限公司 | 手动探针台结构 |
WO2013108452A1 (ja) * | 2012-01-20 | 2013-07-25 | 東京エレクトロン株式会社 | 支持基板及び基板の処理方法 |
JP2014107469A (ja) * | 2012-11-29 | 2014-06-09 | Tokyo Electron Ltd | 半導体装置の製造方法及び製造装置 |
CN104377101B (zh) | 2013-08-14 | 2017-08-08 | Fei 公司 | 用于带电粒子束***的电路探头 |
JP6386923B2 (ja) * | 2015-01-26 | 2018-09-05 | 三菱電機株式会社 | 半導体評価装置およびチャックステージの検査方法 |
JP6809049B2 (ja) * | 2016-08-31 | 2021-01-06 | 日亜化学工業株式会社 | 発光装置の検査方法 |
JP7497629B2 (ja) * | 2020-07-03 | 2024-06-11 | 富士電機株式会社 | 半導体チップの試験装置および試験方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5545247U (de) * | 1978-09-20 | 1980-03-25 | ||
JPS5545247A (en) | 1978-09-25 | 1980-03-29 | Matsushita Electric Ind Co Ltd | Signal receiving unit |
GB8305967D0 (en) * | 1983-03-04 | 1983-04-07 | Univ Liverpool | Material for treatment of spontaneous abortions |
JPH0727951B2 (ja) | 1987-04-15 | 1995-03-29 | 東京エレクトロン株式会社 | ウエハ載置台 |
JPH02166746A (ja) | 1988-12-21 | 1990-06-27 | Tokyo Electron Ltd | 測定装置 |
JP3208734B2 (ja) * | 1990-08-20 | 2001-09-17 | 東京エレクトロン株式会社 | プローブ装置 |
US5184398A (en) * | 1991-08-30 | 1993-02-09 | Texas Instruments Incorporated | In-situ real-time sheet resistance measurement method |
JPH06151529A (ja) * | 1992-11-16 | 1994-05-31 | Mitsubishi Electric Corp | 半導体装置の製造方法及びウエハテスト装置 |
US5557215A (en) * | 1993-05-12 | 1996-09-17 | Tokyo Electron Limited | Self-bias measuring method, apparatus thereof and electrostatic chucking apparatus |
JPH1164385A (ja) | 1997-08-21 | 1999-03-05 | Hitachi Electron Eng Co Ltd | 検査用基板のプローブ |
JP3642456B2 (ja) * | 1998-02-24 | 2005-04-27 | 株式会社村田製作所 | 電子部品の検査方法および装置 |
RU2249431C2 (ru) * | 1998-07-06 | 2005-04-10 | ПАСТОР Александер | Устроойство и способ определения полного электрического сопротивления кожи |
JP2000164665A (ja) | 1998-11-27 | 2000-06-16 | Miyazaki Oki Electric Co Ltd | 半導体集積回路装置及びその製造方法 |
AU2117101A (en) * | 1999-10-19 | 2001-04-30 | Solid State Measurements, Inc. | Non-invasive electrical measurement of semiconductor wafers |
JP4841737B2 (ja) * | 2000-08-21 | 2011-12-21 | 東京エレクトロン株式会社 | 検査方法及び検査装置 |
JP2002176142A (ja) * | 2000-12-07 | 2002-06-21 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
JP4456325B2 (ja) * | 2002-12-12 | 2010-04-28 | 東京エレクトロン株式会社 | 検査方法及び検査装置 |
-
2003
- 2003-06-09 JP JP2003164349A patent/JP4387125B2/ja not_active Expired - Fee Related
-
2004
- 2004-06-08 EP EP04745857A patent/EP1637893B1/de not_active Expired - Lifetime
- 2004-06-08 DE DE602004017655T patent/DE602004017655D1/de not_active Expired - Lifetime
- 2004-06-08 KR KR1020057023671A patent/KR100810550B1/ko not_active IP Right Cessation
- 2004-06-08 WO PCT/JP2004/008300 patent/WO2004109306A1/ja active IP Right Grant
- 2004-06-08 EP EP07004065A patent/EP1788401B1/de not_active Expired - Lifetime
- 2004-06-08 CN CNB2004800161192A patent/CN100442068C/zh not_active Expired - Fee Related
- 2004-06-08 AT AT07004065T patent/ATE413605T1/de not_active IP Right Cessation
- 2004-06-08 DE DE602004010116T patent/DE602004010116T2/de not_active Expired - Lifetime
- 2004-06-08 AT AT04745857T patent/ATE378607T1/de not_active IP Right Cessation
-
2005
- 2005-12-08 US US11/296,482 patent/US7262613B2/en not_active Expired - Fee Related
-
2006
- 2006-10-06 US US11/543,777 patent/US20070063725A1/en not_active Abandoned
-
2008
- 2008-01-10 US US12/007,403 patent/US7688088B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1637893A1 (de) | 2006-03-22 |
US7688088B2 (en) | 2010-03-30 |
KR20060119719A (ko) | 2006-11-24 |
EP1637893B1 (de) | 2007-11-14 |
EP1788401B1 (de) | 2008-11-05 |
DE602004017655D1 (de) | 2008-12-18 |
JP2005005331A (ja) | 2005-01-06 |
EP1637893A4 (de) | 2006-07-19 |
ATE378607T1 (de) | 2007-11-15 |
EP1788401A1 (de) | 2007-05-23 |
DE602004010116T2 (de) | 2008-09-11 |
KR100810550B1 (ko) | 2008-03-18 |
US20070063725A1 (en) | 2007-03-22 |
CN1809757A (zh) | 2006-07-26 |
CN100442068C (zh) | 2008-12-10 |
US7262613B2 (en) | 2007-08-28 |
JP4387125B2 (ja) | 2009-12-16 |
WO2004109306A1 (ja) | 2004-12-16 |
US20080174325A1 (en) | 2008-07-24 |
ATE413605T1 (de) | 2008-11-15 |
US20060145716A1 (en) | 2006-07-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8381 | Inventor (new situation) |
Inventor name: ITOH, TOSHIHIRO, CHIBA 263-0022, JP Inventor name: SUGA, TADATOMO, TOKYO 164-0003, JP Inventor name: KOMATSU, SHIGEKAZU, TOKYO 107-8481, JP Inventor name: KATAOKA, KENICHI, TOKYO 154-0023, JP |
|
8364 | No opposition during term of opposition |