DE4191065T - - Google Patents
Info
- Publication number
- DE4191065T DE4191065T DE19914191065 DE4191065T DE4191065T DE 4191065 T DE4191065 T DE 4191065T DE 19914191065 DE19914191065 DE 19914191065 DE 4191065 T DE4191065 T DE 4191065T DE 4191065 T DE4191065 T DE 4191065T
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
- H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2134783A JPH0429338A (ja) | 1990-05-24 | 1990-05-24 | Icの搭載用回路基板及びその搭載方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE4191065T true DE4191065T (de) | 1992-06-25 |
Family
ID=15136451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19914191065 Ceased DE4191065T (de) | 1990-05-24 | 1991-05-22 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5250469A (de) |
JP (1) | JPH0429338A (de) |
DE (1) | DE4191065T (de) |
WO (1) | WO1991018415A1 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2762792B2 (ja) * | 1991-08-30 | 1998-06-04 | 日本電気株式会社 | 光半導体装置 |
JP3215424B2 (ja) * | 1992-03-24 | 2001-10-09 | ユニシス・コーポレイション | 微細自己整合特性を有する集積回路モジュール |
TW332348B (en) * | 1992-06-23 | 1998-05-21 | Sony Co Ltd | Manufacturing method for solid state motion picture device provides a highly accurate and low cost solid state motion picture device by use of empty package made of resin. |
US6077725A (en) * | 1992-09-03 | 2000-06-20 | Lucent Technologies Inc | Method for assembling multichip modules |
US5451274A (en) * | 1994-01-31 | 1995-09-19 | Motorola, Inc. | Reflow of multi-layer metal bumps |
US5766972A (en) * | 1994-06-02 | 1998-06-16 | Mitsubishi Denki Kabushiki Kaisha | Method of making resin encapsulated semiconductor device with bump electrodes |
US6614110B1 (en) | 1994-12-22 | 2003-09-02 | Benedict G Pace | Module with bumps for connection and support |
US5904499A (en) * | 1994-12-22 | 1999-05-18 | Pace; Benedict G | Package for power semiconductor chips |
WO1996019829A1 (en) * | 1994-12-22 | 1996-06-27 | Pace Benedict G | Device for superheating steam |
US5608260A (en) * | 1994-12-30 | 1997-03-04 | International Business Machines Corporation | Leadframe having contact pads defined by a polymer insulating film |
DE19504967C2 (de) * | 1995-02-15 | 2002-01-24 | Fraunhofer Ges Forschung | Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip |
TW520816U (en) * | 1995-04-24 | 2003-02-11 | Matsushita Electric Ind Co Ltd | Semiconductor device |
JP3015712B2 (ja) * | 1995-06-30 | 2000-03-06 | 日東電工株式会社 | フィルムキャリアおよびそれを用いてなる半導体装置 |
US5776824A (en) * | 1995-12-22 | 1998-07-07 | Micron Technology, Inc. | Method for producing laminated film/metal structures for known good die ("KG") applications |
JP3385872B2 (ja) * | 1995-12-25 | 2003-03-10 | 三菱電機株式会社 | はんだ供給法およびはんだ供給装置 |
KR100433857B1 (ko) * | 1996-09-17 | 2004-06-04 | 마츠시타 덴끼 산교 가부시키가이샤 | 아이씨칩의 조립 방법, 조립장치 및 그에 사용하는 테이프형 지지체 |
JP3663786B2 (ja) * | 1996-10-14 | 2005-06-22 | ヤマハ株式会社 | 半導体チップの実装方法と実装構造 |
IT1291779B1 (it) | 1997-02-17 | 1999-01-21 | Magnetek Spa | Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti |
FI970822A (fi) * | 1997-02-27 | 1998-08-28 | Nokia Mobile Phones Ltd | Menetelmä ja järjestely komponentin liittämiseksi |
US6730541B2 (en) * | 1997-11-20 | 2004-05-04 | Texas Instruments Incorporated | Wafer-scale assembly of chip-size packages |
JP3942738B2 (ja) | 1998-07-17 | 2007-07-11 | 松下電器産業株式会社 | バンプ接合装置及び方法、並びに半導体部品製造装置 |
JP4338834B2 (ja) * | 1999-08-06 | 2009-10-07 | 日本テキサス・インスツルメンツ株式会社 | 超音波振動を用いた半導体チップの実装方法 |
US20020014702A1 (en) * | 2000-03-10 | 2002-02-07 | Nazir Ahmad | Packaging structure and method |
US10388626B2 (en) * | 2000-03-10 | 2019-08-20 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming flipchip interconnect structure |
EP1278612B1 (de) * | 2000-03-10 | 2010-02-24 | Chippac, Inc. | Flipchip-Verbindungsstruktur und dessen Herstellungsverfahren |
US6737295B2 (en) * | 2001-02-27 | 2004-05-18 | Chippac, Inc. | Chip scale package with flip chip interconnect |
US6780682B2 (en) | 2001-02-27 | 2004-08-24 | Chippac, Inc. | Process for precise encapsulation of flip chip interconnects |
US6940178B2 (en) * | 2001-02-27 | 2005-09-06 | Chippac, Inc. | Self-coplanarity bumping shape for flip chip |
DE10202788A1 (de) * | 2002-01-25 | 2003-07-31 | Rieter Ag Maschf | Texturieranlage und Texturierdüse hierfür |
DE10249005A1 (de) * | 2002-10-21 | 2004-05-06 | Siemens Ag | Verfahren zur Herstellung einer Schaltungsanordnung |
JP3870915B2 (ja) * | 2003-03-05 | 2007-01-24 | セイコーエプソン株式会社 | 光通信モジュール、光通信装置、及びその製造方法 |
WO2005055288A2 (de) | 2003-12-03 | 2005-06-16 | Pac Tech - Packaging Technologies Gmbh | Verfahren und vorrichtung zur wechselseitigen kontaktierung von zwei wafern |
DE10361521A1 (de) | 2003-12-03 | 2005-07-07 | Pac Tech - Packaging Technologies Gmbh | Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern |
DE102004030813B4 (de) * | 2004-06-25 | 2007-03-29 | Infineon Technologies Ag | Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung |
US7980444B2 (en) * | 2006-05-09 | 2011-07-19 | Panasonic Corporation | Electronic component mounting head, and apparatus and method for mounting electronic component |
CA2659987A1 (en) * | 2006-07-20 | 2008-01-24 | Wms Gaming Inc. | Wagering game with special-event eligibility feature based on passive game play |
DE102006060719A1 (de) * | 2006-12-21 | 2008-06-26 | Infineon Technologies Ag | Chipkartenmodul und Verfahren zur Herstellung eines Chipkartenmoduls |
JP5428339B2 (ja) * | 2007-10-26 | 2014-02-26 | 東レ株式会社 | 平面アンテナおよびその製造方法 |
US20090155958A1 (en) * | 2007-12-13 | 2009-06-18 | Boris Kolodin | Robust die bonding process for led dies |
US20140097003A1 (en) * | 2012-10-05 | 2014-04-10 | Tyco Electronics Amp Gmbh | Electrical components and methods and systems of manufacturing electrical components |
US20230319971A1 (en) * | 2022-03-30 | 2023-10-05 | Applied Materials, Inc. | Methods of manufacturing plasma generating cells for a plasma source |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3486223A (en) * | 1967-04-27 | 1969-12-30 | Philco Ford Corp | Solder bonding |
US3717743A (en) * | 1970-12-07 | 1973-02-20 | Argus Eng Co | Method and apparatus for heat-bonding in a local area using combined heating techniques |
DE2330161A1 (de) * | 1973-06-08 | 1974-12-19 | Minnesota Mining & Mfg | Verbesserte schaltkreise und verfahren zu deren herstellung |
DE2343235B2 (de) * | 1973-08-28 | 1978-09-28 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zur Befestigung und Kontaktierung von elektrischen Subminiatur-Bauelementen auf gedruckten Schaltungen |
GB1583192A (en) * | 1978-04-26 | 1981-01-21 | Atomic Energy Authority Uk | Processing of printed circuit boards |
DE3701013C2 (de) * | 1987-01-15 | 1989-02-16 | Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De | |
DE3839396A1 (de) * | 1988-11-22 | 1990-05-23 | Nixdorf Computer Ag | Verfahren und einrichtung zum verloeten von auf einer leiterplatte aufliegenden elektrischen bauelementen mit der leiterplatte |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5190568A (en) * | 1975-02-07 | 1976-08-09 | Handotaisochino seizohoho | |
JPS5925378B2 (ja) * | 1980-05-23 | 1984-06-16 | 松下電器産業株式会社 | 電子部品の実装方法 |
JPS57106141A (en) * | 1980-12-24 | 1982-07-01 | Fujitsu Ltd | Connecting method for hybrid integrated circuit substrate to semiconductor pellet |
JPS62194652A (ja) * | 1986-02-21 | 1987-08-27 | Hitachi Ltd | 半導体装置 |
JPH074995B2 (ja) * | 1986-05-20 | 1995-01-25 | 株式会社東芝 | Icカ−ド及びその製造方法 |
JP2545899B2 (ja) * | 1987-12-17 | 1996-10-23 | ソニー株式会社 | 固体撮像装置とその製造方法 |
JPH02143466A (ja) * | 1988-11-25 | 1990-06-01 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
US5071787A (en) * | 1989-03-14 | 1991-12-10 | Kabushiki Kaisha Toshiba | Semiconductor device utilizing a face-down bonding and a method for manufacturing the same |
JP2933672B2 (ja) * | 1990-04-09 | 1999-08-16 | 沖電気工業株式会社 | 半導体装置のバンプ高さ修正方法 |
-
1990
- 1990-05-24 JP JP2134783A patent/JPH0429338A/ja active Pending
-
1991
- 1991-05-22 WO PCT/JP1991/000680 patent/WO1991018415A1/ja active Application Filing
- 1991-05-22 US US07/776,340 patent/US5250469A/en not_active Expired - Lifetime
- 1991-05-22 DE DE19914191065 patent/DE4191065T/de not_active Ceased
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3486223A (en) * | 1967-04-27 | 1969-12-30 | Philco Ford Corp | Solder bonding |
US3717743A (en) * | 1970-12-07 | 1973-02-20 | Argus Eng Co | Method and apparatus for heat-bonding in a local area using combined heating techniques |
DE2330161A1 (de) * | 1973-06-08 | 1974-12-19 | Minnesota Mining & Mfg | Verbesserte schaltkreise und verfahren zu deren herstellung |
DE2343235B2 (de) * | 1973-08-28 | 1978-09-28 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zur Befestigung und Kontaktierung von elektrischen Subminiatur-Bauelementen auf gedruckten Schaltungen |
GB1583192A (en) * | 1978-04-26 | 1981-01-21 | Atomic Energy Authority Uk | Processing of printed circuit boards |
DE3701013C2 (de) * | 1987-01-15 | 1989-02-16 | Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De | |
DE3839396A1 (de) * | 1988-11-22 | 1990-05-23 | Nixdorf Computer Ag | Verfahren und einrichtung zum verloeten von auf einer leiterplatte aufliegenden elektrischen bauelementen mit der leiterplatte |
Also Published As
Publication number | Publication date |
---|---|
US5250469A (en) | 1993-10-05 |
WO1991018415A1 (en) | 1991-11-28 |
JPH0429338A (ja) | 1992-01-31 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8131 | Rejection |