DE4290875T1 - Wärmetauscher für elektronische Festkörper-Vorrichtungen - Google Patents

Wärmetauscher für elektronische Festkörper-Vorrichtungen

Info

Publication number
DE4290875T1
DE4290875T1 DE4290875T DE4290875T DE4290875T1 DE 4290875 T1 DE4290875 T1 DE 4290875T1 DE 4290875 T DE4290875 T DE 4290875T DE 4290875 T DE4290875 T DE 4290875T DE 4290875 T1 DE4290875 T1 DE 4290875T1
Authority
DE
Germany
Prior art keywords
electronic devices
solid state
heat exchangers
state electronic
exchangers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4290875T
Other languages
English (en)
Inventor
James A Matthews
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microunity Systems Engineering Inc
Original Assignee
Microunity Systems Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microunity Systems Engineering Inc filed Critical Microunity Systems Engineering Inc
Publication of DE4290875T1 publication Critical patent/DE4290875T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet
    • Y10T29/49368—Sheet joined to sheet with inserted tubes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE4290875T 1991-04-02 1992-03-31 Wärmetauscher für elektronische Festkörper-Vorrichtungen Withdrawn DE4290875T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/679,529 US5125451A (en) 1991-04-02 1991-04-02 Heat exchanger for solid-state electronic devices

Publications (1)

Publication Number Publication Date
DE4290875T1 true DE4290875T1 (de) 1994-01-13

Family

ID=24727288

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4290875T Withdrawn DE4290875T1 (de) 1991-04-02 1992-03-31 Wärmetauscher für elektronische Festkörper-Vorrichtungen

Country Status (6)

Country Link
US (2) US5125451A (de)
JP (1) JPH06508911A (de)
AU (1) AU1756692A (de)
DE (1) DE4290875T1 (de)
GB (1) GB2275575B (de)
WO (1) WO1992017745A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4401607A1 (de) * 1994-01-20 1995-07-27 Siemens Ag Kühleinheit für Leistungshalbleiter
DE19710783A1 (de) * 1997-03-17 1998-09-24 Curamik Electronics Gmbh Kühler für elektrische Bauelemente oder Schaltkreise sowie elektrischer Schaltkreis mit einer solchen Wärmesenke

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US5751327A (en) * 1993-06-18 1998-05-12 Xeikon N.V. Printer including temperature controlled LED recording heads
US5777259A (en) * 1994-01-14 1998-07-07 Brush Wellman Inc. Heat exchanger assembly and method for making the same
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US6022426A (en) * 1995-05-31 2000-02-08 Brush Wellman Inc. Multilayer laminate process
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
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US6003591A (en) * 1997-12-22 1999-12-21 Saddleback Aerospace Formed laminate heat pipe
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US8464781B2 (en) * 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7156159B2 (en) * 2003-03-17 2007-01-02 Cooligy, Inc. Multi-level microchannel heat exchangers
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US6988535B2 (en) * 2002-11-01 2006-01-24 Cooligy, Inc. Channeled flat plate fin heat exchange system, device and method
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US20050211417A1 (en) * 2002-11-01 2005-09-29 Cooligy,Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US6986382B2 (en) 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US7293423B2 (en) 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US20090044928A1 (en) * 2003-01-31 2009-02-19 Girish Upadhya Method and apparatus for preventing cracking in a liquid cooling system
US7090001B2 (en) * 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US7201012B2 (en) * 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US7017654B2 (en) * 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
US20040182551A1 (en) * 2003-03-17 2004-09-23 Cooligy, Inc. Boiling temperature design in pumped microchannel cooling loops
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
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JP4014549B2 (ja) * 2003-09-18 2007-11-28 富士電機システムズ株式会社 ヒートシンク及びその製造方法
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US7616444B2 (en) 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7188662B2 (en) * 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
US20060042785A1 (en) * 2004-08-27 2006-03-02 Cooligy, Inc. Pumped fluid cooling system and method
CN100389371C (zh) * 2004-09-16 2008-05-21 中芯国际集成电路制造(上海)有限公司 具有低待机电流的调压器用器件和方法
JP4551261B2 (ja) * 2005-04-01 2010-09-22 株式会社日立製作所 冷却ジャケット
JP2007127398A (ja) * 2005-10-05 2007-05-24 Seiko Epson Corp 熱交換器、熱交換器の製造方法、液冷システム、光源装置、プロジェクタ、電子デバイスユニット、電子機器
US20070114010A1 (en) * 2005-11-09 2007-05-24 Girish Upadhya Liquid cooling for backlit displays
JP4449894B2 (ja) * 2005-12-16 2010-04-14 セイコーエプソン株式会社 熱交換器、光源装置、プロジェクタおよび電子機器
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
JP5208769B2 (ja) 2006-02-16 2013-06-12 クーリギー インコーポレイテッド 取付装置
DE112007000768T5 (de) 2006-03-30 2009-02-12 Cooligy, Inc., Mountain View Integriertes Modul für die Flüssigkeits-Luft-Leitung
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US20070256825A1 (en) * 2006-05-04 2007-11-08 Conway Bruce R Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect
US20080006396A1 (en) * 2006-06-30 2008-01-10 Girish Upadhya Multi-stage staggered radiator for high performance liquid cooling applications
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US8081462B2 (en) * 2007-09-13 2011-12-20 Rockwell Automation Technologies, Inc. Modular liquid cooling system
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Publication number Priority date Publication date Assignee Title
DE4401607A1 (de) * 1994-01-20 1995-07-27 Siemens Ag Kühleinheit für Leistungshalbleiter
DE19710783A1 (de) * 1997-03-17 1998-09-24 Curamik Electronics Gmbh Kühler für elektrische Bauelemente oder Schaltkreise sowie elektrischer Schaltkreis mit einer solchen Wärmesenke
DE19710783C2 (de) * 1997-03-17 2003-08-21 Curamik Electronics Gmbh Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise

Also Published As

Publication number Publication date
GB2275575A (en) 1994-08-31
JPH06508911A (ja) 1994-10-06
WO1992017745A1 (en) 1992-10-15
AU1756692A (en) 1992-11-02
GB9320323D0 (en) 1994-05-04
US5274920A (en) 1994-01-04
GB2275575B (en) 1995-11-22
US5125451A (en) 1992-06-30

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Legal Events

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8139 Disposal/non-payment of the annual fee