DE60134824D1 - Geschlitztes Substrat und dazugehöriges Herstellungsverfahren - Google Patents
Geschlitztes Substrat und dazugehöriges HerstellungsverfahrenInfo
- Publication number
- DE60134824D1 DE60134824D1 DE60134824T DE60134824T DE60134824D1 DE 60134824 D1 DE60134824 D1 DE 60134824D1 DE 60134824 T DE60134824 T DE 60134824T DE 60134824 T DE60134824 T DE 60134824T DE 60134824 D1 DE60134824 D1 DE 60134824D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- manufacturing process
- associated manufacturing
- slotted substrate
- fabricating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 abstract 2
- 239000010409 thin film Substances 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/34—Structure of thermal heads comprising semiconductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Liquid Crystal (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/730,263 US6675476B2 (en) | 2000-12-05 | 2000-12-05 | Slotted substrates and techniques for forming same |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60134824D1 true DE60134824D1 (de) | 2008-08-28 |
Family
ID=24934612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60134824T Expired - Lifetime DE60134824D1 (de) | 2000-12-05 | 2001-12-03 | Geschlitztes Substrat und dazugehöriges Herstellungsverfahren |
Country Status (8)
Country | Link |
---|---|
US (3) | US6675476B2 (de) |
EP (1) | EP1213147B1 (de) |
KR (1) | KR100838955B1 (de) |
CN (1) | CN1227112C (de) |
AT (1) | ATE401198T1 (de) |
DE (1) | DE60134824D1 (de) |
SG (1) | SG115428A1 (de) |
TW (1) | TW530007B (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4768097B2 (ja) * | 1999-09-30 | 2011-09-07 | 丸善製薬株式会社 | 活性酸素消去剤、血小板凝集抑制剤、皮膚化粧料および浴用剤 |
US7160806B2 (en) * | 2001-08-16 | 2007-01-09 | Hewlett-Packard Development Company, L.P. | Thermal inkjet printhead processing with silicon etching |
AU2002367376A1 (en) * | 2001-12-28 | 2003-07-24 | Jeffrey James Jonas | Real time data warehousing |
TW590897B (en) * | 2002-04-30 | 2004-06-11 | Ind Tech Res Inst | Method for manufacturing identification circuit of inkjet print-head chip |
US7023342B2 (en) | 2003-09-17 | 2006-04-04 | The United States Of America As Represented By The Secretary Of The Navy | Continuous wave (CW)—fixed multiple frequency triggered, radio frequency identification (RFID) tag and system and method employing same |
US7278706B2 (en) * | 2003-10-30 | 2007-10-09 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
US7052122B2 (en) * | 2004-02-19 | 2006-05-30 | Dimatix, Inc. | Printhead |
US7086291B2 (en) * | 2004-04-29 | 2006-08-08 | International Business Machines Corporation | Overstress indication |
JP4961711B2 (ja) * | 2005-03-22 | 2012-06-27 | コニカミノルタホールディングス株式会社 | インクジェットヘッド用貫通電極付き基板の製造方法及びインクジェットヘッドの製造方法 |
US8029119B2 (en) | 2005-03-31 | 2011-10-04 | Telecom Italia S.P.A. | Ink jet print head which prevents bubbles from collecting |
US7824560B2 (en) | 2006-03-07 | 2010-11-02 | Canon Kabushiki Kaisha | Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head |
EP2766509B1 (de) | 2011-10-14 | 2016-06-08 | Hewlett-Packard Development Company, L.P. | Widerstand |
WO2016068921A1 (en) | 2014-10-30 | 2016-05-06 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
JP7346148B2 (ja) * | 2018-09-28 | 2023-09-19 | キヤノン株式会社 | 液体吐出ヘッド |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE455103B (sv) | 1985-01-09 | 1988-06-20 | Lars Edgar Martin Ehrnford | Berare for immobilisering av biologiskt aktivt organiskt material, vilken utgores av sammanfogade partiklar av en poros sintrad glasfibermatris |
US4894664A (en) * | 1986-04-28 | 1990-01-16 | Hewlett-Packard Company | Monolithic thermal ink jet printhead with integral nozzle and ink feed |
US4937172A (en) * | 1986-12-02 | 1990-06-26 | E. I. Du Pont De Nemours And Company | Photopolymerizable composition having superior adhesion, articles and processes |
US4847630A (en) * | 1987-12-17 | 1989-07-11 | Hewlett-Packard Company | Integrated thermal ink jet printhead and method of manufacture |
IT1234800B (it) | 1989-06-08 | 1992-05-27 | C Olivetti & C Spa Sede Via Je | Procedimento di fabbricazione di testine termiche di stampa a getto d'inchiostro e testine cosi' ottenute |
US5201987A (en) * | 1990-06-04 | 1993-04-13 | Xerox Corporation | Fabricating method for silicon structures |
EP0477600A1 (de) * | 1990-09-26 | 1992-04-01 | Siemens Aktiengesellschaft | Verfahren zum Befestigen eines mit wenigstens einem Halbleiterbauelement versehenen Halbleiterkörpers auf einem Substrat |
US5146674A (en) * | 1991-07-01 | 1992-09-15 | International Business Machines Corporation | Manufacturing process of a high density substrate design |
US5306874A (en) * | 1991-07-12 | 1994-04-26 | W.I.T. Inc. | Electrical interconnect and method of its manufacture |
US5317346A (en) | 1992-03-04 | 1994-05-31 | Hewlett-Packard Company | Compound ink feed slot |
US5874974A (en) * | 1992-04-02 | 1999-02-23 | Hewlett-Packard Company | Reliable high performance drop generator for an inkjet printhead |
US5563642A (en) * | 1992-04-02 | 1996-10-08 | Hewlett-Packard Company | Inkjet printhead architecture for high speed ink firing chamber refill |
JP2960608B2 (ja) * | 1992-06-04 | 1999-10-12 | キヤノン株式会社 | 液体噴射記録ヘッドの製造方法 |
US5387314A (en) | 1993-01-25 | 1995-02-07 | Hewlett-Packard Company | Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining |
US5308442A (en) * | 1993-01-25 | 1994-05-03 | Hewlett-Packard Company | Anisotropically etched ink fill slots in silicon |
US5363553A (en) * | 1993-07-27 | 1994-11-15 | International Business Machines, Inc. | Method of drilling vias and through holes |
GB9400036D0 (en) * | 1994-01-04 | 1994-03-02 | Xaar Ltd | Manufacture of ink jet printheads |
US5635968A (en) * | 1994-04-29 | 1997-06-03 | Hewlett-Packard Company | Thermal inkjet printer printhead with offset heater resistors |
JP2718901B2 (ja) * | 1994-10-31 | 1998-02-25 | ローム株式会社 | 半導体装置の製造方法 |
US5658471A (en) | 1995-09-22 | 1997-08-19 | Lexmark International, Inc. | Fabrication of thermal ink-jet feed slots in a silicon substrate |
US5699613A (en) * | 1995-09-25 | 1997-12-23 | International Business Machines Corporation | Fine dimension stacked vias for a multiple layer circuit board structure |
US5911329A (en) * | 1996-04-30 | 1999-06-15 | Micron Technology, Inc. | Apparatus and method for facilitating circuit board processing |
US5665650A (en) * | 1996-05-30 | 1997-09-09 | International Business Machines Corporation | Method for manufacturing a high density electronic circuit assembly |
DE69730667T2 (de) | 1996-11-11 | 2005-09-22 | Canon K.K. | Verfahren zur Herstellung eines Durchgangslochs, Gebrauch dieses Verfahrens zur Herstellung eines Slikonsubstrates mit einem solchen Durchgangsloch oder eine Vorrichtung mit diesem Substrat, Verfahren zur Herstellung eines Tintenstrahl-Druckkopfes und Gebrauch dieses Verfahrens zur Herstellung eines Tintenstrahldruckkopfes |
WO1998022288A1 (fr) * | 1996-11-18 | 1998-05-28 | Seiko Epson Corporation | Tete d'ecriture a jet d'encre |
US6019907A (en) * | 1997-08-08 | 2000-02-01 | Hewlett-Packard Company | Forming refill for monolithic inkjet printhead |
US6388202B1 (en) * | 1997-10-06 | 2002-05-14 | Motorola, Inc. | Multi layer printed circuit board |
US6322201B1 (en) | 1997-10-22 | 2001-11-27 | Hewlett-Packard Company | Printhead with a fluid channel therethrough |
JPH11198387A (ja) | 1998-01-09 | 1999-07-27 | Canon Inc | インクジェット記録ヘッドの製造方法 |
US6273557B1 (en) | 1998-03-02 | 2001-08-14 | Hewlett-Packard Company | Micromachined ink feed channels for an inkjet printhead |
TW368479B (en) * | 1998-05-29 | 1999-09-01 | Ind Tech Res Inst | Manufacturing method for ink passageway |
ITTO980562A1 (it) | 1998-06-29 | 1999-12-29 | Olivetti Lexikon Spa | Testina di stampa a getto di inchiostro |
US6473966B1 (en) * | 1999-02-01 | 2002-11-05 | Casio Computer Co., Ltd. | Method of manufacturing ink-jet printer head |
DE19928777A1 (de) | 1999-06-23 | 2000-12-28 | Vacuumschmelze Gmbh | Gießrad über Schleudergießverfahren hergestelltes Gießrad |
US6297127B1 (en) * | 2000-06-22 | 2001-10-02 | International Business Machines Corporation | Self-aligned deep trench isolation to shallow trench isolation |
US6517735B2 (en) | 2001-03-15 | 2003-02-11 | Hewlett-Packard Company | Ink feed trench etch technique for a fully integrated thermal inkjet printhead |
US6818138B2 (en) | 2001-06-22 | 2004-11-16 | Hewlett-Packard Development Company, L.P. | Slotted substrate and slotting process |
US6627467B2 (en) | 2001-10-31 | 2003-09-30 | Hewlett-Packard Development Company, Lp. | Fluid ejection device fabrication |
US6554403B1 (en) | 2002-04-30 | 2003-04-29 | Hewlett-Packard Development Company, L.P. | Substrate for fluid ejection device |
US6540337B1 (en) * | 2002-07-26 | 2003-04-01 | Hewlett-Packard Company | Slotted substrates and methods and systems for forming same |
-
2000
- 2000-12-05 US US09/730,263 patent/US6675476B2/en not_active Expired - Lifetime
-
2001
- 2001-11-09 SG SG200106920A patent/SG115428A1/en unknown
- 2001-11-14 TW TW090128232A patent/TW530007B/zh not_active IP Right Cessation
- 2001-12-03 EP EP01310108A patent/EP1213147B1/de not_active Expired - Lifetime
- 2001-12-03 AT AT01310108T patent/ATE401198T1/de not_active IP Right Cessation
- 2001-12-03 DE DE60134824T patent/DE60134824D1/de not_active Expired - Lifetime
- 2001-12-04 KR KR1020010076057A patent/KR100838955B1/ko not_active IP Right Cessation
- 2001-12-05 CN CNB011435321A patent/CN1227112C/zh not_active Expired - Fee Related
-
2003
- 2003-08-01 US US10/633,098 patent/US6968617B2/en not_active Expired - Lifetime
-
2005
- 2005-09-22 US US11/233,321 patent/US20060016073A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US6968617B2 (en) | 2005-11-29 |
KR100838955B1 (ko) | 2008-06-16 |
TW530007B (en) | 2003-05-01 |
CN1357457A (zh) | 2002-07-10 |
EP1213147A1 (de) | 2002-06-12 |
US20040139608A1 (en) | 2004-07-22 |
US20020066182A1 (en) | 2002-06-06 |
CN1227112C (zh) | 2005-11-16 |
US20060016073A1 (en) | 2006-01-26 |
SG115428A1 (en) | 2005-10-28 |
US6675476B2 (en) | 2004-01-13 |
ATE401198T1 (de) | 2008-08-15 |
KR20020044075A (ko) | 2002-06-14 |
EP1213147B1 (de) | 2008-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, US |
|
8364 | No opposition during term of opposition |