DE69007452D1 - Mehrlagenschaltungsstruktur. - Google Patents
Mehrlagenschaltungsstruktur.Info
- Publication number
- DE69007452D1 DE69007452D1 DE90314045T DE69007452T DE69007452D1 DE 69007452 D1 DE69007452 D1 DE 69007452D1 DE 90314045 T DE90314045 T DE 90314045T DE 69007452 T DE69007452 T DE 69007452T DE 69007452 D1 DE69007452 D1 DE 69007452D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit structure
- layer circuit
- layer
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09318—Core having one signal plane and one power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/459,087 US5121299A (en) | 1989-12-29 | 1989-12-29 | Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69007452D1 true DE69007452D1 (de) | 1994-04-21 |
DE69007452T2 DE69007452T2 (de) | 1994-10-06 |
Family
ID=23823351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69007452T Expired - Fee Related DE69007452T2 (de) | 1989-12-29 | 1990-12-20 | Mehrlagenschaltungsstruktur. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5121299A (de) |
EP (1) | EP0435584B1 (de) |
JP (1) | JPH0724337B2 (de) |
DE (1) | DE69007452T2 (de) |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5597313A (en) * | 1986-06-19 | 1997-01-28 | Labinal Components And Systems, Inc. | Electrical connectors |
US5672062A (en) * | 1991-01-30 | 1997-09-30 | Labinal Components And Systems, Inc. | Electrical connectors |
US5704794A (en) * | 1986-12-29 | 1998-01-06 | Labinal Components And Systems, Inc. | Electrical connectors |
JPH045844A (ja) * | 1990-04-23 | 1992-01-09 | Nippon Mektron Ltd | Ic搭載用多層回路基板及びその製造法 |
JP2673993B2 (ja) * | 1990-07-02 | 1997-11-05 | 日本無線株式会社 | 表面弾性波装置 |
JPH04170811A (ja) * | 1990-11-05 | 1992-06-18 | Fujitsu Ltd | 弾性表面波デバイス |
FR2669500B1 (fr) * | 1990-11-16 | 1996-06-14 | Commissariat Energie Atomique | Circuit hybride forme de deux circuits dont les pistes sont reliees par des billes de connexion electrique |
WO1993003591A1 (en) * | 1991-07-31 | 1993-02-18 | Cambridge Management Corporation | Close-packed impedance-controlled connectors |
US5677515A (en) * | 1991-10-18 | 1997-10-14 | Trw Inc. | Shielded multilayer printed wiring board, high frequency, high isolation |
US5315239A (en) * | 1991-12-16 | 1994-05-24 | Hughes Aircraft Company | Circuit module connections |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
US5367764A (en) * | 1991-12-31 | 1994-11-29 | Tessera, Inc. | Method of making a multi-layer circuit assembly |
US5245750A (en) * | 1992-02-28 | 1993-09-21 | Hughes Aircraft Company | Method of connecting a spaced ic chip to a conductor and the article thereby obtained |
US5213511A (en) * | 1992-03-27 | 1993-05-25 | Hughes Aircraft Company | Dimple interconnect for flat cables and printed wiring boards |
US5401911A (en) * | 1992-04-03 | 1995-03-28 | International Business Machines Corporation | Via and pad structure for thermoplastic substrates and method and apparatus for forming the same |
US5245135A (en) * | 1992-04-20 | 1993-09-14 | Hughes Aircraft Company | Stackable high density interconnection mechanism (SHIM) |
JPH0627132A (ja) * | 1992-07-08 | 1994-02-04 | Takata Kk | メカニカル加速度センサ及びそれを用いたガス圧起動装置 |
DE4225138A1 (de) * | 1992-07-30 | 1994-02-03 | Daimler Benz Ag | Multichipmodul und Verfahren zu dessen Herstellung |
USH1471H (en) * | 1993-04-26 | 1995-08-01 | Braun David J | Metal substrate double sided circuit board |
US5495397A (en) * | 1993-04-27 | 1996-02-27 | International Business Machines Corporation | Three dimensional package and architecture for high performance computer |
US5432675A (en) * | 1993-11-15 | 1995-07-11 | Fujitsu Limited | Multi-chip module having thermal contacts |
CA2135241C (en) * | 1993-12-17 | 1998-08-04 | Mohi Sobhani | Cavity and bump interconnection structure for electronic packages |
US5435482A (en) * | 1994-02-04 | 1995-07-25 | Lsi Logic Corporation | Integrated circuit having a coplanar solder ball contact array |
JP2570617B2 (ja) * | 1994-05-13 | 1997-01-08 | 日本電気株式会社 | 多層配線セラミック基板のビア構造及びその製造方法 |
WO1996008037A1 (en) * | 1994-09-06 | 1996-03-14 | Sheldahl, Inc. | Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture |
US5567653A (en) * | 1994-09-14 | 1996-10-22 | International Business Machines Corporation | Process for aligning etch masks on an integrated circuit surface using electromagnetic energy |
US5509200A (en) * | 1994-11-21 | 1996-04-23 | International Business Machines Corporation | Method of making laminar stackable circuit board structure |
US5745333A (en) * | 1994-11-21 | 1998-04-28 | International Business Machines Corporation | Laminar stackable circuit board structure with capacitor |
US5629837A (en) * | 1995-09-20 | 1997-05-13 | Oz Technologies, Inc. | Button contact for surface mounting an IC device to a circuit board |
US5754405A (en) * | 1995-11-20 | 1998-05-19 | Mitsubishi Semiconductor America, Inc. | Stacked dual in-line package assembly |
US5938455A (en) * | 1996-05-15 | 1999-08-17 | Ford Motor Company | Three-dimensional molded circuit board having interlocking connections |
SE516011C2 (sv) * | 1996-12-19 | 2001-11-05 | Ericsson Telefon Ab L M | Tätpackade elektriska kontaktdon |
US5897335A (en) * | 1997-02-04 | 1999-04-27 | Integrated Device Technology, Inc. | Flip-chip bonding method |
US5818697A (en) * | 1997-03-21 | 1998-10-06 | International Business Machines Corporation | Flexible thin film ball grid array containing solder mask |
US6521845B1 (en) * | 1997-06-12 | 2003-02-18 | Intel Corporation | Thermal spreading enhancements for motherboards using PBGAs |
US6288451B1 (en) * | 1998-06-24 | 2001-09-11 | Vanguard International Semiconductor Corporation | Flip-chip package utilizing a printed circuit board having a roughened surface for increasing bond strength |
US6198634B1 (en) | 1999-03-31 | 2001-03-06 | International Business Machines Corporation | Electronic package with stacked connections |
SE521704C2 (sv) * | 1999-10-29 | 2003-11-25 | Ericsson Telefon Ab L M | Förfarande för att anordna koppling mellan olika skikt i ett kretskort samt kretskort |
US6954986B2 (en) | 2000-03-31 | 2005-10-18 | Dyconex Ag | Method for fabricating electrical connecting element |
JP4590088B2 (ja) * | 2000-11-22 | 2010-12-01 | ソニーケミカル&インフォメーションデバイス株式会社 | フレキシブル基板素片、及び、多層フレキシブル配線板 |
US6921869B2 (en) * | 2001-09-26 | 2005-07-26 | Fujikura Ltd. | Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof |
TW530377B (en) * | 2002-05-28 | 2003-05-01 | Via Tech Inc | Structure of laminated substrate with high integration and method of production thereof |
EP1383366A1 (de) * | 2002-07-17 | 2004-01-21 | Printprocess AG | Verfahren und Vorrichtung zum Fixieren der einzelnen Lagen einer mehrlagigen Leiterplatte |
JP2006518944A (ja) * | 2003-02-25 | 2006-08-17 | テッセラ,インコーポレイテッド | バンプを有するボールグリッドアレー |
US7380338B2 (en) * | 2005-06-22 | 2008-06-03 | Gigno Technology Co., Ltd. | Circuit board and manufacturing method thereof |
JP4359257B2 (ja) * | 2004-07-06 | 2009-11-04 | 三星電機株式会社 | Bgaパッケージおよびその製造方法 |
JP4287458B2 (ja) * | 2005-11-16 | 2009-07-01 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | ペーストバンプを用いた印刷回路基板およびその製造方法 |
CN101385403B (zh) * | 2006-02-09 | 2012-08-08 | 日立化成工业株式会社 | 多层布线板的制造方法 |
DE102006015198A1 (de) * | 2006-04-01 | 2007-10-11 | Semikron Elektronik Gmbh & Co. Kg | Verbindungseinrichtung für elektronische Bauelemente |
US7928582B2 (en) | 2007-03-09 | 2011-04-19 | Micron Technology, Inc. | Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces |
KR100872131B1 (ko) * | 2007-07-10 | 2008-12-08 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
WO2009041159A1 (ja) * | 2007-09-28 | 2009-04-02 | Sanyo Electric Co., Ltd. | 素子搭載用基板及びその製造方法、回路装置及びその製造方法、携帯機器 |
FR2925222B1 (fr) * | 2007-12-17 | 2010-04-16 | Commissariat Energie Atomique | Procede de realisation d'une interconnexion electrique entre deux couches conductrices |
JP2009246166A (ja) * | 2008-03-31 | 2009-10-22 | Fujitsu Ltd | 電子部品パッケージおよび基板ユニット並びにプリント配線板およびその製造方法 |
JP5077324B2 (ja) * | 2009-10-26 | 2012-11-21 | 株式会社デンソー | 配線基板 |
DE102011122037A1 (de) * | 2011-12-22 | 2013-06-27 | Kathrein-Werke Kg | Verfahren zur Herstellung einer elektrischen Hochfrequenz-Verbindung zwischen zwei Plattenabschnitten sowie eine zugehörige elektrische Hochfrequenz-Verbindung |
US9553053B2 (en) | 2012-07-25 | 2017-01-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bump structure for yield improvement |
JP6760796B2 (ja) * | 2016-08-24 | 2020-09-23 | 京セラ株式会社 | 電子素子実装用基板、電子装置および電子モジュール |
FR3065616B1 (fr) * | 2017-04-20 | 2019-09-06 | Auxel | Procede de fabrication d'un circuit multicouches |
FR3065617B1 (fr) * | 2017-04-20 | 2022-01-21 | Auxel | Procede de fabrication d'un circuit multicouches pour la distribution de courant electrique |
CN109673112B (zh) * | 2017-10-13 | 2021-08-20 | 鹏鼎控股(深圳)股份有限公司 | 柔性电路板以及柔性电路板的制作方法 |
US10790236B2 (en) * | 2018-04-05 | 2020-09-29 | Shinko Electric Industries Co., Ltd. | Wiring substrate and electronic device |
WO2022261970A1 (zh) * | 2021-06-18 | 2022-12-22 | 庆鼎精密电子(淮安)有限公司 | 电路板组件及其制作方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3436819A (en) * | 1965-09-22 | 1969-04-08 | Litton Systems Inc | Multilayer laminate |
US3606677A (en) * | 1967-12-26 | 1971-09-21 | Rca Corp | Multilayer circuit board techniques |
US3795047A (en) * | 1972-06-15 | 1974-03-05 | Ibm | Electrical interconnect structuring for laminate assemblies and fabricating methods therefor |
US4074342A (en) * | 1974-12-20 | 1978-02-14 | International Business Machines Corporation | Electrical package for lsi devices and assembly process therefor |
JPS5446376A (en) * | 1977-09-20 | 1979-04-12 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
US4191789A (en) * | 1978-11-02 | 1980-03-04 | Bell Telephone Laboratories, Incorporated | Fabrication of bi-level circuits |
US4496793A (en) * | 1980-06-25 | 1985-01-29 | General Electric Company | Multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion |
US4617730A (en) * | 1984-08-13 | 1986-10-21 | International Business Machines Corporation | Method of fabricating a chip interposer |
NL8403755A (nl) * | 1984-12-11 | 1986-07-01 | Philips Nv | Werkwijze voor de vervaardiging van een meerlaags gedrukte bedrading met doorverbonden sporen in verschillende lagen en meerlaags gedrukte bedrading vervaardigd volgens de werkwijze. |
JPS61159793A (ja) * | 1984-12-31 | 1986-07-19 | 株式会社 アサヒ化学研究所 | 基板に導電回路を形成する方法 |
JPH0754872B2 (ja) * | 1987-06-22 | 1995-06-07 | 古河電気工業株式会社 | 二層印刷回路シ−トの製造方法 |
US4963697A (en) * | 1988-02-12 | 1990-10-16 | Texas Instruments Incorporated | Advanced polymers on metal printed wiring board |
US4882454A (en) * | 1988-02-12 | 1989-11-21 | Texas Instruments Incorporated | Thermal interface for a printed wiring board |
US4967314A (en) * | 1988-03-28 | 1990-10-30 | Prime Computer Inc. | Circuit board construction |
-
1989
- 1989-12-29 US US07/459,087 patent/US5121299A/en not_active Expired - Fee Related
-
1990
- 1990-11-07 JP JP2299981A patent/JPH0724337B2/ja not_active Expired - Lifetime
- 1990-12-20 DE DE69007452T patent/DE69007452T2/de not_active Expired - Fee Related
- 1990-12-20 EP EP90314045A patent/EP0435584B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5121299A (en) | 1992-06-09 |
DE69007452T2 (de) | 1994-10-06 |
JPH03211792A (ja) | 1991-09-17 |
EP0435584A1 (de) | 1991-07-03 |
JPH0724337B2 (ja) | 1995-03-15 |
EP0435584B1 (de) | 1994-03-16 |
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