DE60119039D1 - Halbleitervorrichtung, Stromwandler und Fahrzeug - Google Patents

Halbleitervorrichtung, Stromwandler und Fahrzeug

Info

Publication number
DE60119039D1
DE60119039D1 DE60119039T DE60119039T DE60119039D1 DE 60119039 D1 DE60119039 D1 DE 60119039D1 DE 60119039 T DE60119039 T DE 60119039T DE 60119039 T DE60119039 T DE 60119039T DE 60119039 D1 DE60119039 D1 DE 60119039D1
Authority
DE
Germany
Prior art keywords
vehicle
semiconductor device
current transformer
transformer
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60119039T
Other languages
English (en)
Other versions
DE60119039T2 (de
Inventor
Shinji Shirakawa
Akira Mishima
Hideshi Fukumoto
Keiichi Mashino
Toshiyuki Innami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE60119039D1 publication Critical patent/DE60119039D1/de
Application granted granted Critical
Publication of DE60119039T2 publication Critical patent/DE60119039T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
  • Rectifiers (AREA)
DE60119039T 2000-07-21 2001-02-27 Halbleitervorrichtung, Stromwandler und Fahrzeug Expired - Lifetime DE60119039T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000226192 2000-07-21
JP2000226192A JP3642012B2 (ja) 2000-07-21 2000-07-21 半導体装置，電力変換装置及び自動車

Publications (2)

Publication Number Publication Date
DE60119039D1 true DE60119039D1 (de) 2006-06-01
DE60119039T2 DE60119039T2 (de) 2006-10-05

Family

ID=18719851

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60119039T Expired - Lifetime DE60119039T2 (de) 2000-07-21 2001-02-27 Halbleitervorrichtung, Stromwandler und Fahrzeug

Country Status (4)

Country Link
US (2) US6493249B2 (de)
EP (1) EP1174992B1 (de)
JP (1) JP3642012B2 (de)
DE (1) DE60119039T2 (de)

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JP3642012B2 (ja) * 2000-07-21 2005-04-27 株式会社日立製作所 半導体装置，電力変換装置及び自動車
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US6865080B2 (en) * 2002-01-16 2005-03-08 Rockwell Automation Technologies, Inc. Compact fluid cooled power converter supporting multiple circuit boards
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Also Published As

Publication number Publication date
US6791854B2 (en) 2004-09-14
EP1174992A3 (de) 2002-10-16
EP1174992A2 (de) 2002-01-23
EP1174992B1 (de) 2006-04-26
US20030031038A1 (en) 2003-02-13
US6493249B2 (en) 2002-12-10
DE60119039T2 (de) 2006-10-05
JP2002044964A (ja) 2002-02-08
US20020011363A1 (en) 2002-01-31
JP3642012B2 (ja) 2005-04-27

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