DE3850467D1 - Anzeigevorrichtung. - Google Patents
Anzeigevorrichtung.Info
- Publication number
- DE3850467D1 DE3850467D1 DE3850467T DE3850467T DE3850467D1 DE 3850467 D1 DE3850467 D1 DE 3850467D1 DE 3850467 T DE3850467 T DE 3850467T DE 3850467 T DE3850467 T DE 3850467T DE 3850467 D1 DE3850467 D1 DE 3850467D1
- Authority
- DE
- Germany
- Prior art keywords
- display device
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987137714U JPH0428145Y2 (de) | 1987-09-09 | 1987-09-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3850467D1 true DE3850467D1 (de) | 1994-08-04 |
DE3850467T2 DE3850467T2 (de) | 1995-01-05 |
Family
ID=15205106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3850467T Expired - Lifetime DE3850467T2 (de) | 1987-09-09 | 1988-09-09 | Anzeigevorrichtung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4985663A (de) |
EP (1) | EP0307231B1 (de) |
JP (1) | JPH0428145Y2 (de) |
DE (1) | DE3850467T2 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130833A (en) * | 1989-09-01 | 1992-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal device and manufacturing method therefor |
JP2776051B2 (ja) * | 1991-05-09 | 1998-07-16 | 三菱電機株式会社 | 半導体装置 |
JP3035021B2 (ja) * | 1991-08-29 | 2000-04-17 | 株式会社リコー | 液晶表示素子およびその製造方法 |
JP2745933B2 (ja) * | 1992-02-17 | 1998-04-28 | 日本電気株式会社 | Tab−集積回路 |
JP2727862B2 (ja) * | 1992-04-28 | 1998-03-18 | 日本電気株式会社 | 接続テープおよびフィルムキャリア型icならびに接続方法 |
JP2878066B2 (ja) | 1993-05-24 | 1999-04-05 | シャープ株式会社 | 印刷回路基板の接続方法 |
JPH0756184A (ja) * | 1993-08-12 | 1995-03-03 | Sharp Corp | 表示装置 |
US7081938B1 (en) * | 1993-12-03 | 2006-07-25 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
US5637176A (en) * | 1994-06-16 | 1997-06-10 | Fry's Metals, Inc. | Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials |
US5531942A (en) * | 1994-06-16 | 1996-07-02 | Fry's Metals, Inc. | Method of making electroconductive adhesive particles for Z-axis application |
JP3536571B2 (ja) * | 1996-03-27 | 2004-06-14 | セイコーエプソン株式会社 | 駆動用ic、液晶装置及び電子機器 |
JPH103987A (ja) * | 1996-06-12 | 1998-01-06 | Futaba Corp | 有機エレクトロルミネッセンス素子 |
US6086441A (en) * | 1997-04-30 | 2000-07-11 | Matsushita Electric Industrial Co., Ltd. | Method for connecting electrodes of plasma display panel |
JPH11160734A (ja) * | 1997-11-28 | 1999-06-18 | Semiconductor Energy Lab Co Ltd | 液晶電気光学装置 |
JP2000002882A (ja) * | 1998-06-16 | 2000-01-07 | Toshiba Electronic Engineering Corp | 液晶表示装置及びその製造方法 |
KR100324283B1 (ko) * | 2000-02-23 | 2002-02-21 | 구본준, 론 위라하디락사 | 테이프 캐리어 패키지 및 그 제조방법 |
JP3525918B2 (ja) * | 2000-10-31 | 2004-05-10 | セイコーエプソン株式会社 | 電気光学装置、その検査方法および電子機器 |
DE10061722A1 (de) * | 2000-12-12 | 2002-06-13 | Philips Corp Intellectual Pty | Plasmabildschirm |
JP2002196298A (ja) * | 2000-12-22 | 2002-07-12 | Fujitsu Ltd | 液晶表示ユニットとその製造方法 |
KR100404200B1 (ko) * | 2001-07-12 | 2003-11-03 | 엘지전자 주식회사 | 유기 el 디스플레이 패널 |
JP3749147B2 (ja) * | 2001-07-27 | 2006-02-22 | シャープ株式会社 | 表示装置 |
US6849935B2 (en) | 2002-05-10 | 2005-02-01 | Sarnoff Corporation | Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
USRE41914E1 (en) | 2002-05-10 | 2010-11-09 | Ponnusamy Palanisamy | Thermal management in electronic displays |
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
WO2005003684A1 (de) | 2003-07-04 | 2005-01-13 | Siemens Aktiengesellschaft | Verfahren zum abgleich eines drehratensensors |
KR100571218B1 (ko) * | 2003-07-15 | 2006-04-13 | 엘지전자 주식회사 | 접속 부재 및 플라즈마 디스플레이 패널 구동 장치 |
KR101061853B1 (ko) * | 2003-08-29 | 2011-09-02 | 삼성전자주식회사 | 표시 장치 및 그 표시판 |
JP4413637B2 (ja) * | 2004-02-12 | 2010-02-10 | 株式会社 日立ディスプレイズ | 表示装置 |
JP4920204B2 (ja) | 2005-06-24 | 2012-04-18 | 富士電機株式会社 | 半導体装置 |
KR100927613B1 (ko) * | 2005-08-17 | 2009-11-23 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널 |
US7576713B2 (en) | 2006-04-25 | 2009-08-18 | Lg Electronics Inc. | Plasma display apparatus |
EP1850312A1 (de) * | 2006-04-26 | 2007-10-31 | LG Electronics Inc. | Plasmaanzeigevorrichtung |
KR100741131B1 (ko) * | 2006-06-20 | 2007-07-19 | 삼성에스디아이 주식회사 | 플라즈마 표시장치 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4113981A (en) * | 1974-08-14 | 1978-09-12 | Kabushiki Kaisha Seikosha | Electrically conductive adhesive connecting arrays of conductors |
US4400709A (en) * | 1979-07-13 | 1983-08-23 | Compagnie Industrielle Des Telecommunications Cit-Alcatel | Image printer stylus bar, manufacturing method therefor and image printer device |
EP0110382A3 (de) * | 1982-12-01 | 1987-01-07 | Asahi Glass Company Ltd. | Anzeigevorrichtung und Verfahren zu deren Herstellung und Abziehbild zur Herstellung eines Anzeigepaneelendstücks |
JPS60103328A (ja) * | 1983-11-10 | 1985-06-07 | Sanyo Electric Co Ltd | 液晶表示板の電極接続方法 |
JPH0640181B2 (ja) * | 1984-06-15 | 1994-05-25 | シチズン時計株式会社 | 液晶表示装置 |
US4642421A (en) * | 1984-10-04 | 1987-02-10 | Amp Incorporated | Adhesive electrical interconnecting means |
US4640981A (en) * | 1984-10-04 | 1987-02-03 | Amp Incorporated | Electrical interconnection means |
US4588456A (en) * | 1984-10-04 | 1986-05-13 | Amp Incorporated | Method of making adhesive electrical interconnecting means |
JPS61173471A (ja) * | 1985-01-28 | 1986-08-05 | シャープ株式会社 | 熱圧着コネクタ− |
US4729809A (en) * | 1985-03-14 | 1988-03-08 | Amp Incorporated | Anisotropically conductive adhesive composition |
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
-
1987
- 1987-09-09 JP JP1987137714U patent/JPH0428145Y2/ja not_active Expired
-
1988
- 1988-09-08 US US07/242,433 patent/US4985663A/en not_active Expired - Lifetime
- 1988-09-09 EP EP88308361A patent/EP0307231B1/de not_active Expired - Lifetime
- 1988-09-09 DE DE3850467T patent/DE3850467T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6443390U (de) | 1989-03-15 |
EP0307231A2 (de) | 1989-03-15 |
DE3850467T2 (de) | 1995-01-05 |
JPH0428145Y2 (de) | 1992-07-07 |
EP0307231A3 (en) | 1990-04-11 |
EP0307231B1 (de) | 1994-06-29 |
US4985663A (en) | 1991-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN |