DE3881973D1 - Mehrschichtschaltungsplatte. - Google Patents
Mehrschichtschaltungsplatte.Info
- Publication number
- DE3881973D1 DE3881973D1 DE8888303715T DE3881973T DE3881973D1 DE 3881973 D1 DE3881973 D1 DE 3881973D1 DE 8888303715 T DE8888303715 T DE 8888303715T DE 3881973 T DE3881973 T DE 3881973T DE 3881973 D1 DE3881973 D1 DE 3881973D1
- Authority
- DE
- Germany
- Prior art keywords
- layer board
- board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987109602U JPH0316299Y2 (de) | 1987-07-17 | 1987-07-17 | |
JP10960187U JPS6413765U (de) | 1987-07-17 | 1987-07-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3881973D1 true DE3881973D1 (de) | 1993-07-29 |
DE3881973T2 DE3881973T2 (de) | 1993-10-14 |
Family
ID=26449334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88303715T Expired - Fee Related DE3881973T2 (de) | 1987-07-17 | 1988-04-25 | Mehrschichtschaltungsplatte. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5136123A (de) |
EP (1) | EP0299595B1 (de) |
DE (1) | DE3881973T2 (de) |
GB (1) | GB2207287B (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02296389A (ja) * | 1989-05-11 | 1990-12-06 | Japan Gore Tex Inc | 印刷回路基板 |
JP3061059B2 (ja) * | 1989-08-07 | 2000-07-10 | ジャパンゴアテックス株式会社 | Icパッケージ |
US5311406A (en) * | 1991-10-30 | 1994-05-10 | Honeywell Inc. | Microstrip printed wiring board and a method for making same |
US5235132A (en) * | 1992-01-29 | 1993-08-10 | W. L. Gore & Associates, Inc. | Externally and internally shielded double-layered flat cable assembly |
JPH05327192A (ja) * | 1992-05-15 | 1993-12-10 | Cmk Corp | フレキシブルプリント配線板の製造方法 |
JP3113153B2 (ja) * | 1994-07-26 | 2000-11-27 | 株式会社東芝 | 多層配線構造の半導体装置 |
US5847324A (en) * | 1996-04-01 | 1998-12-08 | International Business Machines Corporation | High performance electrical cable |
US6492595B2 (en) | 1997-10-01 | 2002-12-10 | Decorp Americas, Inc. | Flat surface-mounted multi-purpose wire |
US6110576A (en) * | 1998-10-16 | 2000-08-29 | Lucent Technologies Inc. | Article comprising molded circuit |
US6310398B1 (en) | 1998-12-03 | 2001-10-30 | Walter M. Katz | Routable high-density interfaces for integrated circuit devices |
JP3973340B2 (ja) * | 1999-10-05 | 2007-09-12 | Necエレクトロニクス株式会社 | 半導体装置、配線基板、及び、それらの製造方法 |
JP3617388B2 (ja) * | 1999-10-20 | 2005-02-02 | 日本電気株式会社 | プリント配線板及びその製造方法 |
JP2003078244A (ja) | 2001-06-18 | 2003-03-14 | Nitto Denko Corp | 多層配線基板及びその製造方法 |
JP4063533B2 (ja) * | 2001-12-10 | 2008-03-19 | 日本碍子株式会社 | フレキシブル配線板 |
AU2003223783A1 (en) * | 2002-04-29 | 2003-11-17 | Silicon Pipe, Inc. | Direct-connect signaling system |
US7750446B2 (en) | 2002-04-29 | 2010-07-06 | Interconnect Portfolio Llc | IC package structures having separate circuit interconnection structures and assemblies constructed thereof |
JP3876770B2 (ja) * | 2002-06-07 | 2007-02-07 | 日産自動車株式会社 | 配線構造 |
US6891272B1 (en) | 2002-07-31 | 2005-05-10 | Silicon Pipe, Inc. | Multi-path via interconnection structures and methods for manufacturing the same |
US7014472B2 (en) * | 2003-01-13 | 2006-03-21 | Siliconpipe, Inc. | System for making high-speed connections to board-mounted modules |
US8237051B2 (en) * | 2003-09-05 | 2012-08-07 | Newire, Inc. | Flat wire extension cords and extension cord devices |
US7145073B2 (en) * | 2003-09-05 | 2006-12-05 | Southwire Company | Electrical wire and method of fabricating the electrical wire |
US7217884B2 (en) * | 2004-03-02 | 2007-05-15 | Southwire Company | Electrical wire and method of fabricating the electrical wire |
US7737359B2 (en) * | 2003-09-05 | 2010-06-15 | Newire Inc. | Electrical wire and method of fabricating the electrical wire |
US7378598B2 (en) * | 2004-02-19 | 2008-05-27 | Hewlett-Packard Development Company, L.P. | Printed circuit board substrate and method for constructing same |
US20110036615A1 (en) * | 2004-12-01 | 2011-02-17 | Molex Incorporated | Flexible flat circuitry |
TWI445463B (zh) * | 2011-03-10 | 2014-07-11 | Hon Hai Prec Ind Co Ltd | 電路板及使用該電路板的電子裝置 |
CN102686010B (zh) * | 2011-03-11 | 2015-12-16 | 鸿富锦精密工业(深圳)有限公司 | 电路板及使用该电路板的电子装置 |
DE102017210704A1 (de) * | 2017-06-26 | 2018-12-27 | Siemens Aktiengesellschaft | Elektrische Baugruppe und Verfahren zu deren Herstellung |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3740678A (en) * | 1971-03-19 | 1973-06-19 | Ibm | Strip transmission line structures |
US3777221A (en) * | 1972-12-18 | 1973-12-04 | Ibm | Multi-layer circuit package |
DE2644252A1 (de) * | 1976-09-28 | 1978-03-30 | Siemens Ag | Flachbandleitung mit folienfoermigen durchbrochenen metallischen einlagen |
JPS5831753B2 (ja) * | 1979-02-02 | 1983-07-08 | 鐘淵化学工業株式会社 | 電気用絶縁積層板及び印刷回路用金属箔張り積層板 |
JPS56158502A (en) * | 1980-05-12 | 1981-12-07 | Junkosha Co Ltd | Strip line |
JPS56161701A (en) * | 1980-05-16 | 1981-12-12 | Hirokatsu Tsukidate | Thin and flexible microstrip line |
US4423282A (en) * | 1981-06-29 | 1983-12-27 | Hirosuke Suzuki | Flat cable |
US4490690A (en) * | 1982-04-22 | 1984-12-25 | Junkosha Company, Ltd. | Strip line cable |
US4560962A (en) * | 1983-08-30 | 1985-12-24 | Burroughs Corporation | Multilayered printed circuit board with controlled 100 ohm impedance |
JPS6050425U (ja) * | 1983-09-14 | 1985-04-09 | 株式会社 潤工社 | フラツトケ−ブル |
JPS60214941A (ja) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | プリント基板 |
JPS60169904U (ja) * | 1984-04-20 | 1985-11-11 | 株式会社 潤工社 | ストリップラインケーブル |
JPS60225750A (ja) * | 1984-04-24 | 1985-11-11 | 株式会社 潤工社 | プリント基板 |
JPH023631Y2 (de) * | 1984-12-28 | 1990-01-29 | ||
JPS61220499A (ja) * | 1985-03-27 | 1986-09-30 | 株式会社日立製作所 | 混成多層配線基板 |
US4707671A (en) * | 1985-05-31 | 1987-11-17 | Junkosha Co., Ltd. | Electrical transmission line |
JPS61281406A (ja) * | 1985-06-06 | 1986-12-11 | 株式会社 潤工社 | 伝送線路 |
US4770922A (en) * | 1987-04-13 | 1988-09-13 | Japan Gore-Tex, Inc. | Printed circuit board base material |
US4755911A (en) * | 1987-04-28 | 1988-07-05 | Junkosha Co., Ltd. | Multilayer printed circuit board |
-
1988
- 1988-03-23 US US07/172,256 patent/US5136123A/en not_active Expired - Lifetime
- 1988-04-25 GB GB8809737A patent/GB2207287B/en not_active Expired - Fee Related
- 1988-04-25 DE DE88303715T patent/DE3881973T2/de not_active Expired - Fee Related
- 1988-04-25 EP EP88303715A patent/EP0299595B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0299595B1 (de) | 1993-06-23 |
GB8809737D0 (en) | 1988-06-02 |
GB2207287B (en) | 1990-11-21 |
EP0299595A3 (en) | 1989-08-16 |
US5136123A (en) | 1992-08-04 |
GB2207287A (en) | 1989-01-25 |
DE3881973T2 (de) | 1993-10-14 |
EP0299595A2 (de) | 1989-01-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |