DE60030619D1 - Schutzvorrichtung - Google Patents

Schutzvorrichtung

Info

Publication number
DE60030619D1
DE60030619D1 DE60030619T DE60030619T DE60030619D1 DE 60030619 D1 DE60030619 D1 DE 60030619D1 DE 60030619 T DE60030619 T DE 60030619T DE 60030619 T DE60030619 T DE 60030619T DE 60030619 D1 DE60030619 D1 DE 60030619D1
Authority
DE
Germany
Prior art keywords
guard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60030619T
Other languages
English (en)
Other versions
DE60030619T2 (de
Inventor
Masami Kawazu
Norikazu Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of DE60030619D1 publication Critical patent/DE60030619D1/de
Application granted granted Critical
Publication of DE60030619T2 publication Critical patent/DE60030619T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H85/463—Circuit arrangements not adapted to a particular application of the protective device with printed circuit fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/06—Fusible members characterised by the fusible material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49107—Fuse making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fuses (AREA)
DE60030619T 1999-04-16 2000-04-12 Schutzvorrichtung Expired - Lifetime DE60030619T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11110163A JP2000306477A (ja) 1999-04-16 1999-04-16 保護素子
JP11016399 1999-04-16

Publications (2)

Publication Number Publication Date
DE60030619D1 true DE60030619D1 (de) 2006-10-26
DE60030619T2 DE60030619T2 (de) 2007-09-13

Family

ID=14528655

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60030619T Expired - Lifetime DE60030619T2 (de) 1999-04-16 2000-04-12 Schutzvorrichtung

Country Status (5)

Country Link
US (1) US6452475B1 (de)
EP (1) EP1045418B1 (de)
JP (1) JP2000306477A (de)
KR (1) KR100473470B1 (de)
DE (1) DE60030619T2 (de)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001325869A (ja) 2000-05-17 2001-11-22 Sony Chem Corp 保護素子
JP2001325868A (ja) 2000-05-17 2001-11-22 Sony Chem Corp 保護素子
JP3692042B2 (ja) 2001-02-06 2005-09-07 ソニーケミカル株式会社 保護回路付き二次電池
ATE291220T1 (de) * 2001-05-29 2005-04-15 Em Microelectronic Marin Sa Elektronische vorrichtung und verfahren zur temperaturüberwachung eines mediums
DE10142091A1 (de) * 2001-08-30 2003-03-20 Wickmann Werke Gmbh Verfahren zum Herstellen eines Schutzbauelements mit einem eingestellten Zeitverhalten des Wärmeübergangs von einem Heizelement zu einem Schmelzelement
DE10245393A1 (de) * 2002-09-28 2004-04-08 Wickmann-Werke Gmbh Mittels Lichtbogen selbst-konfigurierendes Bauelement
JP2004214033A (ja) * 2002-12-27 2004-07-29 Sony Chem Corp 保護素子
JP4110967B2 (ja) * 2002-12-27 2008-07-02 ソニーケミカル＆インフォメーションデバイス株式会社 保護素子
JP2005171371A (ja) * 2003-12-15 2005-06-30 Uchihashi Estec Co Ltd 合金型温度ヒューズ及び温度ヒューズエレメント用線材
DE102004033251B3 (de) 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
DE102005024346B4 (de) * 2005-05-27 2012-04-26 Infineon Technologies Ag Sicherungselement mit Auslöseunterstützung
US20070075822A1 (en) * 2005-10-03 2007-04-05 Littlefuse, Inc. Fuse with cavity forming enclosure
TWI323906B (en) * 2007-02-14 2010-04-21 Besdon Technology Corp Chip-type fuse and method of manufacturing the same
JP2008311161A (ja) * 2007-06-18 2008-12-25 Sony Chemical & Information Device Corp 保護素子
US20090009281A1 (en) * 2007-07-06 2009-01-08 Cyntec Company Fuse element and manufacturing method thereof
JP5287154B2 (ja) * 2007-11-08 2013-09-11 パナソニック株式会社 回路保護素子およびその製造方法
TW200929310A (en) * 2007-12-21 2009-07-01 Chun-Chang Yen Surface Mounted Technology type thin film fuse structure and the manufacturing method thereof
JP5117917B2 (ja) * 2008-04-21 2013-01-16 デクセリアルズ株式会社 保護素子及びその製造方法
JP5072796B2 (ja) * 2008-05-23 2012-11-14 ソニーケミカル＆インフォメーションデバイス株式会社 保護素子及び二次電池装置
US20110163840A1 (en) * 2008-10-28 2011-07-07 Nanjing Sart Science & Technology Development Co., Ltd. High reliability blade fuse and the manufacturing method thereof
JP5130232B2 (ja) * 2009-01-21 2013-01-30 デクセリアルズ株式会社 保護素子
JP5130233B2 (ja) * 2009-01-21 2013-01-30 デクセリアルズ株式会社 保護素子
JP5301298B2 (ja) * 2009-01-21 2013-09-25 デクセリアルズ株式会社 保護素子
US9129769B2 (en) * 2009-09-04 2015-09-08 Cyntec Co., Ltd. Protective device
JP5351860B2 (ja) * 2009-09-04 2013-11-27 乾坤科技股▲ふん▼有限公司 保護装置
US9025295B2 (en) 2009-09-04 2015-05-05 Cyntec Co., Ltd. Protective device and protective module
US8659384B2 (en) * 2009-09-16 2014-02-25 Littelfuse, Inc. Metal film surface mount fuse
US8531263B2 (en) * 2009-11-24 2013-09-10 Littelfuse, Inc. Circuit protection device
DE102010011150B4 (de) * 2010-03-11 2012-03-29 Auto-Kabel Managementgesellschaft Mbh Elektrische Sicherung für Kraftfahrzeugenergieleitungen und Herstellungsverfahren für eine solche Sicherung
JP5260592B2 (ja) * 2010-04-08 2013-08-14 デクセリアルズ株式会社 保護素子、バッテリ制御装置、及びバッテリパック
PL2408277T3 (pl) * 2010-07-16 2016-08-31 Schurter Ag Element bezpiecznikowy
CN201774742U (zh) * 2010-08-19 2011-03-23 依必安派特风机(上海)有限公司 集成于印刷电路板上的保险单元以及印刷电路板
US8976001B2 (en) * 2010-11-08 2015-03-10 Cyntec Co., Ltd. Protective device
KR101278503B1 (ko) * 2011-06-17 2013-07-02 주식회사 엘지화학 이차전지용 부품 및 그 제조 방법, 및 상기 부품을 사용하여 제조된 이차전지와 멀티 전지 시스템
JP5844669B2 (ja) * 2012-03-26 2016-01-20 デクセリアルズ株式会社 保護素子
JP6249600B2 (ja) 2012-03-29 2017-12-20 デクセリアルズ株式会社 保護素子
FR2989825B1 (fr) * 2012-04-18 2014-06-06 Centre Nat Rech Scient Dispositif electrique et procede de fabrication de celui-ci
KR101388354B1 (ko) * 2012-11-26 2014-04-24 스마트전자 주식회사 비정상상태의 전류 및 전압을 차단하는 복합보호소자
KR101401141B1 (ko) 2012-11-26 2014-05-30 스마트전자 주식회사 비정상상태의 전류 및 전압을 차단하는 복합보호소자
JP6151550B2 (ja) * 2013-04-25 2017-06-21 デクセリアルズ株式会社 保護素子
US10483061B2 (en) * 2013-07-02 2019-11-19 Littelfuse Japan G.K. Protective device
US20150200067A1 (en) * 2014-01-10 2015-07-16 Littelfuse, Inc. Ceramic chip fuse with offset fuse element
DE102015102292A1 (de) * 2014-02-28 2015-09-03 Smart Electronics Inc. Komplexe Schutzvorrichtung zum Blockieren eines abnormalen Zustands von Strom und Spannung
KR101504133B1 (ko) * 2014-02-28 2015-03-19 스마트전자 주식회사 복합보호소자
KR101434135B1 (ko) * 2014-03-17 2014-08-26 스마트전자 주식회사 퓨즈 저항기
DE102015108758A1 (de) * 2014-06-13 2015-12-17 Smart Electronics Inc. Komplexe Schutzvorrichtung
JP6294165B2 (ja) * 2014-06-19 2018-03-14 Koa株式会社 チップ型ヒューズ
JP6203136B2 (ja) * 2014-06-27 2017-09-27 エヌイーシー ショット コンポーネンツ株式会社 保護素子およびその製造方法、ならびに保護素子用消散性フラックス
DE102014215279A1 (de) * 2014-08-04 2016-02-04 Phoenix Contact Gmbh & Co. Kg Schmelzsicherung für eine zu schützende Einrichtung
KR101533996B1 (ko) * 2014-10-23 2015-07-06 주식회사 에스엠하이테크 온도 퓨즈 기능을 가진 smd형 마이크로 복합 퓨즈 및 그 제조방법
US10998738B2 (en) * 2015-03-24 2021-05-04 Seung Gyu Lee Fusible switch, battery control apparatus including same, and battery control method
DE102015225377A1 (de) * 2015-12-16 2017-06-22 Phoenix Contact Gmbh & Co. Kg Laststromtragende Sicherung mit internem Schaltelement
JP6160788B1 (ja) * 2017-01-13 2017-07-12 千住金属工業株式会社 フラックス
JP6433527B2 (ja) * 2017-03-16 2018-12-05 ショット日本株式会社 消散性フラックスおよびそれを用いた保護素子の製造方法
JP7231527B2 (ja) 2018-12-28 2023-03-01 ショット日本株式会社 保護素子用ヒューズ素子およびそれを利用した保護素子
CN114730679A (zh) * 2019-11-21 2022-07-08 力特保险丝公司 具有正温度系数装置和备用熔断器的电路保护装置
JP7349954B2 (ja) * 2020-04-13 2023-09-25 ショット日本株式会社 保護素子
JP2023127740A (ja) * 2022-03-02 2023-09-14 デクセリアルズ株式会社 保護素子

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US3445798A (en) * 1967-08-04 1969-05-20 Dieter R Lohrmann Short-time melting fuse
US4873506A (en) * 1988-03-09 1989-10-10 Cooper Industries, Inc. Metallo-organic film fractional ampere fuses and method of making
DE4222278C1 (de) * 1992-07-07 1994-03-31 Roederstein Kondensatoren Verfahren zur Herstellung elektrischer Dickschichtsicherungen
JP2790433B2 (ja) 1993-08-31 1998-08-27 ソニー株式会社 保護素子及び回路基板
JPH07122406A (ja) * 1993-10-22 1995-05-12 Hokuriku Electric Ind Co Ltd チップ状ヒューズ抵抗器とその製造方法
JP2608031B2 (ja) * 1994-07-21 1997-05-07 釜屋電機株式会社 チップ型ヒューズ抵抗器
US5712610C1 (en) * 1994-08-19 2002-06-25 Sony Chemicals Corp Protective device
JP3067011B2 (ja) 1994-11-30 2000-07-17 ソニーケミカル株式会社 保護素子及びその製造方法
KR200203067Y1 (ko) * 1994-10-13 2001-04-02 권호택 하이브리드 아이씨용 퓨즈저항 패턴
JP3768621B2 (ja) 1996-10-12 2006-04-19 内橋エステック株式会社 保護素子の使用方法
JP3782176B2 (ja) 1996-10-12 2006-06-07 内橋エステック株式会社 保護素子の使用方法及び保護装置
JPH10162715A (ja) * 1996-11-28 1998-06-19 Kyocera Corp チップヒューズ
US5939969A (en) * 1997-08-29 1999-08-17 Microelectronic Modules Corporation Preformed thermal fuse

Also Published As

Publication number Publication date
EP1045418A3 (de) 2002-11-27
EP1045418A2 (de) 2000-10-18
JP2000306477A (ja) 2000-11-02
US6452475B1 (en) 2002-09-17
DE60030619T2 (de) 2007-09-13
KR100473470B1 (ko) 2005-03-07
EP1045418B1 (de) 2006-09-13
KR20010006986A (ko) 2001-01-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition