DE60013620D1 - Heizplatteneinheit - Google Patents
HeizplatteneinheitInfo
- Publication number
- DE60013620D1 DE60013620D1 DE60013620T DE60013620T DE60013620D1 DE 60013620 D1 DE60013620 D1 DE 60013620D1 DE 60013620 T DE60013620 T DE 60013620T DE 60013620 T DE60013620 T DE 60013620T DE 60013620 D1 DE60013620 D1 DE 60013620D1
- Authority
- DE
- Germany
- Prior art keywords
- hot plate
- heater
- casing
- opening portion
- shaped member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Lubricants (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2000/003595 WO2001095379A1 (fr) | 2000-06-02 | 2000-06-02 | Plaque de cuisson |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60013620D1 true DE60013620D1 (de) | 2004-10-14 |
DE60013620T2 DE60013620T2 (de) | 2005-02-03 |
Family
ID=11736107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60013620T Expired - Lifetime DE60013620T2 (de) | 2000-06-02 | 2000-06-02 | Heizplatteneinheit |
Country Status (5)
Country | Link |
---|---|
US (1) | US6756568B1 (de) |
EP (2) | EP1463097A1 (de) |
AT (1) | ATE275760T1 (de) |
DE (1) | DE60013620T2 (de) |
WO (1) | WO2001095379A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1550477A (zh) * | 1999-09-06 | 2004-12-01 | Ibiden股份有限公司 | 含碳的氮化铝烧结体,用于半导体制造/检测设备的基材 |
JP2001247382A (ja) * | 2000-03-06 | 2001-09-11 | Ibiden Co Ltd | セラミック基板 |
JP3516392B2 (ja) * | 2000-06-16 | 2004-04-05 | イビデン株式会社 | 半導体製造・検査装置用ホットプレート |
US20060088692A1 (en) * | 2004-10-22 | 2006-04-27 | Ibiden Co., Ltd. | Ceramic plate for a semiconductor producing/examining device |
JP5111876B2 (ja) * | 2007-01-31 | 2013-01-09 | 東京エレクトロン株式会社 | 基板載置構造体及び基板処理装置 |
JP5524560B2 (ja) * | 2009-10-01 | 2014-06-18 | 株式会社ブリヂストン | ヒータユニット反射板および該反射板を備えたヒータユニット |
DE102013113045A1 (de) * | 2013-11-26 | 2015-05-28 | Aixtron Se | Heizvorrichtung |
JP6847610B2 (ja) * | 2016-09-14 | 2021-03-24 | 株式会社Screenホールディングス | 熱処理装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2976386A (en) * | 1958-03-31 | 1961-03-21 | Lewis L Salton | Electric food warmers |
US3805024A (en) * | 1973-06-18 | 1974-04-16 | Irex Corp | Electrical infrared heater with a coated silicon carbide emitter |
US3987275A (en) * | 1976-02-02 | 1976-10-19 | General Electric Company | Glass plate surface heating unit with sheathed heater |
DE3527533A1 (de) * | 1985-08-01 | 1987-02-12 | Ego Elektro Blanc & Fischer | Elektrokochplatte |
JPS6296292A (ja) | 1985-10-22 | 1987-05-02 | 三菱電機株式会社 | ク−ラ−付エレベ−タの冷気流出防止装置 |
JPS63274768A (ja) | 1987-05-06 | 1988-11-11 | Tokuda Seisakusho Ltd | 真空処理装置 |
DE3728466A1 (de) * | 1987-08-26 | 1989-03-09 | Ego Elektro Blanc & Fischer | Kochgeraet |
US5221829A (en) * | 1990-10-15 | 1993-06-22 | Shimon Yahav | Domestic cooking apparatus |
JP2617064B2 (ja) | 1992-07-28 | 1997-06-04 | 日本碍子株式会社 | 半導体ウェハー加熱装置およびその製造方法 |
JP3165938B2 (ja) * | 1993-06-24 | 2001-05-14 | 東京エレクトロン株式会社 | ガス処理装置 |
JPH07111244A (ja) | 1993-10-13 | 1995-04-25 | Mitsubishi Electric Corp | 気相結晶成長装置 |
DE9319245U1 (de) * | 1993-12-15 | 1994-02-03 | Bräuer, Dietmar, 78050 Villingen-Schwenningen | Heizkörper, bestehend aus einem Grundmaterial mit sehr geringer Wärmeleitfähigkeit, mindestens einem vorzugsweis elektrischen Heizelement und Materialien zur Wärmedämmung und Wärmestrahlungsreflexion |
JPH07280462A (ja) | 1994-04-11 | 1995-10-27 | Shin Etsu Chem Co Ltd | 均熱セラミックスヒーター |
JPH08176831A (ja) | 1994-12-26 | 1996-07-09 | Touyoko Kagaku Kk | 高速熱処理成膜装置 |
JPH08274147A (ja) | 1995-03-30 | 1996-10-18 | Kyocera Corp | ウェハ保持装置 |
JPH08222360A (ja) | 1995-02-10 | 1996-08-30 | Noboru Naruo | 真空加熱兼冷却均熱ヒータ |
US6002109A (en) | 1995-07-10 | 1999-12-14 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
JP3338593B2 (ja) | 1995-09-19 | 2002-10-28 | 日本碍子株式会社 | 半導体処理装置およびその製造方法 |
JP3423131B2 (ja) | 1995-11-20 | 2003-07-07 | 東京エレクトロン株式会社 | 熱処理装置及び処理装置 |
KR100280634B1 (ko) * | 1996-05-05 | 2001-02-01 | 세이이치로 미야타 | 전기 발열체 및 이를 이용한 정전 척 |
JPH11283729A (ja) * | 1998-03-27 | 1999-10-15 | Ibiden Co Ltd | ホットプレートユニット |
-
2000
- 2000-06-02 AT AT00935530T patent/ATE275760T1/de not_active IP Right Cessation
- 2000-06-02 DE DE60013620T patent/DE60013620T2/de not_active Expired - Lifetime
- 2000-06-02 EP EP04012355A patent/EP1463097A1/de not_active Withdrawn
- 2000-06-02 WO PCT/JP2000/003595 patent/WO2001095379A1/ja active IP Right Grant
- 2000-06-02 EP EP00935530A patent/EP1220303B1/de not_active Expired - Lifetime
- 2000-06-02 US US10/048,894 patent/US6756568B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE275760T1 (de) | 2004-09-15 |
EP1463097A1 (de) | 2004-09-29 |
WO2001095379A1 (fr) | 2001-12-13 |
EP1220303B1 (de) | 2004-09-08 |
EP1220303A1 (de) | 2002-07-03 |
US6756568B1 (en) | 2004-06-29 |
DE60013620T2 (de) | 2005-02-03 |
EP1220303A4 (de) | 2003-04-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |