DE3854677D1 - Komplementäre Feldeffekttransistorstruktur. - Google Patents

Komplementäre Feldeffekttransistorstruktur.

Info

Publication number
DE3854677D1
DE3854677D1 DE3854677T DE3854677T DE3854677D1 DE 3854677 D1 DE3854677 D1 DE 3854677D1 DE 3854677 T DE3854677 T DE 3854677T DE 3854677 T DE3854677 T DE 3854677T DE 3854677 D1 DE3854677 D1 DE 3854677D1
Authority
DE
Germany
Prior art keywords
field effect
effect transistor
transistor structure
complementary field
complementary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3854677T
Other languages
English (en)
Other versions
DE3854677T2 (de
Inventor
Toshiyuki Ishijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE3854677D1 publication Critical patent/DE3854677D1/de
Publication of DE3854677T2 publication Critical patent/DE3854677T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823871—Complementary field-effect transistors, e.g. CMOS interconnection or wiring or contact manufacturing related aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/903—FET configuration adapted for use as static memory cell

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
DE3854677T 1987-03-26 1988-03-24 Komplementäre Feldeffekttransistorstruktur. Expired - Fee Related DE3854677T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62073241A JPH0687500B2 (ja) 1987-03-26 1987-03-26 半導体記憶装置およびその製造方法

Publications (2)

Publication Number Publication Date
DE3854677D1 true DE3854677D1 (de) 1995-12-21
DE3854677T2 DE3854677T2 (de) 1996-07-04

Family

ID=13512485

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3854677T Expired - Fee Related DE3854677T2 (de) 1987-03-26 1988-03-24 Komplementäre Feldeffekttransistorstruktur.

Country Status (4)

Country Link
US (1) US4920397A (de)
EP (1) EP0284065B1 (de)
JP (1) JPH0687500B2 (de)
DE (1) DE3854677T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610968B2 (ja) * 1987-12-21 1997-05-14 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体装置
JP2825244B2 (ja) * 1988-12-09 1998-11-18 株式会社東芝 半導体装置
US5258635A (en) * 1988-09-06 1993-11-02 Kabushiki Kaisha Toshiba MOS-type semiconductor integrated circuit device
US5181088A (en) * 1988-09-14 1993-01-19 Kabushiki Kaisha Toshiba Vertical field effect transistor with an extended polysilicon channel region
US5233223A (en) * 1989-01-09 1993-08-03 Nec Corporation Semiconductor device having a plurality of conductive layers interconnected via a tungsten plug
JPH088313B2 (ja) * 1989-07-25 1996-01-29 株式会社東芝 不揮発性半導体記憶装置及びその製造方法
US5036378A (en) * 1989-11-01 1991-07-30 At&T Bell Laboratories Memory device
US5192989A (en) * 1989-11-28 1993-03-09 Nissan Motor Co., Ltd. Lateral dmos fet device with reduced on resistance
JPH07120800B2 (ja) * 1990-01-25 1995-12-20 株式会社東芝 半導体装置およびその製造方法
MY107475A (en) * 1990-05-31 1995-12-30 Canon Kk Semiconductor device and method for producing the same.
JP3307928B2 (ja) * 1991-01-09 2002-07-29 シーメンス アクチエンゲゼルシヤフト メモリセル装置およびその作動方法
US5243206A (en) * 1991-07-02 1993-09-07 Motorola, Inc. Logic circuit using vertically stacked heterojunction field effect transistors
US5324973A (en) * 1993-05-03 1994-06-28 Motorola Inc. Semiconductor SRAM with trench transistors
JP3403231B2 (ja) * 1993-05-12 2003-05-06 三菱電機株式会社 半導体装置およびその製造方法
JPH07245343A (ja) * 1994-03-03 1995-09-19 Toshiba Corp 半導体装置及びその製造方法
US5670803A (en) * 1995-02-08 1997-09-23 International Business Machines Corporation Three-dimensional SRAM trench structure and fabrication method therefor
US5981995A (en) * 1997-06-13 1999-11-09 Advanced Micro Devices, Inc. Static random access memory cell having buried sidewall transistors, buried bit lines, and buried vdd and vss nodes
US6459123B1 (en) * 1999-04-30 2002-10-01 Infineon Technologies Richmond, Lp Double gated transistor
US6903411B1 (en) * 2000-08-25 2005-06-07 Agere Systems Inc. Architecture for circuit connection of a vertical transistor
JP2008177278A (ja) * 2007-01-17 2008-07-31 Toshiba Corp スタティック型半導体記憶装置
US8097930B2 (en) * 2008-08-08 2012-01-17 Infineon Technologies Ag Semiconductor devices with trench isolations
JP2012019093A (ja) * 2010-07-08 2012-01-26 Sharp Corp 半導体装置及びその製造方法
US8796751B2 (en) 2012-11-20 2014-08-05 Micron Technology, Inc. Transistors, memory cells and semiconductor constructions
CN104091767B (zh) * 2014-06-25 2016-11-02 京东方科技集团股份有限公司 离子注入的监控方法
CN107256827A (zh) * 2017-07-07 2017-10-17 上海华虹宏力半导体制造有限公司 离子注入机工艺能力的监控方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4554570A (en) * 1982-06-24 1985-11-19 Rca Corporation Vertically integrated IGFET device
DE3380377D1 (en) * 1982-06-24 1989-09-14 Harris Semiconductor Patents Vertical igfet device and method for fabricating same
JPS60128654A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 半導体集積回路
US4672410A (en) * 1984-07-12 1987-06-09 Nippon Telegraph & Telephone Semiconductor memory device with trench surrounding each memory cell
JPS6135554A (ja) * 1984-07-28 1986-02-20 Nippon Telegr & Teleph Corp <Ntt> 読出し専用メモリ−およびその製造方法
JPS6169165A (ja) * 1984-09-12 1986-04-09 Toshiba Corp 相補型半導体装置及びその製造方法
JP2511399B2 (ja) * 1985-06-19 1996-06-26 日本電気株式会社 半導体装置およびその製造方法
JPS6220366A (ja) * 1985-07-18 1987-01-28 Nec Corp 半導体装置
US4740826A (en) * 1985-09-25 1988-04-26 Texas Instruments Incorporated Vertical inverter

Also Published As

Publication number Publication date
DE3854677T2 (de) 1996-07-04
US4920397A (en) 1990-04-24
EP0284065A2 (de) 1988-09-28
JPH0687500B2 (ja) 1994-11-02
EP0284065A3 (de) 1991-01-16
JPS63237561A (ja) 1988-10-04
EP0284065B1 (de) 1995-11-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee