ATE401198T1 - Geschlitztes substrat und dazugehöriges herstellungsverfahren - Google Patents

Geschlitztes substrat und dazugehöriges herstellungsverfahren

Info

Publication number
ATE401198T1
ATE401198T1 AT01310108T AT01310108T ATE401198T1 AT E401198 T1 ATE401198 T1 AT E401198T1 AT 01310108 T AT01310108 T AT 01310108T AT 01310108 T AT01310108 T AT 01310108T AT E401198 T1 ATE401198 T1 AT E401198T1
Authority
AT
Austria
Prior art keywords
substrate
production method
associated production
slotted substrate
fabricating
Prior art date
Application number
AT01310108T
Other languages
English (en)
Inventor
Timothy S Hostetler
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of ATE401198T1 publication Critical patent/ATE401198T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/34—Structure of thermal heads comprising semiconductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Liquid Crystal (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT01310108T 2000-12-05 2001-12-03 Geschlitztes substrat und dazugehöriges herstellungsverfahren ATE401198T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/730,263 US6675476B2 (en) 2000-12-05 2000-12-05 Slotted substrates and techniques for forming same

Publications (1)

Publication Number Publication Date
ATE401198T1 true ATE401198T1 (de) 2008-08-15

Family

ID=24934612

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01310108T ATE401198T1 (de) 2000-12-05 2001-12-03 Geschlitztes substrat und dazugehöriges herstellungsverfahren

Country Status (8)

Country Link
US (3) US6675476B2 (de)
EP (1) EP1213147B1 (de)
KR (1) KR100838955B1 (de)
CN (1) CN1227112C (de)
AT (1) ATE401198T1 (de)
DE (1) DE60134824D1 (de)
SG (1) SG115428A1 (de)
TW (1) TW530007B (de)

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JP4768097B2 (ja) * 1999-09-30 2011-09-07 丸善製薬株式会社 活性酸素消去剤、血小板凝集抑制剤、皮膚化粧料および浴用剤
US7160806B2 (en) * 2001-08-16 2007-01-09 Hewlett-Packard Development Company, L.P. Thermal inkjet printhead processing with silicon etching
US8452787B2 (en) * 2001-12-28 2013-05-28 International Business Machines Corporation Real time data warehousing
TW590897B (en) * 2002-04-30 2004-06-11 Ind Tech Res Inst Method for manufacturing identification circuit of inkjet print-head chip
US7023342B2 (en) * 2003-09-17 2006-04-04 The United States Of America As Represented By The Secretary Of The Navy Continuous wave (CW)—fixed multiple frequency triggered, radio frequency identification (RFID) tag and system and method employing same
US7278706B2 (en) * 2003-10-30 2007-10-09 Hewlett-Packard Development Company, L.P. Fluid ejection device
US7052122B2 (en) * 2004-02-19 2006-05-30 Dimatix, Inc. Printhead
US7086291B2 (en) * 2004-04-29 2006-08-08 International Business Machines Corporation Overstress indication
JP4961711B2 (ja) * 2005-03-22 2012-06-27 コニカミノルタホールディングス株式会社 インクジェットヘッド用貫通電極付き基板の製造方法及びインクジェットヘッドの製造方法
WO2006103485A1 (en) 2005-03-31 2006-10-05 Telecom Italia S.P.A. Ink jet print head which prevents bubbles from collecting
US7824560B2 (en) 2006-03-07 2010-11-02 Canon Kabushiki Kaisha Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head
WO2013055349A1 (en) 2011-10-14 2013-04-18 Hewlett-Packard Development Company, L.P. Resistor
CN107073962A (zh) 2014-10-30 2017-08-18 惠普发展公司，有限责任合伙企业 流体喷射设备
JP7346148B2 (ja) * 2018-09-28 2023-09-19 キヤノン株式会社 液体吐出ヘッド

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SE455103B (sv) 1985-01-09 1988-06-20 Lars Edgar Martin Ehrnford Berare for immobilisering av biologiskt aktivt organiskt material, vilken utgores av sammanfogade partiklar av en poros sintrad glasfibermatris
US4894664A (en) * 1986-04-28 1990-01-16 Hewlett-Packard Company Monolithic thermal ink jet printhead with integral nozzle and ink feed
US4937172A (en) * 1986-12-02 1990-06-26 E. I. Du Pont De Nemours And Company Photopolymerizable composition having superior adhesion, articles and processes
US4847630A (en) * 1987-12-17 1989-07-11 Hewlett-Packard Company Integrated thermal ink jet printhead and method of manufacture
IT1234800B (it) 1989-06-08 1992-05-27 C Olivetti & C Spa Sede Via Je Procedimento di fabbricazione di testine termiche di stampa a getto d'inchiostro e testine cosi' ottenute
US5201987A (en) * 1990-06-04 1993-04-13 Xerox Corporation Fabricating method for silicon structures
EP0477600A1 (de) * 1990-09-26 1992-04-01 Siemens Aktiengesellschaft Verfahren zum Befestigen eines mit wenigstens einem Halbleiterbauelement versehenen Halbleiterkörpers auf einem Substrat
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JP2960608B2 (ja) * 1992-06-04 1999-10-12 キヤノン株式会社 液体噴射記録ヘッドの製造方法
US5387314A (en) * 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
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Also Published As

Publication number Publication date
US20060016073A1 (en) 2006-01-26
DE60134824D1 (de) 2008-08-28
KR20020044075A (ko) 2002-06-14
CN1227112C (zh) 2005-11-16
SG115428A1 (en) 2005-10-28
KR100838955B1 (ko) 2008-06-16
US20040139608A1 (en) 2004-07-22
TW530007B (en) 2003-05-01
US20020066182A1 (en) 2002-06-06
EP1213147A1 (de) 2002-06-12
US6675476B2 (en) 2004-01-13
US6968617B2 (en) 2005-11-29
CN1357457A (zh) 2002-07-10
EP1213147B1 (de) 2008-07-16

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties