JPS6439097A - Manufacture of multilayer interconnection board - Google Patents
Manufacture of multilayer interconnection boardInfo
- Publication number
- JPS6439097A JPS6439097A JP19545287A JP19545287A JPS6439097A JP S6439097 A JPS6439097 A JP S6439097A JP 19545287 A JP19545287 A JP 19545287A JP 19545287 A JP19545287 A JP 19545287A JP S6439097 A JPS6439097 A JP S6439097A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- pattern
- interconnection board
- coarse
- specified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To make it possible to manufacture an interconnection board at a low cost, by forming an insulating layer on a wiring pattern, making the surface coarse, applying electroless plating and electrolytic plating on the coarse surface, forming an insulating film furthermore, and laminating a plurality of layers by repeating said procedure. CONSTITUTION:An organic resin is used as a substrate 30 of a multilayer interconnection board 52. A copper foil is applied on the surface of a representative epoxy resin, and the copper lined substrate is used. A specified first wiring pattern 32 is formed on the copper foil by using the etching technology of a photographic method. Thereafter, a first insulating layer 34 is printed in an arbitrary shape on the pattern 32 by using a screen printing method and the like. The surface is made coarse by a honing method or the like. Then a dry film 38, which is a light sensitive resin, undergoes thermocompression bonding on the insulating layer 34. A specified pattern is formed by a photographic method. After electroless plating and electrolytic plating, the exposed dry film 38 is released. A second insulating layer 42 is printed on a specified second pattern 40, which is formed after the cleaning of the surface. The surface is made coarse, and a dry film undergoes thermocompression bonding. This procedure is repeated, and layers are laminated. Thus, the interconnection board can be manufactured in a short time at a low cost.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19545287A JPS6439097A (en) | 1987-08-05 | 1987-08-05 | Manufacture of multilayer interconnection board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19545287A JPS6439097A (en) | 1987-08-05 | 1987-08-05 | Manufacture of multilayer interconnection board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6439097A true JPS6439097A (en) | 1989-02-09 |
Family
ID=16341303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19545287A Pending JPS6439097A (en) | 1987-08-05 | 1987-08-05 | Manufacture of multilayer interconnection board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6439097A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013101221A (en) * | 2011-11-08 | 2013-05-23 | Fujifilm Corp | Electrophotographic photoreceptor, copying machine using the same, and dope for forming photosensitive layer of the same |
-
1987
- 1987-08-05 JP JP19545287A patent/JPS6439097A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013101221A (en) * | 2011-11-08 | 2013-05-23 | Fujifilm Corp | Electrophotographic photoreceptor, copying machine using the same, and dope for forming photosensitive layer of the same |
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