JPS62142845U - - Google Patents
Info
- Publication number
- JPS62142845U JPS62142845U JP1986029400U JP2940086U JPS62142845U JP S62142845 U JPS62142845 U JP S62142845U JP 1986029400 U JP1986029400 U JP 1986029400U JP 2940086 U JP2940086 U JP 2940086U JP S62142845 U JPS62142845 U JP S62142845U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- fingers
- suction cup
- movable
- gripping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Specific Conveyance Elements (AREA)
- Die Bonding (AREA)
Description
第1図はこの考案を具体化した一実施例を示す
斜視図、第2図はその縦断面図、第3図は他の一
対のフインガの取着状態を示す縦断面図、第4図
は作用を説明するための縦断面図、第5,6図は
フインガ、プツシユレバー、イコライザー、ばね
の取着状態を示す要部平面図、第7,8図はポジ
シヨナーの取着状態を示す斜視図である。 スリーブ…3、スプラインリーアベアリング…
4、吸気孔…5、スピンドル…6、上下連接板…
10、エアシリンダ…11、ローラ挾持部…17
、ローラ…18,19、支柱…20、摺動溝…2
1,22、円板…23,24、ばね…25、フイ
ンガ…26,27、ローラ…28、ばね…29、
プツシユレバー…30,31、イコライザー…3
2、ポジシヨナー…34,35、サツカーチユー
ブ…36。
斜視図、第2図はその縦断面図、第3図は他の一
対のフインガの取着状態を示す縦断面図、第4図
は作用を説明するための縦断面図、第5,6図は
フインガ、プツシユレバー、イコライザー、ばね
の取着状態を示す要部平面図、第7,8図はポジ
シヨナーの取着状態を示す斜視図である。 スリーブ…3、スプラインリーアベアリング…
4、吸気孔…5、スピンドル…6、上下連接板…
10、エアシリンダ…11、ローラ挾持部…17
、ローラ…18,19、支柱…20、摺動溝…2
1,22、円板…23,24、ばね…25、フイ
ンガ…26,27、ローラ…28、ばね…29、
プツシユレバー…30,31、イコライザー…3
2、ポジシヨナー…34,35、サツカーチユー
ブ…36。
Claims (1)
- 【実用新案登録請求の範囲】 1 半導体チツプ等のチツプを吸着可能にしたサ
ツカーを上下動可能に設けるとともに、そのサツ
カーの近傍において前記チツプを挾持する位置と
開放する位置とに往復移動可能でかつ上下動可能
な少なくとも一対のフインガ26,27を設け、
同フインガ26,27の往復移動が直線移動とな
るように案内する案内手段を設けたことを特徴と
するチツプマウンター。 2 前記フインガ26,27はサツカーチユーブ
36の軸心を中心とする十字上に設けられている
ことを特徴とする実用新案登録請求の範囲第1項
に記載のチツプマウンター。 3 前記フインガ26,27はその先端にチツプ
を把持するためのポジシヨナー34,35が把持
方向への位置調節可能に取着していることを特徴
とする実用新案登録請求の範囲第1項または第2
項に記載のチツプマウンター。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986029400U JPS62142845U (ja) | 1986-02-28 | 1986-02-28 | |
US07/019,027 US4753004A (en) | 1986-02-28 | 1987-02-26 | Chip mounter |
CA000530781A CA1298694C (en) | 1986-02-28 | 1987-02-27 | Chip mounter |
DE8787400440T DE3786273D1 (de) | 1986-02-28 | 1987-02-27 | Vorrichtung zur bestueckung mit chips. |
EP87400440A EP0235047B1 (en) | 1986-02-28 | 1987-02-27 | Chip mounter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986029400U JPS62142845U (ja) | 1986-02-28 | 1986-02-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62142845U true JPS62142845U (ja) | 1987-09-09 |
Family
ID=12275089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986029400U Pending JPS62142845U (ja) | 1986-02-28 | 1986-02-28 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4753004A (ja) |
EP (1) | EP0235047B1 (ja) |
JP (1) | JPS62142845U (ja) |
CA (1) | CA1298694C (ja) |
DE (1) | DE3786273D1 (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4844324A (en) * | 1987-09-29 | 1989-07-04 | Todd Thomas W | Solder system and method of using same |
US5497983A (en) * | 1987-10-16 | 1996-03-12 | Tenryu Technics Co., Ltd. | Work positioner of chip mounter for monitoring a chip-shaped electronic part onto a substrate |
US4883300A (en) * | 1988-10-13 | 1989-11-28 | Intelmatec Corporation | End effector for IC chip handling |
US4950011A (en) * | 1988-10-24 | 1990-08-21 | Nicky Borcea | Tool for precisely positioning a workpiece |
DE3904587A1 (de) * | 1989-02-16 | 1990-08-23 | Arnold & Richter Kg | Montagekopf fuer handhabungsgeraete |
DE8904031U1 (de) * | 1989-04-01 | 1989-05-18 | SES Electronics GmbH, 8860 Nördlingen | Bestückkopf |
US5106138A (en) * | 1989-06-05 | 1992-04-21 | Hewlett-Packard Company | Linear tweezers |
US4987676A (en) * | 1989-08-23 | 1991-01-29 | Quad Systems Corporation | End effector for a robotic system |
DE69210441T2 (de) * | 1991-02-20 | 1996-10-10 | Matsumoto Giken Co | Vorrichtung zur Halterung und Positionierung von elektronischen Chips |
US5160181A (en) * | 1991-09-09 | 1992-11-03 | Intelmatec Corporation | Pick-up head assembly |
US5315189A (en) * | 1991-09-25 | 1994-05-24 | Systems, Machines, Automation Corporation | Actuator with translational and rotational control |
US5284413A (en) * | 1992-08-05 | 1994-02-08 | Intelmatec Corporation | Apparatus for loading and unloading thin integrated circuits into and from carriers |
JPH06224595A (ja) * | 1993-01-19 | 1994-08-12 | Juki Corp | 部品吸着搭載ヘッド装置 |
DE4430381C2 (de) * | 1993-08-31 | 1997-02-27 | Smc Kk | Saugpipette |
DE19500416A1 (de) * | 1995-01-10 | 1996-07-11 | Atg Test Systems Gmbh | Haltevorrichtung für flächenförmige Prüflinge |
US5697658A (en) * | 1995-05-05 | 1997-12-16 | Samsung Electronics Co., Ltd. | Centering apparatus for component mounting device |
US6139078A (en) * | 1998-11-13 | 2000-10-31 | International Business Machines Corporation | Self-aligning end effector for small components |
FR2859197B1 (fr) * | 2003-09-02 | 2006-10-13 | Commissariat Energie Atomique | Dispositif de manutention de fut |
US9258936B2 (en) * | 2011-12-27 | 2016-02-09 | Hanwha Techwin Co., Ltd. | Adsorption head for surface mounting device |
CN102632638A (zh) * | 2012-03-16 | 2012-08-15 | 安徽德力日用玻璃股份有限公司 | 压机自动吸取杯机构 |
ITFI20120233A1 (it) * | 2012-10-29 | 2014-04-30 | Esanastri S R L | Dispositivo di micro-sfridatura di film plastici o in carta a uno o più strati autoadesivi, biadesivizzati o elettrostatici accoppiati con un liner di supporto antiaderente |
CN108275466A (zh) * | 2018-03-30 | 2018-07-13 | 青岛元启智能机器人科技有限公司 | 一种液晶屏抓取装置 |
CN108674968B (zh) * | 2018-05-29 | 2020-05-12 | 江西绣丽织带有限公司 | 一种用于织机的纱管自动上下料设备 |
CN110729217A (zh) * | 2019-10-22 | 2020-01-24 | 江苏佳晟精密设备科技有限公司 | 一种安装半导体芯片的装置 |
CN113644019B (zh) * | 2021-08-09 | 2024-03-19 | 恩纳基智能科技无锡有限公司 | 一种半导体贴片机的复合上料装置 |
CN114567972B (zh) * | 2021-10-22 | 2024-06-04 | 苏州联讯仪器股份有限公司 | 光通讯芯片的测试机构 |
CN115372243B (zh) * | 2022-10-21 | 2023-02-03 | 东营华亚国联航空燃料有限公司 | 一种航空燃料测试用铜片腐蚀试验设备 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4438559A (en) * | 1980-06-27 | 1984-03-27 | Fuji Machine Mfg. Co. Ltd. | Apparatus for automatically mounting non-lead electronic components on printed-circuit |
JPS59224279A (ja) * | 1983-06-01 | 1984-12-17 | 富士機械製造株式会社 | 電子部品の位置決め保持方法および装置 |
WO1985003404A1 (en) * | 1984-01-23 | 1985-08-01 | Dyna/Pert - Precima Limited | Head for handling electrical components |
DE3411125A1 (de) * | 1984-03-26 | 1985-10-03 | Alfred 8000 München Lemmer | Vorrichtung zum greifen von elektronischen bauelementen, insbesondere ic's |
-
1986
- 1986-02-28 JP JP1986029400U patent/JPS62142845U/ja active Pending
-
1987
- 1987-02-26 US US07/019,027 patent/US4753004A/en not_active Expired - Fee Related
- 1987-02-27 CA CA000530781A patent/CA1298694C/en not_active Expired - Lifetime
- 1987-02-27 DE DE8787400440T patent/DE3786273D1/de not_active Expired - Lifetime
- 1987-02-27 EP EP87400440A patent/EP0235047B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA1298694C (en) | 1992-04-14 |
EP0235047A3 (en) | 1989-09-06 |
EP0235047A2 (en) | 1987-09-02 |
EP0235047B1 (en) | 1993-06-23 |
US4753004A (en) | 1988-06-28 |
DE3786273D1 (de) | 1993-07-29 |