DE3767067D1 - Steckverbinder mit kontaktmodulen fuer ein substrat, zum beispiel fuer einen ic-chip-traeger. - Google Patents

Steckverbinder mit kontaktmodulen fuer ein substrat, zum beispiel fuer einen ic-chip-traeger.

Info

Publication number
DE3767067D1
DE3767067D1 DE8787305901T DE3767067T DE3767067D1 DE 3767067 D1 DE3767067 D1 DE 3767067D1 DE 8787305901 T DE8787305901 T DE 8787305901T DE 3767067 T DE3767067 T DE 3767067T DE 3767067 D1 DE3767067 D1 DE 3767067D1
Authority
DE
Germany
Prior art keywords
connector
substrate
chip carrier
contact modules
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787305901T
Other languages
English (en)
Inventor
Dimitry G Grabbe
Iosif Korsunsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Application granted granted Critical
Publication of DE3767067D1 publication Critical patent/DE3767067D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
DE8787305901T 1986-07-31 1987-07-03 Steckverbinder mit kontaktmodulen fuer ein substrat, zum beispiel fuer einen ic-chip-traeger. Expired - Fee Related DE3767067D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/891,710 US4699593A (en) 1986-01-14 1986-07-31 Connector having contact modules for a substrate such as an IC chip carrier

Publications (1)

Publication Number Publication Date
DE3767067D1 true DE3767067D1 (de) 1991-02-07

Family

ID=25398687

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8787305901T Expired - Fee Related DE3767067D1 (de) 1986-07-31 1987-07-03 Steckverbinder mit kontaktmodulen fuer ein substrat, zum beispiel fuer einen ic-chip-traeger.
DE3789453T Expired - Fee Related DE3789453T2 (de) 1986-07-31 1987-07-03 Elektrischer Kontakt.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE3789453T Expired - Fee Related DE3789453T2 (de) 1986-07-31 1987-07-03 Elektrischer Kontakt.

Country Status (5)

Country Link
US (1) US4699593A (de)
EP (2) EP0255244B1 (de)
JP (1) JPS6343279A (de)
DE (2) DE3767067D1 (de)
ES (1) ES2020275B3 (de)

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NL9401658A (nl) 1994-10-07 1996-05-01 Framatome Connectors Belgium Connector voor een substraat met een elektronische schakeling.
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US7188918B2 (en) 1997-01-21 2007-03-13 Hewlett-Packard Development Company, L.P. Ink delivery system adapter
JPH10228966A (ja) * 1997-02-12 1998-08-25 Hirose Electric Co Ltd 中間電気コネクタ
US5823792A (en) * 1997-03-10 1998-10-20 Molex Incorporated Wire-wrap connector
US5913700A (en) * 1997-07-14 1999-06-22 The Whitaker Corporation Card edge connector having low inductance contact system
JP3356394B2 (ja) * 1997-10-23 2002-12-16 タイコエレクトロニクスアンプ株式会社 電気コンタクト
US6217342B1 (en) 1997-10-30 2001-04-17 Intercon Systems, Inc. Interposer assembly
US6290507B1 (en) 1997-10-30 2001-09-18 Intercon Systems, Inc. Interposer assembly
US6315576B1 (en) 1997-10-30 2001-11-13 Intercon Systems, Inc. Interposer assembly
US6042412A (en) * 1998-08-28 2000-03-28 The Whitaker Corporation Land grid array connector assembly
US6618267B1 (en) * 1998-09-22 2003-09-09 International Business Machines Corporation Multi-level electronic package and method for making same
US6672912B2 (en) * 2000-03-31 2004-01-06 Intel Corporation Discrete device socket and method of fabrication therefor
US6358063B1 (en) 2000-06-28 2002-03-19 Intercon Systems, Inc. Sealed interposer assembly
MXPA03004441A (es) * 2000-11-20 2005-01-25 Intel Corp Configuraciones de pileta termica de alto desempeno para utilizarse en aplicaciones de empaque de alta densidad.
US6501655B1 (en) 2000-11-20 2002-12-31 Intel Corporation High performance fin configuration for air cooled heat sinks
US6633484B1 (en) 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
JP3942823B2 (ja) * 2000-12-28 2007-07-11 山一電機株式会社 検査装置
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FR2826230B1 (fr) * 2001-06-19 2003-11-07 Bull Sa Dispositif et procede de fixation de circuits integres sur une carte a circuit imprime
US6435882B1 (en) * 2001-07-27 2002-08-20 Agilent Technologies, Inc. Socketable flexible circuit based electronic device module and a socket for the same
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JP2011502339A (ja) * 2007-10-29 2011-01-20 アーデント コンセプツ、インコーポレイテッド コンプライアント接点及びアセンブリ
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US10794933B1 (en) * 2013-03-15 2020-10-06 Johnstech International Corporation Integrated circuit contact test apparatus with and method of construction
US9490188B2 (en) * 2014-09-12 2016-11-08 International Business Machines Corporation Compute intensive module packaging
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JP2017535929A (ja) * 2014-11-28 2017-11-30 中航光電科技股▲ふん▼有限公司Avic Jonhon Optronic Technology Co., Ltd 略弓字状弾性接触リード及び端接続式アダプタコネクタ
CN107492728A (zh) * 2017-01-12 2017-12-19 番禺得意精密电子工业有限公司 电连接器
US10663486B2 (en) 2017-02-06 2020-05-26 International Business Machines Corporation Portable electrical noise probe structure
CN110098507B (zh) * 2019-04-12 2020-09-25 番禺得意精密电子工业有限公司 电连接器
CN110994226B (zh) * 2019-12-24 2021-12-10 海光信息技术股份有限公司 插槽、主板和处理装置

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US4513353A (en) * 1982-12-27 1985-04-23 Amp Incorporated Connection of leadless integrated circuit package to a circuit board
US4552422A (en) * 1983-03-14 1985-11-12 Amp Incorporated Modular receptacle pin grid array
US4511197A (en) * 1983-08-01 1985-04-16 Amp Incorporated High density contact assembly
JPS60101888A (ja) * 1983-10-31 1985-06-05 アンプ インコーポレーテッド 電気コネクタ
US4571015A (en) * 1984-03-16 1986-02-18 Amp Incorporated Electrical connector having rotating clamps for securing electronic packages therein
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Also Published As

Publication number Publication date
DE3789453D1 (de) 1994-04-28
EP0386853A1 (de) 1990-09-12
JPH0371745B2 (de) 1991-11-14
EP0386853B1 (de) 1994-03-23
ES2020275B3 (es) 1991-08-01
US4699593A (en) 1987-10-13
JPS6343279A (ja) 1988-02-24
EP0255244A1 (de) 1988-02-03
DE3789453T2 (de) 1994-10-20
EP0255244B1 (de) 1990-12-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee