DE60019352D1 - Chemisch-mechanisches Polieren mit einem bewegenden Poliertuch - Google Patents

Chemisch-mechanisches Polieren mit einem bewegenden Poliertuch

Info

Publication number
DE60019352D1
DE60019352D1 DE60019352T DE60019352T DE60019352D1 DE 60019352 D1 DE60019352 D1 DE 60019352D1 DE 60019352 T DE60019352 T DE 60019352T DE 60019352 T DE60019352 T DE 60019352T DE 60019352 D1 DE60019352 D1 DE 60019352D1
Authority
DE
Germany
Prior art keywords
polishing
chemical
moving
cloth
mechanical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60019352T
Other languages
English (en)
Other versions
DE60019352T2 (de
Inventor
John M White
Manoocher Birang
Lawrence Rosenberg
Sasson Somekh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/244,456 external-priority patent/US6244935B1/en
Priority claimed from US09/303,812 external-priority patent/US6241583B1/en
Priority claimed from US09/302,570 external-priority patent/US6475070B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE60019352D1 publication Critical patent/DE60019352D1/de
Application granted granted Critical
Publication of DE60019352T2 publication Critical patent/DE60019352T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60019352T 1999-02-04 2000-02-04 Chemisch-mechanisches Polieren mit einem bewegenden Poliertuch Expired - Lifetime DE60019352T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US244456 1999-02-04
US09/244,456 US6244935B1 (en) 1999-02-04 1999-02-04 Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
US09/303,812 US6241583B1 (en) 1999-02-04 1999-04-30 Chemical mechanical polishing with a plurality of polishing sheets
US302570 1999-04-30
US303812 1999-04-30
US09/302,570 US6475070B1 (en) 1999-02-04 1999-04-30 Chemical mechanical polishing with a moving polishing sheet

Publications (2)

Publication Number Publication Date
DE60019352D1 true DE60019352D1 (de) 2005-05-19
DE60019352T2 DE60019352T2 (de) 2006-05-11

Family

ID=27399758

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60019352T Expired - Lifetime DE60019352T2 (de) 1999-02-04 2000-02-04 Chemisch-mechanisches Polieren mit einem bewegenden Poliertuch

Country Status (5)

Country Link
EP (1) EP1025955B1 (de)
JP (1) JP3825220B2 (de)
KR (1) KR100773190B1 (de)
DE (1) DE60019352T2 (de)
TW (1) TW438648B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6589105B2 (en) 1998-12-01 2003-07-08 Nutool, Inc. Pad tensioning method and system in a bi-directional linear polisher
US6468139B1 (en) * 1998-12-01 2002-10-22 Nutool, Inc. Polishing apparatus and method with a refreshing polishing belt and loadable housing
US6626736B2 (en) 2000-06-30 2003-09-30 Ebara Corporation Polishing apparatus
US20020072296A1 (en) * 2000-11-29 2002-06-13 Muilenburg Michael J. Abrasive article having a window system for polishing wafers, and methods
EP1395392A1 (de) * 2001-06-12 2004-03-10 Nutool, Inc. Verbesserte verfahren und vorrichtung zum bidirectionalen polieren von werkstücken
KR100841623B1 (ko) * 2002-03-21 2008-06-27 엘지디스플레이 주식회사 액정 패널의 연마장치
US6939203B2 (en) 2002-04-18 2005-09-06 Asm Nutool, Inc. Fluid bearing slide assembly for workpiece polishing
JP4941735B2 (ja) * 2007-03-30 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
KR102453254B1 (ko) * 2017-07-10 2022-10-12 주식회사 케이씨텍 순환 구동 유닛 및 이를 포함하는 기판 연마 장치
CN108789062B (zh) * 2018-06-14 2024-03-15 深圳市特瑞华腾新能源有限公司 一种基于多电机电控磨平板状物料装置及其控制方法
WO2020176460A1 (en) * 2019-02-28 2020-09-03 Applied Materials, Inc. Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer
CN109719599B (zh) * 2019-03-13 2024-07-05 广东泰格威机器人科技有限公司 铝型材门窗框架打磨装置
CN112692724A (zh) * 2019-10-23 2021-04-23 中国石油化工股份有限公司 一种磨头组件及使用该磨头组件的岩石薄片磨片装置
CN113579990B (zh) * 2021-07-30 2022-07-26 上海积塔半导体有限公司 固定研磨粒抛光装置及抛光方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980012048A (ko) * 1996-07-12 1998-04-30 조셉제이. 스위니 화학 기계식 폴리싱 장치와 이러한 화학 기계식 폴리싱 장치내에서 폴리싱 패드를 플래튼에 대해 고정시키는 방법
JPH1034514A (ja) * 1996-07-24 1998-02-10 Sanshin:Kk 表面研磨加工方法及びその装置

Also Published As

Publication number Publication date
TW438648B (en) 2001-06-07
JP3825220B2 (ja) 2006-09-27
JP2000317823A (ja) 2000-11-21
EP1025955A2 (de) 2000-08-09
DE60019352T2 (de) 2006-05-11
EP1025955A3 (de) 2003-05-02
EP1025955B1 (de) 2005-04-13
KR100773190B1 (ko) 2007-11-02
KR20000057941A (ko) 2000-09-25

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