DE60133306D1 - Verfahren zum Abrichten eines Poliertuches - Google Patents

Verfahren zum Abrichten eines Poliertuches

Info

Publication number
DE60133306D1
DE60133306D1 DE60133306T DE60133306T DE60133306D1 DE 60133306 D1 DE60133306 D1 DE 60133306D1 DE 60133306 T DE60133306 T DE 60133306T DE 60133306 T DE60133306 T DE 60133306T DE 60133306 D1 DE60133306 D1 DE 60133306D1
Authority
DE
Germany
Prior art keywords
dressing
polishing cloth
polishing
cloth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60133306T
Other languages
English (en)
Other versions
DE60133306T2 (de
Inventor
Kenji Kamimura
Norio Kimura
Satoshi Okamura
Hideo Aizawa
Makoto Akagi
Katsuhiko Tokushige
Hisanori Matsuo
Manabu Tsujimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE60133306D1 publication Critical patent/DE60133306D1/de
Application granted granted Critical
Publication of DE60133306T2 publication Critical patent/DE60133306T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/003—Devices or means for dressing or conditioning abrasive surfaces using at least two conditioning tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE60133306T 2000-10-24 2001-01-22 Verfahren zum Abrichten eines Poliertuches Expired - Lifetime DE60133306T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000324290 2000-10-24
JP2000324290 2000-10-24
PCT/JP2001/000382 WO2002034467A1 (fr) 2000-10-24 2001-01-22 Polisseuse

Publications (2)

Publication Number Publication Date
DE60133306D1 true DE60133306D1 (de) 2008-04-30
DE60133306T2 DE60133306T2 (de) 2009-03-05

Family

ID=18801848

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60133306T Expired - Lifetime DE60133306T2 (de) 2000-10-24 2001-01-22 Verfahren zum Abrichten eines Poliertuches

Country Status (6)

Country Link
US (3) US6939208B2 (de)
EP (1) EP1334802B1 (de)
KR (1) KR100666664B1 (de)
DE (1) DE60133306T2 (de)
TW (1) TW495416B (de)
WO (1) WO2002034467A1 (de)

Families Citing this family (50)

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JP2004042213A (ja) * 2002-07-12 2004-02-12 Ebara Corp 研磨装置、および研磨工具のドレッシング方法
JP2005268566A (ja) * 2004-03-19 2005-09-29 Ebara Corp 化学機械研磨装置の基板把持機構のヘッド構造
US7348276B2 (en) * 2005-03-30 2008-03-25 Fujitsu, Limited Fabrication process of semiconductor device and polishing method
JP2007144564A (ja) * 2005-11-28 2007-06-14 Ebara Corp 研磨装置
US20070135024A1 (en) * 2005-12-08 2007-06-14 Itsuki Kobata Polishing pad and polishing apparatus
US7846006B2 (en) * 2006-06-30 2010-12-07 Memc Electronic Materials, Inc. Dressing a wafer polishing pad
US7846007B2 (en) * 2006-06-30 2010-12-07 Memc Electronic Materials, Inc. System and method for dressing a wafer polishing pad
JP5390750B2 (ja) * 2007-03-30 2014-01-15 ラムバス・インコーポレーテッド 研磨装置、および研磨パッド再生処理方法
JP5504901B2 (ja) * 2010-01-13 2014-05-28 株式会社Ｓｕｍｃｏ 研磨パッドの形状修正方法
KR101120046B1 (ko) * 2010-04-06 2012-03-22 새솔다이아몬드공업 주식회사 컨디셔너 교체형 연마장치
JP5898420B2 (ja) 2011-06-08 2016-04-06 株式会社荏原製作所 研磨パッドのコンディショニング方法及び装置
US8920214B2 (en) * 2011-07-12 2014-12-30 Chien-Min Sung Dual dressing system for CMP pads and associated methods
TWI613037B (zh) * 2011-07-19 2018-02-01 荏原製作所股份有限公司 硏磨方法
JP6202544B2 (ja) 2012-08-27 2017-09-27 アクティエボラゲット エレクトロラックス ロボット位置決めシステム
KR101689428B1 (ko) * 2012-10-31 2016-12-23 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
JP6034717B2 (ja) * 2013-02-22 2016-11-30 株式会社荏原製作所 ドレッサの研磨部材上の摺動距離分布の取得方法、ドレッサの研磨部材上の摺動ベクトル分布の取得方法、および研磨装置
JP5964262B2 (ja) * 2013-02-25 2016-08-03 株式会社荏原製作所 研磨装置に使用される研磨部材のプロファイル調整方法、および研磨装置
US10448794B2 (en) 2013-04-15 2019-10-22 Aktiebolaget Electrolux Robotic vacuum cleaner
CN105101855A (zh) 2013-04-15 2015-11-25 伊莱克斯公司 具有伸出的侧刷的机器人真空吸尘器
JP6121795B2 (ja) * 2013-05-15 2017-04-26 株式会社荏原製作所 ドレッシング装置、該ドレッシング装置を備えた研磨装置、および研磨方法
KR102137857B1 (ko) 2013-12-19 2020-07-24 에이비 엘렉트로룩스 로봇 청소 장치 및 랜드마크 인식 방법
KR102116596B1 (ko) 2013-12-19 2020-05-28 에이비 엘렉트로룩스 나선형 패턴으로 이동하는 사이드 브러시를 구비한 로봇 진공 청소기
KR102130190B1 (ko) 2013-12-19 2020-07-03 에이비 엘렉트로룩스 로봇 청소 장치
WO2015090402A1 (en) 2013-12-19 2015-06-25 Aktiebolaget Electrolux Robotic cleaning device with perimeter recording function
EP3082541B1 (de) 2013-12-19 2018-04-04 Aktiebolaget Electrolux Angepasste geschwindigkeitskontrolle der rotierenden seitenbürste
KR102099495B1 (ko) 2013-12-19 2020-04-09 에이비 엘렉트로룩스 로봇 청소 장치가 장애물에 올라가는 것의 감지
EP3084539B1 (de) 2013-12-19 2019-02-20 Aktiebolaget Electrolux Priorisierung von reinigungsbereichen
CN105848545B (zh) 2013-12-20 2019-02-19 伊莱克斯公司 灰尘容器
KR20150075357A (ko) * 2013-12-25 2015-07-03 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 처리 장치
CN106415423B (zh) 2014-07-10 2021-01-01 伊莱克斯公司 用于检测机器人清洁装置的测量误差的方法
CN106659345B (zh) 2014-09-08 2019-09-03 伊莱克斯公司 机器人真空吸尘器
EP3190938A1 (de) 2014-09-08 2017-07-19 Aktiebolaget Electrolux Robotischer staubsauger
CN106998980B (zh) 2014-12-10 2021-12-17 伊莱克斯公司 使用激光传感器检测地板类型
US10874271B2 (en) 2014-12-12 2020-12-29 Aktiebolaget Electrolux Side brush and robotic cleaner
KR102339531B1 (ko) 2014-12-16 2021-12-16 에이비 엘렉트로룩스 로봇 청소 장치를 위한 경험-기반의 로드맵
US10678251B2 (en) 2014-12-16 2020-06-09 Aktiebolaget Electrolux Cleaning method for a robotic cleaning device
EP3282912B1 (de) 2015-04-17 2020-06-10 Aktiebolaget Electrolux Reinigungsroboter und ein verfahren zur steuerung des reinigungsroboters
WO2016196216A1 (en) 2015-05-29 2016-12-08 Sunedison Semiconductor Limited Methods for processing semiconductor wafers having a polycrystalline finish
CN107920709A (zh) 2015-09-03 2018-04-17 伊莱克斯公司 机器人清洁设备***
JP7035300B2 (ja) 2016-03-15 2022-03-15 アクチエボラゲット エレクトロルックス ロボット清掃デバイス、ロボット清掃デバイスにおける、断崖検出を遂行する方法、コンピュータプログラム、およびコンピュータプログラム製品
WO2017194102A1 (en) 2016-05-11 2017-11-16 Aktiebolaget Electrolux Robotic cleaning device
TWI616279B (zh) * 2016-08-01 2018-03-01 中國砂輪企業股份有限公司 Chemical mechanical polishing dresser and manufacturing method thereof
JP6575463B2 (ja) * 2016-08-24 2019-09-18 信越半導体株式会社 ウェーハの研磨方法
EP3629869B1 (de) 2017-06-02 2023-08-16 Aktiebolaget Electrolux Verfahren zum erkennen einer niveaudifferenz einer oberfläche vor einer roboterreinigungsvorrichtung
KR20200058400A (ko) 2017-09-26 2020-05-27 에이비 엘렉트로룩스 로봇 청소 장치의 이동 제어
KR102493011B1 (ko) * 2018-01-30 2023-01-31 주식회사 케이씨텍 기판 처리 장치
US10967480B2 (en) * 2018-10-29 2021-04-06 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing
JP7160725B2 (ja) * 2019-03-06 2022-10-25 株式会社荏原製作所 基板処理装置
JP2022018685A (ja) * 2020-07-16 2022-01-27 株式会社岡本工作機械製作所 ドレッシング装置及び研磨装置

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JPH08281550A (ja) * 1995-04-14 1996-10-29 Sony Corp 研磨装置及びその補正方法
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KR20010071353A (ko) * 1999-04-01 2001-07-28 롤페스 요하네스 게라투스 알베르투스 2중 ｃｍｐ 패드 조절기
JP2001038602A (ja) 1999-07-26 2001-02-13 Ebara Corp ポリッシング装置
TW495416B (en) * 2000-10-24 2002-07-21 Ebara Corp Polishing apparatus

Also Published As

Publication number Publication date
TW495416B (en) 2002-07-21
US7040968B2 (en) 2006-05-09
KR20020070085A (ko) 2002-09-05
US20060194521A1 (en) 2006-08-31
US7207864B2 (en) 2007-04-24
EP1334802A4 (de) 2005-08-31
EP1334802B1 (de) 2008-03-19
WO2002034467A1 (fr) 2002-05-02
US6939208B2 (en) 2005-09-06
US20020164932A1 (en) 2002-11-07
EP1334802A1 (de) 2003-08-13
US20050191949A1 (en) 2005-09-01
DE60133306T2 (de) 2009-03-05
KR100666664B1 (ko) 2007-01-09

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