DE60019352D1 - Chemisch-mechanisches Polieren mit einem bewegenden Poliertuch - Google Patents
Chemisch-mechanisches Polieren mit einem bewegenden PoliertuchInfo
- Publication number
- DE60019352D1 DE60019352D1 DE60019352T DE60019352T DE60019352D1 DE 60019352 D1 DE60019352 D1 DE 60019352D1 DE 60019352 T DE60019352 T DE 60019352T DE 60019352 T DE60019352 T DE 60019352T DE 60019352 D1 DE60019352 D1 DE 60019352D1
- Authority
- DE
- Germany
- Prior art keywords
- polishing
- chemical
- moving
- cloth
- mechanical polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title 2
- 239000004744 fabric Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US244456 | 1999-02-04 | ||
US09/244,456 US6244935B1 (en) | 1999-02-04 | 1999-02-04 | Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet |
US09/303,812 US6241583B1 (en) | 1999-02-04 | 1999-04-30 | Chemical mechanical polishing with a plurality of polishing sheets |
US302570 | 1999-04-30 | ||
US303812 | 1999-04-30 | ||
US09/302,570 US6475070B1 (en) | 1999-02-04 | 1999-04-30 | Chemical mechanical polishing with a moving polishing sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60019352D1 true DE60019352D1 (de) | 2005-05-19 |
DE60019352T2 DE60019352T2 (de) | 2006-05-11 |
Family
ID=27399758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60019352T Expired - Lifetime DE60019352T2 (de) | 1999-02-04 | 2000-02-04 | Chemisch-mechanisches Polieren mit einem bewegenden Poliertuch |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1025955B1 (de) |
JP (1) | JP3825220B2 (de) |
KR (1) | KR100773190B1 (de) |
DE (1) | DE60019352T2 (de) |
TW (1) | TW438648B (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6589105B2 (en) | 1998-12-01 | 2003-07-08 | Nutool, Inc. | Pad tensioning method and system in a bi-directional linear polisher |
US6468139B1 (en) * | 1998-12-01 | 2002-10-22 | Nutool, Inc. | Polishing apparatus and method with a refreshing polishing belt and loadable housing |
US6626736B2 (en) | 2000-06-30 | 2003-09-30 | Ebara Corporation | Polishing apparatus |
US20020072296A1 (en) * | 2000-11-29 | 2002-06-13 | Muilenburg Michael J. | Abrasive article having a window system for polishing wafers, and methods |
EP1395392A1 (de) * | 2001-06-12 | 2004-03-10 | Nutool, Inc. | Verbesserte verfahren und vorrichtung zum bidirectionalen polieren von werkstücken |
KR100841623B1 (ko) * | 2002-03-21 | 2008-06-27 | 엘지디스플레이 주식회사 | 액정 패널의 연마장치 |
US6939203B2 (en) | 2002-04-18 | 2005-09-06 | Asm Nutool, Inc. | Fluid bearing slide assembly for workpiece polishing |
JP4941735B2 (ja) * | 2007-03-30 | 2012-05-30 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
KR102453254B1 (ko) * | 2017-07-10 | 2022-10-12 | 주식회사 케이씨텍 | 순환 구동 유닛 및 이를 포함하는 기판 연마 장치 |
CN108789062B (zh) * | 2018-06-14 | 2024-03-15 | 深圳市特瑞华腾新能源有限公司 | 一种基于多电机电控磨平板状物料装置及其控制方法 |
WO2020176460A1 (en) * | 2019-02-28 | 2020-09-03 | Applied Materials, Inc. | Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer |
CN109719599B (zh) * | 2019-03-13 | 2024-07-05 | 广东泰格威机器人科技有限公司 | 铝型材门窗框架打磨装置 |
CN112692724A (zh) * | 2019-10-23 | 2021-04-23 | 中国石油化工股份有限公司 | 一种磨头组件及使用该磨头组件的岩石薄片磨片装置 |
CN113579990B (zh) * | 2021-07-30 | 2022-07-26 | 上海积塔半导体有限公司 | 固定研磨粒抛光装置及抛光方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR980012048A (ko) * | 1996-07-12 | 1998-04-30 | 조셉제이. 스위니 | 화학 기계식 폴리싱 장치와 이러한 화학 기계식 폴리싱 장치내에서 폴리싱 패드를 플래튼에 대해 고정시키는 방법 |
JPH1034514A (ja) * | 1996-07-24 | 1998-02-10 | Sanshin:Kk | 表面研磨加工方法及びその装置 |
-
2000
- 2000-02-04 EP EP00300878A patent/EP1025955B1/de not_active Expired - Lifetime
- 2000-02-04 DE DE60019352T patent/DE60019352T2/de not_active Expired - Lifetime
- 2000-02-04 JP JP2000028260A patent/JP3825220B2/ja not_active Expired - Lifetime
- 2000-02-07 KR KR1020000005614A patent/KR100773190B1/ko active IP Right Grant
- 2000-04-06 TW TW089102032A patent/TW438648B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW438648B (en) | 2001-06-07 |
JP3825220B2 (ja) | 2006-09-27 |
JP2000317823A (ja) | 2000-11-21 |
EP1025955A2 (de) | 2000-08-09 |
DE60019352T2 (de) | 2006-05-11 |
EP1025955A3 (de) | 2003-05-02 |
EP1025955B1 (de) | 2005-04-13 |
KR100773190B1 (ko) | 2007-11-02 |
KR20000057941A (ko) | 2000-09-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |