DE3688255D1 - Verfahren zur herstellung von mehrschichtleiterplatten. - Google Patents
Verfahren zur herstellung von mehrschichtleiterplatten.Info
- Publication number
- DE3688255D1 DE3688255D1 DE8787903756T DE3688255T DE3688255D1 DE 3688255 D1 DE3688255 D1 DE 3688255D1 DE 8787903756 T DE8787903756 T DE 8787903756T DE 3688255 T DE3688255 T DE 3688255T DE 3688255 D1 DE3688255 D1 DE 3688255D1
- Authority
- DE
- Germany
- Prior art keywords
- metal
- layer
- producing multi
- layer boards
- sites
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Radar Systems Or Details Thereof (AREA)
- Time-Division Multiplex Systems (AREA)
- Burglar Alarm Systems (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US1986/002710 WO1988004877A1 (en) | 1986-12-17 | 1986-12-17 | Multilayer circuit board fabrication process |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3688255D1 true DE3688255D1 (de) | 1993-05-13 |
DE3688255T2 DE3688255T2 (de) | 1993-07-22 |
Family
ID=22195757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787903756T Expired - Fee Related DE3688255T2 (de) | 1986-12-17 | 1986-12-17 | Verfahren zur herstellung von mehrschichtleiterplatten. |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0337986B1 (de) |
JP (1) | JPH0710029B2 (de) |
KR (1) | KR950003244B1 (de) |
AT (1) | ATE88050T1 (de) |
AU (1) | AU622100B2 (de) |
DE (1) | DE3688255T2 (de) |
DK (1) | DK457688A (de) |
NO (1) | NO883642L (de) |
WO (1) | WO1988004877A1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0451254B1 (de) * | 1989-10-30 | 1995-12-20 | The Foxboro Company | Mehrschichtleiterplatte mit mikroporösen schichten und verfahren zur herstellung |
GB2259812B (en) * | 1991-09-06 | 1996-04-24 | Toa Gosei Chem Ind | Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method |
EP0602538B1 (de) * | 1992-12-15 | 1997-06-04 | Asulab S.A. | Schutzrohrschalter und Herstellungsverfahren für aufgehängte dreidimensionale metallische Mikrostrukturen |
FR2699323B1 (fr) * | 1992-12-15 | 1995-01-13 | Asulab Sa | Contacteur "reed" et procédé de fabrication de microstructures métalliques tridimensionnelles suspendues. |
JP2775585B2 (ja) * | 1994-03-25 | 1998-07-16 | 日本メクトロン株式会社 | 両面配線基板の製造法 |
JP3112059B2 (ja) * | 1995-07-05 | 2000-11-27 | 株式会社日立製作所 | 薄膜多層配線基板及びその製法 |
KR100368868B1 (ko) * | 1999-05-17 | 2003-01-24 | 주식회사 화승알앤에이 | 테프론 시트 부착형 전해조 개스킷과 그 제조 방법 |
CN100392809C (zh) * | 2004-12-21 | 2008-06-04 | 联华电子股份有限公司 | 晶片绝缘层内连线的制造方法与结构 |
KR20190132987A (ko) * | 2017-03-31 | 2019-11-29 | 미츠비시 가스 가가쿠 가부시키가이샤 | 프린트 배선판의 제조 방법 |
US10349532B2 (en) | 2017-07-20 | 2019-07-09 | International Business Machines Corporation | Method for implementing stub-less printed circuit board vias |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3352730A (en) * | 1964-08-24 | 1967-11-14 | Sanders Associates Inc | Method of making multilayer circuit boards |
US3471631A (en) * | 1968-04-03 | 1969-10-07 | Us Air Force | Fabrication of microminiature multilayer circuit boards |
DE1937508C3 (de) * | 1969-07-23 | 1974-01-10 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Verfahren zur Herstellung eines mit elektrischen Leitungsbahnen und/oder elektrischen Durchkontaktierungen versehenen Isolierstoffträgers |
DE2716545A1 (de) * | 1977-04-14 | 1978-10-19 | Siemens Ag | Gedruckte schaltungsplatte mit mindestens zwei verdrahtungslagen |
JPS58502079A (ja) * | 1981-12-11 | 1983-12-01 | ウエスタ−ン エレクトリツク カムパニ− インコ−ポレ−テツド | 容量を増大する回路板の製造 |
-
1986
- 1986-12-17 KR KR1019880700981A patent/KR950003244B1/ko not_active IP Right Cessation
- 1986-12-17 JP JP62500383A patent/JPH0710029B2/ja not_active Expired - Lifetime
- 1986-12-17 WO PCT/US1986/002710 patent/WO1988004877A1/en active IP Right Grant
- 1986-12-17 AT AT87903756T patent/ATE88050T1/de not_active IP Right Cessation
- 1986-12-17 DE DE8787903756T patent/DE3688255T2/de not_active Expired - Fee Related
- 1986-12-17 AU AU74867/87A patent/AU622100B2/en not_active Ceased
- 1986-12-17 EP EP87903756A patent/EP0337986B1/de not_active Expired - Lifetime
-
1988
- 1988-08-16 NO NO88883642A patent/NO883642L/no unknown
- 1988-08-16 DK DK457688A patent/DK457688A/da not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DK457688D0 (da) | 1988-08-16 |
JPH02501175A (ja) | 1990-04-19 |
DE3688255T2 (de) | 1993-07-22 |
KR890701304A (ko) | 1989-03-11 |
ATE88050T1 (de) | 1993-04-15 |
NO883642D0 (no) | 1988-08-16 |
EP0337986B1 (de) | 1993-04-07 |
EP0337986A1 (de) | 1989-10-25 |
JPH0710029B2 (ja) | 1995-02-01 |
AU7486787A (en) | 1988-07-15 |
DK457688A (da) | 1988-08-16 |
AU622100B2 (en) | 1992-04-02 |
NO883642L (no) | 1988-10-14 |
KR950003244B1 (ko) | 1995-04-06 |
WO1988004877A1 (en) | 1988-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |