DE60141225D1 - Verfahren zur herstellung einer dünnfilmtransistorstruktur - Google Patents
Verfahren zur herstellung einer dünnfilmtransistorstrukturInfo
- Publication number
- DE60141225D1 DE60141225D1 DE60141225T DE60141225T DE60141225D1 DE 60141225 D1 DE60141225 D1 DE 60141225D1 DE 60141225 T DE60141225 T DE 60141225T DE 60141225 T DE60141225 T DE 60141225T DE 60141225 D1 DE60141225 D1 DE 60141225D1
- Authority
- DE
- Germany
- Prior art keywords
- thin film
- film transistor
- transistor structure
- producing
- trench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 229920006254 polymer film Polymers 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78603—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001042081 | 2001-02-19 | ||
PCT/JP2001/011110 WO2002067335A1 (fr) | 2001-02-19 | 2001-12-18 | Structure de transistor en couches minces, procede de fabrication d'une structure de transistor en couches minces, et dispositif d'affichage utilisant une structure de transistor en couches minces |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60141225D1 true DE60141225D1 (de) | 2010-03-18 |
Family
ID=18904430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60141225T Expired - Lifetime DE60141225D1 (de) | 2001-02-19 | 2001-12-18 | Verfahren zur herstellung einer dünnfilmtransistorstruktur |
Country Status (9)
Country | Link |
---|---|
US (2) | US6952036B2 (de) |
EP (1) | EP1369928B1 (de) |
JP (1) | JP4022470B2 (de) |
KR (1) | KR100650417B1 (de) |
CN (1) | CN100459163C (de) |
AT (1) | ATE456863T1 (de) |
DE (1) | DE60141225D1 (de) |
TW (1) | TW541705B (de) |
WO (1) | WO2002067335A1 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100459163C (zh) | 2001-02-19 | 2009-02-04 | 国际商业机器公司 | 薄膜晶体管结构及其制造方法和使用它的显示器件 |
US6887776B2 (en) | 2003-04-11 | 2005-05-03 | Applied Materials, Inc. | Methods to form metal lines using selective electrochemical deposition |
TWI253174B (en) * | 2003-05-09 | 2006-04-11 | Au Optronics Corp | Ion sensitive field effect transistor and fabrication method of the same |
US7884355B2 (en) | 2003-05-12 | 2011-02-08 | Cambridge Enterprise Ltd | Polymer transistor |
EP1651018A4 (de) * | 2003-06-04 | 2009-11-11 | Tadahiro Ohmi | Substrat und prozess zu seiner herstellung |
JP4554344B2 (ja) * | 2003-12-02 | 2010-09-29 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4712361B2 (ja) * | 2003-12-02 | 2011-06-29 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法 |
KR101124999B1 (ko) * | 2003-12-02 | 2012-03-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치와 그 제조 방법 |
KR101111995B1 (ko) | 2003-12-02 | 2012-03-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막 트랜지스터, 디스플레이 장치 및 액정 디스플레이장치, 그리고 그 제조방법 |
US7223641B2 (en) * | 2004-03-26 | 2007-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method for manufacturing the same, liquid crystal television and EL television |
KR100636503B1 (ko) * | 2004-06-25 | 2006-10-18 | 삼성에스디아이 주식회사 | 발광 표시장치와 그의 제조방법 |
JP2006030502A (ja) * | 2004-07-15 | 2006-02-02 | Sony Corp | 表示装置および表示装置の製造方法 |
JP4628040B2 (ja) * | 2004-08-20 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 半導体素子を備えた表示装置の製造方法 |
CN100452325C (zh) * | 2005-03-22 | 2009-01-14 | 友达光电股份有限公司 | 一种薄膜晶体管与液晶显示器的制造方法 |
TW200713596A (en) * | 2005-06-13 | 2007-04-01 | Univ Tohoku | Thin-film transistor, wiring board, and method of producing an electronic apparatus |
US20080217617A1 (en) * | 2005-07-05 | 2008-09-11 | Zeon Corporation | Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same |
US7397086B2 (en) * | 2005-12-23 | 2008-07-08 | Xerox Corporation | Top-gate thin-film transistor |
JP2007203442A (ja) * | 2006-02-06 | 2007-08-16 | Univ Kanagawa | 金属被覆砥粒,金属被覆砥粒の製造方法,およびその金属被覆砥粒を使用した砥石 |
US9179579B2 (en) * | 2006-06-08 | 2015-11-03 | International Business Machines Corporation | Sheet having high thermal conductivity and flexibility |
TWI305682B (en) | 2006-08-14 | 2009-01-21 | Au Optronics Corp | Bottom substrate for liquid crystal display device and the method of making the same |
JP2008103653A (ja) * | 2006-09-22 | 2008-05-01 | Tohoku Univ | 半導体装置及び半導体装置の製造方法 |
KR101272489B1 (ko) * | 2006-10-03 | 2013-06-07 | 삼성디스플레이 주식회사 | 표시 기판, 이의 제조 방법 및 이를 구비하는 전기영동표시장치 |
JP5329038B2 (ja) * | 2006-12-21 | 2013-10-30 | 宇部日東化成株式会社 | 半導体装置及び半導体装置の製造方法 |
KR101418588B1 (ko) * | 2007-11-14 | 2014-07-16 | 삼성디스플레이 주식회사 | 표시 기판 및 이의 제조 방법 |
GB2454740B (en) * | 2007-11-19 | 2011-12-21 | Hewlett Packard Development Co | Conductive interconnects |
EP2151876A1 (de) | 2008-08-05 | 2010-02-10 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Elektrische Transportkomponente, Herstellungsverfahren dafür sowie elektro-optische Vorrichtung und opto-elektrische Vorrichtung |
JP2010040897A (ja) * | 2008-08-07 | 2010-02-18 | Sony Corp | 有機薄膜トランジスタ、有機薄膜トランジスタの製造方法、および電子機器 |
JP5533050B2 (ja) * | 2009-04-23 | 2014-06-25 | セイコーエプソン株式会社 | 半導体装置の製造方法、半導体装置、アクティブマトリクス装置、電気光学装置および電子機器 |
US9099437B2 (en) * | 2011-03-08 | 2015-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP5891952B2 (ja) * | 2012-05-29 | 2016-03-23 | 株式会社ジャパンディスプレイ | 表示装置の製造方法 |
KR20140061030A (ko) | 2012-11-13 | 2014-05-21 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
KR20140064550A (ko) * | 2012-11-20 | 2014-05-28 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판의 제조 방법 |
TWI692546B (zh) * | 2013-11-21 | 2020-05-01 | 日商尼康股份有限公司 | 佈線圖案之製造方法及電晶體之製造方法 |
TW201525064A (zh) * | 2013-12-16 | 2015-07-01 | Daxin Materials Corp | 感光樹脂組成物、感光樹脂及有機發光二極體顯示元件 |
CN104795400B (zh) * | 2015-02-12 | 2018-10-30 | 合肥鑫晟光电科技有限公司 | 阵列基板制造方法、阵列基板和显示装置 |
CN106128963B (zh) * | 2016-09-23 | 2019-07-23 | 京东方科技集团股份有限公司 | 薄膜晶体管及制备方法、阵列基板及制备方法、显示面板 |
CN106876260B (zh) * | 2017-03-03 | 2020-03-27 | 惠科股份有限公司 | 一种闸电极结构及其制造方法和显示装置 |
CN107665896B (zh) * | 2017-10-27 | 2021-02-23 | 北京京东方显示技术有限公司 | 显示基板及其制作方法、显示面板和显示装置 |
US11114475B2 (en) * | 2017-11-22 | 2021-09-07 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | IPS thin-film transistor array substrate and manufacturing method thereof |
CN109873037A (zh) * | 2019-03-20 | 2019-06-11 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制备方法、显示装置 |
CN113540127B (zh) * | 2021-07-19 | 2023-09-19 | 合肥鑫晟光电科技有限公司 | 一种背板、显示面板、显示装置及其制备方法 |
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EP0383230B1 (de) * | 1989-02-14 | 1997-05-28 | Seiko Epson Corporation | Herstelllungsverfahren einer Halbleitervorrichtung |
JPH0651350A (ja) * | 1992-08-03 | 1994-02-25 | Alps Electric Co Ltd | 表示装置 |
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JPH0823102A (ja) * | 1994-07-08 | 1996-01-23 | Matsushita Electric Ind Co Ltd | 電子部品及びその製造方法 |
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JPH1146006A (ja) * | 1997-07-25 | 1999-02-16 | Canon Inc | 光起電力素子およびその製造方法 |
JPH11232335A (ja) | 1998-02-13 | 1999-08-27 | Nec Corp | 注文管理装置 |
JP3299167B2 (ja) | 1998-02-13 | 2002-07-08 | 日本板硝子株式会社 | 埋設電極付き基板の製造方法 |
JPH11339672A (ja) | 1998-05-29 | 1999-12-10 | Sony Corp | 画像表示装置の製造方法 |
US6501098B2 (en) * | 1998-11-25 | 2002-12-31 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device |
US6225238B1 (en) * | 1999-06-07 | 2001-05-01 | Allied Signal Inc | Low dielectric constant polyorganosilicon coatings generated from polycarbosilanes |
JP3272326B2 (ja) | 1999-06-14 | 2002-04-08 | 三協化学株式会社 | 2−ピリジルピリジン誘導体の製造方法 |
KR20010046141A (ko) * | 1999-11-10 | 2001-06-05 | 구본준 | 박막 트랜지스터 및 배선 제조방법 |
CN100459163C (zh) | 2001-02-19 | 2009-02-04 | 国际商业机器公司 | 薄膜晶体管结构及其制造方法和使用它的显示器件 |
US7045861B2 (en) * | 2002-03-26 | 2006-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, liquid-crystal display device and method for manufacturing same |
US6825517B2 (en) * | 2002-08-28 | 2004-11-30 | Cova Technologies, Inc. | Ferroelectric transistor with enhanced data retention |
TW200406829A (en) * | 2002-09-17 | 2004-05-01 | Adv Lcd Tech Dev Ct Co Ltd | Interconnect, interconnect forming method, thin film transistor, and display device |
US6887776B2 (en) * | 2003-04-11 | 2005-05-03 | Applied Materials, Inc. | Methods to form metal lines using selective electrochemical deposition |
-
2001
- 2001-12-18 CN CNB018227236A patent/CN100459163C/zh not_active Expired - Fee Related
- 2001-12-18 AT AT01273779T patent/ATE456863T1/de not_active IP Right Cessation
- 2001-12-18 KR KR1020037010725A patent/KR100650417B1/ko not_active IP Right Cessation
- 2001-12-18 EP EP01273779A patent/EP1369928B1/de not_active Expired - Lifetime
- 2001-12-18 JP JP2002566560A patent/JP4022470B2/ja not_active Expired - Fee Related
- 2001-12-18 WO PCT/JP2001/011110 patent/WO2002067335A1/ja active Application Filing
- 2001-12-18 US US10/468,431 patent/US6952036B2/en not_active Expired - Fee Related
- 2001-12-18 DE DE60141225T patent/DE60141225D1/de not_active Expired - Lifetime
-
2002
- 2002-02-07 TW TW091102189A patent/TW541705B/zh not_active IP Right Cessation
-
2005
- 2005-06-27 US US11/167,637 patent/US7326600B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7326600B2 (en) | 2008-02-05 |
JPWO2002067335A1 (ja) | 2004-06-24 |
TW541705B (en) | 2003-07-11 |
US20050250262A1 (en) | 2005-11-10 |
WO2002067335A1 (fr) | 2002-08-29 |
CN1489790A (zh) | 2004-04-14 |
JP4022470B2 (ja) | 2007-12-19 |
EP1369928A4 (de) | 2006-01-11 |
KR20030077621A (ko) | 2003-10-01 |
US6952036B2 (en) | 2005-10-04 |
US20040113161A1 (en) | 2004-06-17 |
EP1369928B1 (de) | 2010-01-27 |
KR100650417B1 (ko) | 2006-11-28 |
ATE456863T1 (de) | 2010-02-15 |
EP1369928A1 (de) | 2003-12-10 |
CN100459163C (zh) | 2009-02-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8364 | No opposition during term of opposition |