DE60128537D1 - Zusammenbau zur verbindung von mindestens zwei gedruckten schaltungen - Google Patents

Zusammenbau zur verbindung von mindestens zwei gedruckten schaltungen

Info

Publication number
DE60128537D1
DE60128537D1 DE60128537T DE60128537T DE60128537D1 DE 60128537 D1 DE60128537 D1 DE 60128537D1 DE 60128537 T DE60128537 T DE 60128537T DE 60128537 T DE60128537 T DE 60128537T DE 60128537 D1 DE60128537 D1 DE 60128537D1
Authority
DE
Germany
Prior art keywords
connect
assembly
printed circuits
printed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60128537T
Other languages
English (en)
Other versions
DE60128537T2 (de
Inventor
Johannes F Reniers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE60128537D1 publication Critical patent/DE60128537D1/de
Publication of DE60128537T2 publication Critical patent/DE60128537T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)
DE60128537T 2000-07-31 2001-07-13 Zusammenbau zur verbindung von mindestens zwei gedruckten schaltungen Expired - Fee Related DE60128537T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP00202702 2000-07-31
EP00202702 2000-07-31
PCT/EP2001/008119 WO2002011245A1 (en) 2000-07-31 2001-07-13 System comprising at least two printed circuit boards

Publications (2)

Publication Number Publication Date
DE60128537D1 true DE60128537D1 (de) 2007-07-05
DE60128537T2 DE60128537T2 (de) 2008-01-31

Family

ID=8171868

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60128537T Expired - Fee Related DE60128537T2 (de) 2000-07-31 2001-07-13 Zusammenbau zur verbindung von mindestens zwei gedruckten schaltungen

Country Status (6)

Country Link
US (1) US6661674B2 (de)
EP (1) EP1238445B1 (de)
JP (1) JP2004505471A (de)
CN (1) CN1214492C (de)
DE (1) DE60128537T2 (de)
WO (1) WO2002011245A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10251615A1 (de) * 2002-11-06 2004-05-19 Valeo Schalter Und Sensoren Gmbh Steckerelement und Platinenaufbau
JP2009135194A (ja) * 2007-11-29 2009-06-18 Toshiba Corp プリント基板システム及びプリント基板の接続方法
CN102143655B (zh) * 2010-12-24 2014-09-17 华为技术有限公司 电源模块及网络设备
DE102011085924A1 (de) * 2011-11-08 2013-05-08 Robert Bosch Gmbh Elektrisches Steuergerät für ein Kraftfahrzeug
KR20130097481A (ko) * 2012-02-24 2013-09-03 삼성전자주식회사 인쇄회로기판(ｐｃｂ) 및 그 ｐｃｂ를 포함한 메모리 모듈
USD733145S1 (en) * 2014-03-14 2015-06-30 Kingston Digital, Inc. Memory module
WO2015177060A1 (en) * 2014-05-22 2015-11-26 Koninklijke Philips N.V. Printed circuit board arrangement and method for mounting a product to a main printed circuit board
CN104109935A (zh) * 2014-06-16 2014-10-22 福建睿能科技股份有限公司 一种横机的机头箱***
USD735201S1 (en) * 2014-07-30 2015-07-28 Kingston Digital, Inc. Memory module
CN106704993A (zh) * 2017-01-09 2017-05-24 宁波亚茂光电股份有限公司 一种插卡式电源与光源板的连接结构
WO2019006344A1 (en) * 2017-06-30 2019-01-03 Lutron Electronics Co., Inc. CIRCUIT BOARD SOLDER JOINTS PRINTED
CN109388195A (zh) * 2017-08-03 2019-02-26 华硕电脑股份有限公司 电脑***及其主板
KR102088323B1 (ko) * 2017-11-23 2020-03-12 주식회사 유라코퍼레이션 인쇄회로기판의 결합구조

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3105869A (en) * 1962-03-23 1963-10-01 Hughes Aircraft Co Electrical connection of microminiature circuit wafers
US3934334A (en) * 1974-04-15 1976-01-27 Texas Instruments Incorporated Method of fabricating metal printed wiring boards
US4074419A (en) * 1976-03-16 1978-02-21 Texas Instruments Incorporated Printed wiring board with angled portion and its method of manufacture
US4109298A (en) * 1976-07-26 1978-08-22 Texas Instruments Incorporated Connector with printed wiring board structure
JPS59121993A (ja) * 1982-12-28 1984-07-14 富士通株式会社 半導体パツケ−ジの実装方法
US4586764A (en) * 1985-01-07 1986-05-06 Motorola, Inc. Electrical subassembly structure
JPS62229896A (ja) * 1986-03-29 1987-10-08 株式会社東芝 印刷配線基板
FI82169C (fi) * 1987-08-21 1991-01-10 Nokia Mobira Oy Rf-skyddad hybridkrets.
JPH01270390A (ja) * 1988-04-22 1989-10-27 Seiko Epson Corp 電子部品の印刷回路基板への取付け方法
FR2693340B1 (fr) * 1992-07-03 1994-10-07 Jaeger Ensemble électrique comprenant au moins deux circuits imprimés.
KR940022803A (ko) * 1993-03-05 1994-10-21 김광호 반도체 패키지 및 그 실장에 적합한 인쇄회로기판
JPH08279670A (ja) * 1995-04-07 1996-10-22 Hitachi Ltd 電子部品の表面実装構造
US5907475A (en) * 1996-04-16 1999-05-25 Allen-Bradley Company, Llc Circuit board system having a mounted board and a plurality of mounting boards
US6042423A (en) * 1997-02-27 2000-03-28 The Whitaker Corporation Alignment adapters for post header
US6191954B1 (en) * 1998-11-16 2001-02-20 International Business Machines Corporation Controlled low impedance high current circuit board interconnect

Also Published As

Publication number Publication date
WO2002011245A1 (en) 2002-02-07
CN1214492C (zh) 2005-08-10
DE60128537T2 (de) 2008-01-31
EP1238445B1 (de) 2007-05-23
US20020015290A1 (en) 2002-02-07
EP1238445A1 (de) 2002-09-11
CN1386313A (zh) 2002-12-18
US6661674B2 (en) 2003-12-09
JP2004505471A (ja) 2004-02-19

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee