DE3676836D1 - Kuehlungsanordnung fuer integrierten schaltungschip. - Google Patents
Kuehlungsanordnung fuer integrierten schaltungschip.Info
- Publication number
- DE3676836D1 DE3676836D1 DE8686101516T DE3676836T DE3676836D1 DE 3676836 D1 DE3676836 D1 DE 3676836D1 DE 8686101516 T DE8686101516 T DE 8686101516T DE 3676836 T DE3676836 T DE 3676836T DE 3676836 D1 DE3676836 D1 DE 3676836D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- circuit chip
- cooling arrangement
- cooling
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4332—Bellows
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
- H01L2224/29109—Indium [In] as principal constituent
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
- H01L2224/29191—The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/01006—Carbon [C]
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/01014—Silicon [Si]
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/0105—Tin [Sn]
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- H01L2924/01074—Tungsten [W]
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- H01L2924/01078—Platinum [Pt]
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- H01L2924/013—Alloys
- H01L2924/0133—Ternary Alloys
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- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60041118A JPH06101523B2 (ja) | 1985-03-04 | 1985-03-04 | 集積回路チツプ冷却装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3676836D1 true DE3676836D1 (de) | 1991-02-21 |
Family
ID=12599540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686101516T Expired - Lifetime DE3676836D1 (de) | 1985-03-04 | 1986-02-06 | Kuehlungsanordnung fuer integrierten schaltungschip. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4686606A (de) |
EP (1) | EP0193747B1 (de) |
JP (1) | JPH06101523B2 (de) |
KR (1) | KR930005491B1 (de) |
DE (1) | DE3676836D1 (de) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62238653A (ja) * | 1986-04-09 | 1987-10-19 | Nec Corp | 冷却構造 |
US4964458A (en) * | 1986-04-30 | 1990-10-23 | International Business Machines Corporation | Flexible finned heat exchanger |
JPH0797617B2 (ja) * | 1986-05-23 | 1995-10-18 | 株式会社日立製作所 | 冷媒漏洩防止装置 |
US4768581A (en) * | 1987-04-06 | 1988-09-06 | International Business Machines Corporation | Cooling system for semiconductor modules |
US4942497A (en) * | 1987-07-24 | 1990-07-17 | Nec Corporation | Cooling structure for heat generating electronic components mounted on a substrate |
JP2786193B2 (ja) * | 1987-10-26 | 1998-08-13 | 株式会社日立製作所 | 半導体冷却装置 |
CA1283225C (en) * | 1987-11-09 | 1991-04-16 | Shinji Mine | Cooling system for three-dimensional ic package |
DE3853197T2 (de) * | 1987-12-07 | 1995-06-29 | Nippon Electric Co | Kühlungssystem für integrierte Schaltungspackung. |
US4841355A (en) * | 1988-02-10 | 1989-06-20 | Amdahl Corporation | Three-dimensional microelectronic package for semiconductor chips |
DE68918156T2 (de) * | 1988-05-09 | 1995-01-12 | Nippon Electric Co | Flache Kühlungsstruktur für integrierte Schaltung. |
US4884630A (en) * | 1988-07-14 | 1989-12-05 | Microelectronics And Computer Technology Corporation | End fed liquid heat exchanger for an electronic component |
US4975766A (en) * | 1988-08-26 | 1990-12-04 | Nec Corporation | Structure for temperature detection in a package |
JPH06100408B2 (ja) * | 1988-09-09 | 1994-12-12 | 日本電気株式会社 | 冷却装置 |
US5365400A (en) * | 1988-09-09 | 1994-11-15 | Hitachi, Ltd. | Heat sinks and semiconductor cooling device using the heat sinks |
DE68925403T2 (de) * | 1988-09-20 | 1996-05-30 | Nippon Electric Co | Kühlungsstruktur für elektronische Bauelemente |
US5664427A (en) * | 1989-03-08 | 1997-09-09 | Rocky Research | Rapid sorption cooling or freezing appliance |
US5598721A (en) | 1989-03-08 | 1997-02-04 | Rocky Research | Heating and air conditioning systems incorporating solid-vapor sorption reactors capable of high reaction rates |
US5628205A (en) * | 1989-03-08 | 1997-05-13 | Rocky Research | Refrigerators/freezers incorporating solid-vapor sorption reactors capable of high reaction rates |
US5271239A (en) * | 1990-11-13 | 1993-12-21 | Rocky Research | Cooling apparatus for electronic and computer components |
US5345107A (en) * | 1989-09-25 | 1994-09-06 | Hitachi, Ltd. | Cooling apparatus for electronic device |
US5050036A (en) * | 1989-10-24 | 1991-09-17 | Amdahl Corporation | Liquid cooled integrated circuit assembly |
US5006924A (en) * | 1989-12-29 | 1991-04-09 | International Business Machines Corporation | Heat sink for utilization with high density integrated circuit substrates |
US5291371A (en) * | 1990-04-27 | 1994-03-01 | International Business Machines Corporation | Thermal joint |
US5170319A (en) * | 1990-06-04 | 1992-12-08 | International Business Machines Corporation | Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels |
US5161089A (en) * | 1990-06-04 | 1992-11-03 | International Business Machines Corporation | Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same |
CA2053055C (en) * | 1990-10-11 | 1997-02-25 | Tsukasa Mizuno | Liquid cooling system for lsi packages |
US5106451A (en) * | 1990-11-15 | 1992-04-21 | International Business Machines Corporation | Heat sink and method of attachment |
JP2748732B2 (ja) * | 1991-07-19 | 1998-05-13 | 日本電気株式会社 | 液体冷媒循環システム |
JP2852148B2 (ja) * | 1991-10-21 | 1999-01-27 | 日本電気株式会社 | 集積回路パッケージの冷却構造 |
JP2728105B2 (ja) * | 1991-10-21 | 1998-03-18 | 日本電気株式会社 | 集積回路用冷却装置 |
US5177667A (en) * | 1991-10-25 | 1993-01-05 | International Business Machines Corporation | Thermal conduction module with integral impingement cooling |
US5218515A (en) * | 1992-03-13 | 1993-06-08 | The United States Of America As Represented By The United States Department Of Energy | Microchannel cooling of face down bonded chips |
US5241450A (en) * | 1992-03-13 | 1993-08-31 | The United States Of America As Represented By The United States Department Of Energy | Three dimensional, multi-chip module |
US5473508A (en) * | 1994-05-31 | 1995-12-05 | At&T Global Information Solutions Company | Focused CPU air cooling system including high efficiency heat exchanger |
US5576932A (en) * | 1995-08-31 | 1996-11-19 | At&T Global Information Solutions Company | Method and apparatus for cooling a heat source |
US6173760B1 (en) * | 1998-08-04 | 2001-01-16 | International Business Machines Corporation | Co-axial bellows liquid heatsink for high power module test |
US6222264B1 (en) | 1999-10-15 | 2001-04-24 | Dell Usa, L.P. | Cooling apparatus for an electronic package |
US6761211B2 (en) | 2000-03-14 | 2004-07-13 | Delphi Technologies, Inc. | High-performance heat sink for electronics cooling |
JP2003110076A (ja) * | 2001-10-01 | 2003-04-11 | Fujitsu Ltd | 熱拡散器および放熱器 |
US7063127B2 (en) * | 2003-09-18 | 2006-06-20 | International Business Machines Corporation | Method and apparatus for chip-cooling |
US6943444B2 (en) | 2003-10-30 | 2005-09-13 | International Business Machines Corporation | Cooling of surface temperature of a device |
US6843310B1 (en) * | 2004-03-03 | 2005-01-18 | Chin-Ping Chen | Semi-closed air cooling type radiator |
US20050284604A1 (en) * | 2004-06-29 | 2005-12-29 | Mongia Rajiv K | Reducing cooling tube bursts in electronic devices |
US20060157225A1 (en) * | 2005-01-18 | 2006-07-20 | Yves Martin | High turbulence heat exchanger |
US7073569B1 (en) * | 2005-04-07 | 2006-07-11 | Delphi Technologies, Inc. | Cooling assembly with spirally wound fin |
US7515418B2 (en) * | 2005-09-26 | 2009-04-07 | Curtiss-Wright Controls, Inc. | Adjustable height liquid cooler in liquid flow through plate |
US7939312B2 (en) * | 2006-08-30 | 2011-05-10 | Dxna Llc | Rapid thermocycler with movable cooling assembly |
KR101102360B1 (ko) * | 2009-02-24 | 2012-01-03 | 유제태 | 에코기능 휀스 |
US8369090B2 (en) | 2009-05-12 | 2013-02-05 | Iceotope Limited | Cooled electronic system |
US8636052B2 (en) * | 2009-09-08 | 2014-01-28 | International Business Machines Corporation | Dual-fluid heat exchanger |
EP2601286A4 (de) | 2010-08-02 | 2016-10-05 | Brent L Weight | Unter druck stehende kartusche für polymerase-kettenreaktionen |
WO2013095362A1 (en) * | 2011-12-20 | 2013-06-27 | Intel Corporation | High performance transient uniform cooling solution for thermal compression bonding process |
US11158562B2 (en) | 2020-02-11 | 2021-10-26 | International Business Machines Corporation | Conformal integrated circuit (IC) device package lid |
US11997825B1 (en) | 2023-05-16 | 2024-05-28 | MTS IP Holdings Ltd | Bellows for immersion cooling |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5438771A (en) * | 1977-09-02 | 1979-03-23 | Toshiba Corp | Cooling fin |
US4138692A (en) * | 1977-09-12 | 1979-02-06 | International Business Machines Corporation | Gas encapsulated cooling module |
US4193445A (en) * | 1978-06-29 | 1980-03-18 | International Business Machines Corporation | Conduction cooled module |
US4254431A (en) * | 1979-06-20 | 1981-03-03 | International Business Machines Corporation | Restorable backbond for LSI chips using liquid metal coated dendrites |
JPS59200495A (ja) * | 1983-04-27 | 1984-11-13 | 株式会社日立製作所 | マルチチツプ・モジユ−ル |
US4567505A (en) * | 1983-10-27 | 1986-01-28 | The Board Of Trustees Of The Leland Stanford Junior University | Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like |
-
1985
- 1985-03-04 JP JP60041118A patent/JPH06101523B2/ja not_active Expired - Lifetime
-
1986
- 1986-02-06 EP EP86101516A patent/EP0193747B1/de not_active Expired - Lifetime
- 1986-02-06 DE DE8686101516T patent/DE3676836D1/de not_active Expired - Lifetime
- 1986-02-10 US US06/827,613 patent/US4686606A/en not_active Expired - Lifetime
- 1986-02-28 KR KR1019860001450A patent/KR930005491B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0193747B1 (de) | 1991-01-16 |
JPS61201452A (ja) | 1986-09-06 |
EP0193747A3 (en) | 1987-04-15 |
JPH06101523B2 (ja) | 1994-12-12 |
KR860007733A (ko) | 1986-10-17 |
EP0193747A2 (de) | 1986-09-10 |
KR930005491B1 (ko) | 1993-06-22 |
US4686606A (en) | 1987-08-11 |
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