DE60140172D1 - Kontaktlose Transportvorrichtung - Google Patents

Kontaktlose Transportvorrichtung

Info

Publication number
DE60140172D1
DE60140172D1 DE60140172T DE60140172T DE60140172D1 DE 60140172 D1 DE60140172 D1 DE 60140172D1 DE 60140172 T DE60140172 T DE 60140172T DE 60140172 T DE60140172 T DE 60140172T DE 60140172 D1 DE60140172 D1 DE 60140172D1
Authority
DE
Germany
Prior art keywords
recess
inner peripheral
peripheral surface
transport device
transfer device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60140172T
Other languages
English (en)
Inventor
Hitoshi Iwasaka
Hideyuki Tokunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harmotec Corp
Original Assignee
Harmotec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001044173A external-priority patent/JP3981241B2/ja
Application filed by Harmotec Corp filed Critical Harmotec Corp
Application granted granted Critical
Publication of DE60140172D1 publication Critical patent/DE60140172D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Pinball Game Machines (AREA)
DE60140172T 2001-02-20 2001-07-12 Kontaktlose Transportvorrichtung Expired - Lifetime DE60140172D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001044173A JP3981241B2 (ja) 2000-06-09 2001-02-20 旋回流形成体および非接触搬送装置

Publications (1)

Publication Number Publication Date
DE60140172D1 true DE60140172D1 (de) 2009-11-26

Family

ID=18906206

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60140172T Expired - Lifetime DE60140172D1 (de) 2001-02-20 2001-07-12 Kontaktlose Transportvorrichtung

Country Status (4)

Country Link
KR (1) KR100630360B1 (de)
AT (1) ATE445909T1 (de)
DE (1) DE60140172D1 (de)
TW (1) TW500651B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100859835B1 (ko) * 2008-05-13 2008-09-23 한국뉴매틱(주) 비접촉식 진공패드
US8905680B2 (en) * 2011-10-31 2014-12-09 Masahiro Lee Ultrathin wafer transport systems
KR101258405B1 (ko) * 2012-01-19 2013-04-26 로체 시스템즈(주) 글라스 디스크 반송장치
KR101423822B1 (ko) * 2012-06-28 2014-07-28 세메스 주식회사 웨이퍼 이송을 위한 비접촉 척
TWI569355B (zh) * 2014-07-23 2017-02-01 Harmotec Co Ltd Control device and control method
KR102053435B1 (ko) * 2019-08-12 2019-12-06 주식회사 디에스이엔티 자동 반전용 인쇄회로기판 적재장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6353945A (ja) * 1986-08-25 1988-03-08 Hitachi Ltd 受け渡し装置
JPH0346250A (ja) * 1989-07-14 1991-02-27 Kawasaki Steel Corp ウエハ搬送装置
JPH04341438A (ja) * 1991-05-16 1992-11-27 Toshiba Corp 非接触ハンドリング装置
JPH0722175B2 (ja) * 1991-05-24 1995-03-08 九州電子金属株式会社 半導体基板の非接触搬送装置
EP0902966A1 (de) * 1996-05-31 1999-03-24 IPEC Precision, Inc. Berührungsloses haltewerkzeug für wafer änlichen artikeln
JP3725615B2 (ja) * 1996-06-21 2005-12-14 大日本スクリーン製造株式会社 基板処理装置
JP3445138B2 (ja) * 1998-03-06 2003-09-08 株式会社西部技研 無接触搬送装置
US6095582A (en) * 1998-03-11 2000-08-01 Trusi Technologies, Llc Article holders and holding methods

Also Published As

Publication number Publication date
KR100630360B1 (ko) 2006-09-29
ATE445909T1 (de) 2009-10-15
KR20020068245A (ko) 2002-08-27
TW500651B (en) 2002-09-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition