DE60133306D1 - Verfahren zum Abrichten eines Poliertuches - Google Patents
Verfahren zum Abrichten eines PoliertuchesInfo
- Publication number
- DE60133306D1 DE60133306D1 DE60133306T DE60133306T DE60133306D1 DE 60133306 D1 DE60133306 D1 DE 60133306D1 DE 60133306 T DE60133306 T DE 60133306T DE 60133306 T DE60133306 T DE 60133306T DE 60133306 D1 DE60133306 D1 DE 60133306D1
- Authority
- DE
- Germany
- Prior art keywords
- dressing
- polishing cloth
- polishing
- cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004744 fabric Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/003—Devices or means for dressing or conditioning abrasive surfaces using at least two conditioning tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000324290 | 2000-10-24 | ||
JP2000324290 | 2000-10-24 | ||
PCT/JP2001/000382 WO2002034467A1 (fr) | 2000-10-24 | 2001-01-22 | Polisseuse |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60133306D1 true DE60133306D1 (de) | 2008-04-30 |
DE60133306T2 DE60133306T2 (de) | 2009-03-05 |
Family
ID=18801848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60133306T Expired - Lifetime DE60133306T2 (de) | 2000-10-24 | 2001-01-22 | Verfahren zum Abrichten eines Poliertuches |
Country Status (6)
Country | Link |
---|---|
US (3) | US6939208B2 (de) |
EP (1) | EP1334802B1 (de) |
KR (1) | KR100666664B1 (de) |
DE (1) | DE60133306T2 (de) |
TW (1) | TW495416B (de) |
WO (1) | WO2002034467A1 (de) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW495416B (en) * | 2000-10-24 | 2002-07-21 | Ebara Corp | Polishing apparatus |
JP2004042213A (ja) * | 2002-07-12 | 2004-02-12 | Ebara Corp | 研磨装置、および研磨工具のドレッシング方法 |
JP2005268566A (ja) * | 2004-03-19 | 2005-09-29 | Ebara Corp | 化学機械研磨装置の基板把持機構のヘッド構造 |
US7348276B2 (en) * | 2005-03-30 | 2008-03-25 | Fujitsu, Limited | Fabrication process of semiconductor device and polishing method |
JP2007144564A (ja) * | 2005-11-28 | 2007-06-14 | Ebara Corp | 研磨装置 |
US20070135024A1 (en) * | 2005-12-08 | 2007-06-14 | Itsuki Kobata | Polishing pad and polishing apparatus |
US7846006B2 (en) * | 2006-06-30 | 2010-12-07 | Memc Electronic Materials, Inc. | Dressing a wafer polishing pad |
US7846007B2 (en) * | 2006-06-30 | 2010-12-07 | Memc Electronic Materials, Inc. | System and method for dressing a wafer polishing pad |
JP5390750B2 (ja) * | 2007-03-30 | 2014-01-15 | ラムバス・インコーポレーテッド | 研磨装置、および研磨パッド再生処理方法 |
JP5504901B2 (ja) * | 2010-01-13 | 2014-05-28 | 株式会社Sumco | 研磨パッドの形状修正方法 |
KR101120046B1 (ko) * | 2010-04-06 | 2012-03-22 | 새솔다이아몬드공업 주식회사 | 컨디셔너 교체형 연마장치 |
JP5898420B2 (ja) | 2011-06-08 | 2016-04-06 | 株式会社荏原製作所 | 研磨パッドのコンディショニング方法及び装置 |
US8920214B2 (en) * | 2011-07-12 | 2014-12-30 | Chien-Min Sung | Dual dressing system for CMP pads and associated methods |
TWI613037B (zh) * | 2011-07-19 | 2018-02-01 | 荏原製作所股份有限公司 | 硏磨方法 |
JP6202544B2 (ja) | 2012-08-27 | 2017-09-27 | アクティエボラゲット エレクトロラックス | ロボット位置決めシステム |
KR101689428B1 (ko) * | 2012-10-31 | 2016-12-23 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 장치 및 연마 방법 |
JP6034717B2 (ja) * | 2013-02-22 | 2016-11-30 | 株式会社荏原製作所 | ドレッサの研磨部材上の摺動距離分布の取得方法、ドレッサの研磨部材上の摺動ベクトル分布の取得方法、および研磨装置 |
JP5964262B2 (ja) * | 2013-02-25 | 2016-08-03 | 株式会社荏原製作所 | 研磨装置に使用される研磨部材のプロファイル調整方法、および研磨装置 |
US10448794B2 (en) | 2013-04-15 | 2019-10-22 | Aktiebolaget Electrolux | Robotic vacuum cleaner |
CN105101855A (zh) | 2013-04-15 | 2015-11-25 | 伊莱克斯公司 | 具有伸出的侧刷的机器人真空吸尘器 |
JP6121795B2 (ja) * | 2013-05-15 | 2017-04-26 | 株式会社荏原製作所 | ドレッシング装置、該ドレッシング装置を備えた研磨装置、および研磨方法 |
KR102137857B1 (ko) | 2013-12-19 | 2020-07-24 | 에이비 엘렉트로룩스 | 로봇 청소 장치 및 랜드마크 인식 방법 |
KR102116596B1 (ko) | 2013-12-19 | 2020-05-28 | 에이비 엘렉트로룩스 | 나선형 패턴으로 이동하는 사이드 브러시를 구비한 로봇 진공 청소기 |
KR102130190B1 (ko) | 2013-12-19 | 2020-07-03 | 에이비 엘렉트로룩스 | 로봇 청소 장치 |
WO2015090402A1 (en) | 2013-12-19 | 2015-06-25 | Aktiebolaget Electrolux | Robotic cleaning device with perimeter recording function |
EP3082541B1 (de) | 2013-12-19 | 2018-04-04 | Aktiebolaget Electrolux | Angepasste geschwindigkeitskontrolle der rotierenden seitenbürste |
KR102099495B1 (ko) | 2013-12-19 | 2020-04-09 | 에이비 엘렉트로룩스 | 로봇 청소 장치가 장애물에 올라가는 것의 감지 |
EP3084539B1 (de) | 2013-12-19 | 2019-02-20 | Aktiebolaget Electrolux | Priorisierung von reinigungsbereichen |
CN105848545B (zh) | 2013-12-20 | 2019-02-19 | 伊莱克斯公司 | 灰尘容器 |
KR20150075357A (ko) * | 2013-12-25 | 2015-07-03 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 세정 장치 및 기판 처리 장치 |
CN106415423B (zh) | 2014-07-10 | 2021-01-01 | 伊莱克斯公司 | 用于检测机器人清洁装置的测量误差的方法 |
CN106659345B (zh) | 2014-09-08 | 2019-09-03 | 伊莱克斯公司 | 机器人真空吸尘器 |
EP3190938A1 (de) | 2014-09-08 | 2017-07-19 | Aktiebolaget Electrolux | Robotischer staubsauger |
CN106998980B (zh) | 2014-12-10 | 2021-12-17 | 伊莱克斯公司 | 使用激光传感器检测地板类型 |
US10874271B2 (en) | 2014-12-12 | 2020-12-29 | Aktiebolaget Electrolux | Side brush and robotic cleaner |
KR102339531B1 (ko) | 2014-12-16 | 2021-12-16 | 에이비 엘렉트로룩스 | 로봇 청소 장치를 위한 경험-기반의 로드맵 |
US10678251B2 (en) | 2014-12-16 | 2020-06-09 | Aktiebolaget Electrolux | Cleaning method for a robotic cleaning device |
EP3282912B1 (de) | 2015-04-17 | 2020-06-10 | Aktiebolaget Electrolux | Reinigungsroboter und ein verfahren zur steuerung des reinigungsroboters |
WO2016196216A1 (en) | 2015-05-29 | 2016-12-08 | Sunedison Semiconductor Limited | Methods for processing semiconductor wafers having a polycrystalline finish |
CN107920709A (zh) | 2015-09-03 | 2018-04-17 | 伊莱克斯公司 | 机器人清洁设备*** |
JP7035300B2 (ja) | 2016-03-15 | 2022-03-15 | アクチエボラゲット エレクトロルックス | ロボット清掃デバイス、ロボット清掃デバイスにおける、断崖検出を遂行する方法、コンピュータプログラム、およびコンピュータプログラム製品 |
WO2017194102A1 (en) | 2016-05-11 | 2017-11-16 | Aktiebolaget Electrolux | Robotic cleaning device |
TWI616279B (zh) * | 2016-08-01 | 2018-03-01 | 中國砂輪企業股份有限公司 | Chemical mechanical polishing dresser and manufacturing method thereof |
JP6575463B2 (ja) * | 2016-08-24 | 2019-09-18 | 信越半導体株式会社 | ウェーハの研磨方法 |
EP3629869B1 (de) | 2017-06-02 | 2023-08-16 | Aktiebolaget Electrolux | Verfahren zum erkennen einer niveaudifferenz einer oberfläche vor einer roboterreinigungsvorrichtung |
KR20200058400A (ko) | 2017-09-26 | 2020-05-27 | 에이비 엘렉트로룩스 | 로봇 청소 장치의 이동 제어 |
KR102493011B1 (ko) * | 2018-01-30 | 2023-01-31 | 주식회사 케이씨텍 | 기판 처리 장치 |
US10967480B2 (en) * | 2018-10-29 | 2021-04-06 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and methods for chemical mechanical polishing |
JP7160725B2 (ja) * | 2019-03-06 | 2022-10-25 | 株式会社荏原製作所 | 基板処理装置 |
JP2022018685A (ja) * | 2020-07-16 | 2022-01-27 | 株式会社岡本工作機械製作所 | ドレッシング装置及び研磨装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5486131A (en) | 1994-01-04 | 1996-01-23 | Speedfam Corporation | Device for conditioning polishing pads |
JPH08281550A (ja) * | 1995-04-14 | 1996-10-29 | Sony Corp | 研磨装置及びその補正方法 |
JP3778594B2 (ja) * | 1995-07-18 | 2006-05-24 | 株式会社荏原製作所 | ドレッシング方法 |
US5875559A (en) * | 1995-10-27 | 1999-03-02 | Applied Materials, Inc. | Apparatus for measuring the profile of a polishing pad in a chemical mechanical polishing system |
JP3111892B2 (ja) * | 1996-03-19 | 2000-11-27 | ヤマハ株式会社 | 研磨装置 |
JPH09277157A (ja) | 1996-04-16 | 1997-10-28 | Nippon Steel Corp | 研磨布の目立て装置 |
JPH09314456A (ja) | 1996-05-29 | 1997-12-09 | Toshiba Mach Co Ltd | 研磨布ドレッシング方法及び研磨装置 |
KR100524510B1 (ko) | 1996-06-25 | 2006-01-12 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마포를드레싱하는방법과장치 |
JPH10180618A (ja) * | 1996-12-24 | 1998-07-07 | Nkk Corp | Cmp装置の研磨パッドの調整方法 |
JPH10202504A (ja) | 1997-01-27 | 1998-08-04 | Toshiba Mach Co Ltd | 研磨面のコンディショニング装置 |
US5990010A (en) * | 1997-04-08 | 1999-11-23 | Lsi Logic Corporation | Pre-conditioning polishing pads for chemical-mechanical polishing |
US5941761A (en) * | 1997-08-25 | 1999-08-24 | Lsi Logic Corporation | Shaping polishing pad to control material removal rate selectively |
US5999010A (en) | 1997-12-08 | 1999-12-07 | Simplex Solutions, Inc. | Method of measuring interconnect coupling capacitance in an IC chip |
US5941762A (en) | 1998-01-07 | 1999-08-24 | Ravkin; Michael A. | Method and apparatus for improved conditioning of polishing pads |
US6135868A (en) * | 1998-02-11 | 2000-10-24 | Applied Materials, Inc. | Groove cleaning device for chemical-mechanical polishing |
JP3615931B2 (ja) | 1998-03-26 | 2005-02-02 | 株式会社荏原製作所 | ポリッシング装置および該ポリッシング装置におけるコンディショニング方法 |
JP2000271854A (ja) | 1999-03-25 | 2000-10-03 | Hitachi Ltd | 加工方法及びその装置並びに半導体基板の加工方法 |
KR20010071353A (ko) * | 1999-04-01 | 2001-07-28 | 롤페스 요하네스 게라투스 알베르투스 | 2중 cmp 패드 조절기 |
JP2001038602A (ja) | 1999-07-26 | 2001-02-13 | Ebara Corp | ポリッシング装置 |
TW495416B (en) * | 2000-10-24 | 2002-07-21 | Ebara Corp | Polishing apparatus |
-
2001
- 2001-01-20 TW TW090101440A patent/TW495416B/zh not_active IP Right Cessation
- 2001-01-22 KR KR1020017003439A patent/KR100666664B1/ko active IP Right Grant
- 2001-01-22 US US09/787,121 patent/US6939208B2/en not_active Expired - Lifetime
- 2001-01-22 EP EP01901492A patent/EP1334802B1/de not_active Expired - Lifetime
- 2001-01-22 WO PCT/JP2001/000382 patent/WO2002034467A1/ja active IP Right Grant
- 2001-01-22 DE DE60133306T patent/DE60133306T2/de not_active Expired - Lifetime
-
2005
- 2005-04-25 US US11/113,084 patent/US7040968B2/en not_active Expired - Lifetime
-
2006
- 2006-03-23 US US11/386,888 patent/US7207864B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW495416B (en) | 2002-07-21 |
US7040968B2 (en) | 2006-05-09 |
KR20020070085A (ko) | 2002-09-05 |
US20060194521A1 (en) | 2006-08-31 |
US7207864B2 (en) | 2007-04-24 |
EP1334802A4 (de) | 2005-08-31 |
EP1334802B1 (de) | 2008-03-19 |
WO2002034467A1 (fr) | 2002-05-02 |
US6939208B2 (en) | 2005-09-06 |
US20020164932A1 (en) | 2002-11-07 |
EP1334802A1 (de) | 2003-08-13 |
US20050191949A1 (en) | 2005-09-01 |
DE60133306T2 (de) | 2009-03-05 |
KR100666664B1 (ko) | 2007-01-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60133306D1 (de) | Verfahren zum Abrichten eines Poliertuches | |
DE69810686D1 (de) | Verfahren zum Abrichten eines Polierkissens. | |
DE69907863D1 (de) | Verfahren zum Infiltrieren eines porösen Körpers | |
DE10196254T1 (de) | Verfahren zum Polieren von Halbleiterwafern unter Verwendung eines beidseitigen Polierers | |
DE60136041D1 (de) | Verfahren zum Abreiben eines Reifens | |
DE60024559D1 (de) | Verfahren und Gerät zum Polieren eines Werkstückes | |
DE69908624D1 (de) | Verfahren zum Abrasionspolieren | |
DE60138486D1 (de) | Verfahren zum nachweis von liganden | |
DE60106661D1 (de) | Verfahren zum Hartdrehen eines Werkstückes | |
DE60030790D1 (de) | Verfahren zum Schleifen eines Werkstücks mit welchem konstante Zeitspaltvolumen erzielt werden | |
DE60123156D1 (de) | Verfahren zur Polierflächenreinigung einer Poliermaschine | |
DE59901761D1 (de) | Verfahren zum konfigurieren eines konfigurierbaren hardware-blocks | |
DE60035905D1 (de) | Verfahren zum reinigen von oberflächen | |
DE69715321D1 (de) | Verfahren und Vorrichtung zum Abrichten eines Poliertuches | |
DE50211815D1 (de) | Verfahren zum Reinigen des Filters einer fahrbaren Bodenreinigungsmaschine | |
DE60020038D1 (de) | Verfahren zum Verarbeiten eines numerischen Bildes | |
DE60123311D1 (de) | Verfahren zum Herstellen einer Milch-Calcium-Zusammensetzung | |
DE60122720D1 (de) | Verfahren zur herstellung eines vliesstoffes zur polierung | |
DE60332926D1 (de) | Verfahren zum trocknen eines wabenförmigen körpers | |
DE60137126D1 (de) | Verfahren zum stricken eines halsteils einer strickware in einer flachstrickmaschine | |
DE60044618D1 (de) | Verfahren zum verbinden von strickwaren | |
DE60227313D1 (de) | Verfahren zum Bedrucken eines Empfangsmaterials | |
DE60220169D1 (de) | Verfahren zum Trocknen von Wäsche in einer Trocknungsvorrichtung | |
DE50011835D1 (de) | Verfahren zum Herstellen eines Garns | |
DE50115749D1 (de) | Maschine und Verfahren zum Verlegen eines Fahrdrahtes |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |