DE60045574D1 - Plasmabehandlungsvorrichtung mit innenelktrode und plasmabehandlungsverfahren - Google Patents
Plasmabehandlungsvorrichtung mit innenelktrode und plasmabehandlungsverfahrenInfo
- Publication number
- DE60045574D1 DE60045574D1 DE60045574T DE60045574T DE60045574D1 DE 60045574 D1 DE60045574 D1 DE 60045574D1 DE 60045574 T DE60045574 T DE 60045574T DE 60045574 T DE60045574 T DE 60045574T DE 60045574 D1 DE60045574 D1 DE 60045574D1
- Authority
- DE
- Germany
- Prior art keywords
- plasma treatment
- internal electrode
- treatment device
- treatment method
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25521999 | 1999-09-09 | ||
JP2000056584 | 2000-03-02 | ||
PCT/JP2000/006189 WO2001019144A1 (fr) | 1999-09-09 | 2000-09-11 | Dispositif de traitement au plasma a electrode interieure et procede associe |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60045574D1 true DE60045574D1 (de) | 2011-03-10 |
Family
ID=26542088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60045574T Expired - Lifetime DE60045574D1 (de) | 1999-09-09 | 2000-09-11 | Plasmabehandlungsvorrichtung mit innenelktrode und plasmabehandlungsverfahren |
Country Status (7)
Country | Link |
---|---|
US (2) | US6719876B1 (de) |
EP (1) | EP1130948B1 (de) |
JP (1) | JP4029615B2 (de) |
KR (1) | KR100732148B1 (de) |
DE (1) | DE60045574D1 (de) |
TW (1) | TW574412B (de) |
WO (1) | WO2001019144A1 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4509337B2 (ja) * | 2000-09-04 | 2010-07-21 | 株式会社Ihi | 薄膜形成方法及び薄膜形成装置 |
EP1293588B1 (de) * | 2000-05-17 | 2009-12-16 | IHI Corporation | Plasma-cvd-vorrichtung und verfahren |
JP4770029B2 (ja) * | 2001-01-22 | 2011-09-07 | 株式会社Ihi | プラズマcvd装置及び太陽電池の製造方法 |
US7096819B2 (en) | 2001-03-30 | 2006-08-29 | Lam Research Corporation | Inductive plasma processor having coil with plural windings and method of controlling plasma density |
JP4605940B2 (ja) * | 2001-06-15 | 2011-01-05 | 三菱電機株式会社 | プラズマエッチング装置、プラズマエッチング方法および半導体装置の製造方法 |
JP5017762B2 (ja) * | 2001-09-27 | 2012-09-05 | 株式会社Ihi | 放電装置、プラズマ処理方法 |
WO2003079740A1 (fr) * | 2002-03-18 | 2003-09-25 | Tokyo Electron Limited | Dispositif mettant en application le plasma |
JP2004055600A (ja) * | 2002-07-16 | 2004-02-19 | Tokyo Electron Ltd | プラズマ処理装置 |
JP4120546B2 (ja) * | 2002-10-04 | 2008-07-16 | 株式会社Ihi | 薄膜形成方法及び装置並びに太陽電池の製造方法及び装置並びに太陽電池 |
US8974630B2 (en) * | 2003-05-07 | 2015-03-10 | Sungkyunkwan University | Inductively coupled plasma processing apparatus having internal linear antenna for large area processing |
US20050067934A1 (en) * | 2003-09-26 | 2005-03-31 | Ishikawajima-Harima Heavy Industries Co., Ltd. | Discharge apparatus, plasma processing method and solar cell |
PL1550656T3 (pl) * | 2003-12-01 | 2009-09-30 | Oreal | Skondensowane pochodne 4-5-diamino-N,N-dihydro-pirazol-3-onu do zastosowania w kompozycji do farbowania włókien keratynowych |
JP4951501B2 (ja) * | 2005-03-01 | 2012-06-13 | 株式会社日立国際電気 | 基板処理装置および半導体デバイスの製造方法 |
KR100735868B1 (ko) * | 2005-08-04 | 2007-07-06 | 주식회사 누리테크 | 패럴린 코팅 전처리용 플라즈마 발생장치 |
JP2007123008A (ja) * | 2005-10-27 | 2007-05-17 | Nissin Electric Co Ltd | プラズマ生成方法及び装置並びにプラズマ処理装置 |
EP1918967B1 (de) * | 2006-11-02 | 2013-12-25 | Dow Corning Corporation | Verfahren zur Herstellung einer Schicht durch Abscheidung aus einem Plasma |
US7845310B2 (en) * | 2006-12-06 | 2010-12-07 | Axcelis Technologies, Inc. | Wide area radio frequency plasma apparatus for processing multiple substrates |
JP5329796B2 (ja) * | 2007-11-14 | 2013-10-30 | 株式会社イー・エム・ディー | プラズマ処理装置 |
US20090169341A1 (en) * | 2008-01-01 | 2009-07-02 | Dongguan Anwell Digital Machinery Ltd. | Method and system for handling objects in chambers |
JP2009209447A (ja) * | 2008-02-04 | 2009-09-17 | Hitachi Kokusai Electric Inc | 基板処理装置 |
TWI407573B (zh) * | 2008-06-06 | 2013-09-01 | Ulvac Inc | 薄膜太陽能電池製造裝置 |
WO2009148117A1 (ja) * | 2008-06-06 | 2009-12-10 | 株式会社アルバック | 薄膜太陽電池製造装置 |
CN107359103A (zh) * | 2009-10-28 | 2017-11-17 | 应用材料公司 | 用于等离子体增强化学气相沉积的腔室 |
TWI432100B (zh) * | 2009-11-25 | 2014-03-21 | Ind Tech Res Inst | 電漿產生裝置 |
KR20120120181A (ko) | 2010-03-03 | 2012-11-01 | 미쯔이 죠센 가부시키가이샤 | 박막 형성 장치 |
JP2013044044A (ja) * | 2011-08-26 | 2013-03-04 | Ihi Corp | アレイアンテナ式のcvdプラズマ装置 |
GB2489761B (en) * | 2011-09-07 | 2015-03-04 | Europlasma Nv | Surface coatings |
JP6010981B2 (ja) * | 2012-04-03 | 2016-10-19 | 株式会社Ihi | プラズマ処理装置 |
JP5817646B2 (ja) * | 2012-05-29 | 2015-11-18 | 株式会社島津製作所 | サンプルホルダ |
JP2014109060A (ja) * | 2012-12-03 | 2014-06-12 | Ihi Corp | アレイアンテナ式のcvdプラズマ装置 |
JP2015074792A (ja) * | 2013-10-07 | 2015-04-20 | 株式会社Screenホールディングス | プラズマcvd装置 |
US20210183619A1 (en) * | 2018-07-26 | 2021-06-17 | Lam Research Corporation | Compact high density plasma source |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69032952T2 (de) * | 1989-11-15 | 1999-09-30 | Kokusai Electric Co Ltd | Trocken-Behandlungsvorrichtung |
NL9000809A (nl) * | 1990-04-06 | 1991-11-01 | Philips Nv | Plasmagenerator. |
JP2785442B2 (ja) | 1990-05-15 | 1998-08-13 | 三菱重工業株式会社 | プラズマcvd装置 |
JP2989279B2 (ja) | 1991-01-21 | 1999-12-13 | 三菱重工業株式会社 | プラズマcvd装置 |
US5801915A (en) * | 1994-01-31 | 1998-09-01 | Applied Materials, Inc. | Electrostatic chuck having a unidirectionally conducting coupler layer |
US5558718A (en) * | 1994-04-08 | 1996-09-24 | The Regents, University Of California | Pulsed source ion implantation apparatus and method |
JPH08299785A (ja) * | 1995-05-10 | 1996-11-19 | Mitsubishi Heavy Ind Ltd | 放電反応装置 |
JP3208079B2 (ja) | 1996-02-27 | 2001-09-10 | 松下電器産業株式会社 | 高周波電力印加装置及びプラズマ処理装置 |
JPH11246971A (ja) * | 1998-03-03 | 1999-09-14 | Canon Inc | 微結晶シリコン系薄膜の作製方法及び作製装置 |
JP3068604B2 (ja) * | 1998-04-08 | 2000-07-24 | 三菱重工業株式会社 | プラズマcvd装置 |
JP3697110B2 (ja) | 1998-05-29 | 2005-09-21 | 三菱重工業株式会社 | プラズマ化学蒸着装置 |
JP2000235953A (ja) * | 1999-02-15 | 2000-08-29 | Canon Inc | プラズマ処理による堆積膜形成装置 |
JP4770029B2 (ja) * | 2001-01-22 | 2011-09-07 | 株式会社Ihi | プラズマcvd装置及び太陽電池の製造方法 |
-
2000
- 2000-09-11 JP JP2001522205A patent/JP4029615B2/ja not_active Expired - Lifetime
- 2000-09-11 US US09/830,879 patent/US6719876B1/en not_active Expired - Lifetime
- 2000-09-11 KR KR1020017005587A patent/KR100732148B1/ko active IP Right Grant
- 2000-09-11 TW TW89118617A patent/TW574412B/zh not_active IP Right Cessation
- 2000-09-11 DE DE60045574T patent/DE60045574D1/de not_active Expired - Lifetime
- 2000-09-11 WO PCT/JP2000/006189 patent/WO2001019144A1/ja active Application Filing
- 2000-09-11 EP EP00957087A patent/EP1130948B1/de not_active Expired - Lifetime
-
2003
- 2003-03-26 US US10/396,381 patent/US20030183169A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1130948A4 (de) | 2007-03-07 |
KR20020004935A (ko) | 2002-01-16 |
JP4029615B2 (ja) | 2008-01-09 |
EP1130948B1 (de) | 2011-01-26 |
WO2001019144A1 (fr) | 2001-03-15 |
US6719876B1 (en) | 2004-04-13 |
TW574412B (en) | 2004-02-01 |
US20030183169A1 (en) | 2003-10-02 |
KR100732148B1 (ko) | 2007-06-25 |
EP1130948A1 (de) | 2001-09-05 |
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