DE3650544D1 - Bleibasislegierungen und Verwendung zum Herabsetzen der Elektromigrationsaktivität - Google Patents
Bleibasislegierungen und Verwendung zum Herabsetzen der ElektromigrationsaktivitätInfo
- Publication number
- DE3650544D1 DE3650544D1 DE3650544T DE3650544T DE3650544D1 DE 3650544 D1 DE3650544 D1 DE 3650544D1 DE 3650544 T DE3650544 T DE 3650544T DE 3650544 T DE3650544 T DE 3650544T DE 3650544 D1 DE3650544 D1 DE 3650544D1
- Authority
- DE
- Germany
- Prior art keywords
- activity
- base alloys
- lead base
- reduce electromigration
- electromigration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910045601 alloy Inorganic materials 0.000 title 1
- 239000000956 alloy Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C11/00—Alloys based on lead
- C22C11/06—Alloys based on lead with tin as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/722,631 US4622205A (en) | 1985-04-12 | 1985-04-12 | Electromigration lifetime increase of lead base alloys |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3650544D1 true DE3650544D1 (de) | 1996-08-29 |
DE3650544T2 DE3650544T2 (de) | 1997-02-06 |
Family
ID=24902685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3650544T Expired - Fee Related DE3650544T2 (de) | 1985-04-12 | 1986-04-04 | Bleibasislegierungen und Verwendung zum Herabsetzen der Elektromigrationsaktivität |
Country Status (5)
Country | Link |
---|---|
US (1) | US4622205A (de) |
EP (1) | EP0198353B1 (de) |
JP (1) | JPS61238932A (de) |
CA (1) | CA1257786A (de) |
DE (1) | DE3650544T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5011658A (en) * | 1989-05-31 | 1991-04-30 | International Business Machines Corporation | Copper doped low melt solder for component assembly and rework |
JP2891432B2 (ja) * | 1989-12-27 | 1999-05-17 | 田中電子工業株式会社 | 半導体材料の接続方法,それに用いる接続材料及び半導体装置 |
US5066544A (en) * | 1990-08-27 | 1991-11-19 | U.S. Philips Corporation | Dispersion strengthened lead-tin alloy solder |
US5614328A (en) * | 1995-01-19 | 1997-03-25 | The Furukawa Electric Co. Ltd. | Reflow-plated member and a manufacturing method therefor |
CN1298455A (zh) * | 1998-04-28 | 2001-06-06 | 西德马公司 | 还原金属氧化物的方法及其装置 |
DE69909964T2 (de) * | 1999-04-28 | 2004-04-15 | Federal-Mogul Wiesbaden Gmbh & Co. Kg | Mehrschichtenmaterial für Gleitelemente und Verfahren zur Herstellung |
DE19953670A1 (de) * | 1999-11-08 | 2001-05-23 | Euromat Gmbh | Lotlegierung |
US6489229B1 (en) | 2001-09-07 | 2002-12-03 | Motorola, Inc. | Method of forming a semiconductor device having conductive bumps without using gold |
US6811892B2 (en) * | 2002-08-22 | 2004-11-02 | Delphi Technologies, Inc. | Lead-based solder alloys containing copper |
US6630251B1 (en) * | 2002-09-23 | 2003-10-07 | Delphi Technologies, Inc. | Leach-resistant solder alloys for silver-based thick-film conductors |
US20060273450A1 (en) * | 2005-06-02 | 2006-12-07 | Intel Corporation | Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor |
JP5058766B2 (ja) * | 2007-12-07 | 2012-10-24 | 山陽特殊製鋼株式会社 | 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器 |
US10323299B2 (en) * | 2015-07-15 | 2019-06-18 | Iowa State University Research Foundation, Inc. | Recovering rare earth metals from magnet scrap |
CN108857135A (zh) * | 2018-03-12 | 2018-11-23 | 深圳市鑫富锦新材料有限公司 | 一种混合合金焊料膏 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB552330A (en) * | 1941-12-11 | 1943-04-01 | Alan Richard Powell | Improvements in or relating to soft solders |
GB721881A (en) * | 1950-09-29 | 1955-01-12 | Gunther Laubmeyer | Improvements in methods of soldering and solder therefor |
DE1204500B (de) * | 1960-08-02 | 1965-11-04 | Dr G Laubmeyer | Verwendung von Zinn-Blei-Legierungen als Weichlot zum automatischen Tauchloeten |
US3600164A (en) * | 1968-04-16 | 1971-08-17 | Gen Motors Corp | Heat treatable creep resistant solder |
GB1357073A (en) * | 1972-08-02 | 1974-06-19 | Asahi Glass Co Ltd | Process for soldering difficultly-solderable material having oxide surface |
JPS5266856A (en) * | 1975-12-02 | 1977-06-02 | Kokusai Denshin Denwa Co Ltd | Method of connecting fine wire |
JPS5838693A (ja) * | 1981-08-31 | 1983-03-07 | Pioneer Electronic Corp | プリント基板の半田付方法 |
JPS5838694A (ja) * | 1981-08-31 | 1983-03-07 | Toshiba Corp | 半導体ダイボンデイング用はんだ |
JPS58151037A (ja) * | 1982-03-02 | 1983-09-08 | Mitsubishi Metal Corp | 半導体装置用pb合金ろう材 |
JPS58200546A (ja) * | 1982-05-19 | 1983-11-22 | Hitachi Ltd | 半導体装置 |
-
1985
- 1985-04-12 US US06/722,631 patent/US4622205A/en not_active Expired - Lifetime
- 1985-12-20 CA CA000498313A patent/CA1257786A/en not_active Expired
-
1986
- 1986-02-14 JP JP61029158A patent/JPS61238932A/ja active Granted
- 1986-04-04 DE DE3650544T patent/DE3650544T2/de not_active Expired - Fee Related
- 1986-04-04 EP EP86104600A patent/EP0198353B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0198353B1 (de) | 1996-07-24 |
US4622205A (en) | 1986-11-11 |
CA1257786A (en) | 1989-07-25 |
DE3650544T2 (de) | 1997-02-06 |
EP0198353A3 (en) | 1988-09-14 |
JPS61238932A (ja) | 1986-10-24 |
JPH0327317B2 (de) | 1991-04-15 |
EP0198353A2 (de) | 1986-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK88186A (da) | Benzoylurinstofderivater med antitumoraktivitet | |
DK470787A (da) | Enzymer med aendret aktivitet | |
DE3681899D1 (de) | Bausteine zum aufeinandersetzen und montagestift. | |
DE3650544D1 (de) | Bleibasislegierungen und Verwendung zum Herabsetzen der Elektromigrationsaktivität | |
IT1190375B (it) | N-benzidrildiazacicloalchil-alcanilidi ad attivita' antianafilattica ed antibroncospastica | |
PH22293A (en) | Thienopyridone compounds and compositions with therapeutic activity | |
DK568685A (da) | Hidtil ukendte benzothiophener og benzofuraner med antiallergisk aktivitet | |
GB2171721B (en) | Palladium and palladium alloy plating | |
DK495586A (da) | Piperazinoisothiazoloner med psykotrop aktivitet | |
DK508084A (da) | Modificerede glucosaminoglucaner med antithrombotisk aktivitet | |
DK55685A (da) | Enzym eller enzymkompleks med proteolytisk aktivitet | |
IT8522284A0 (it) | Composizione moderatrice dell'appetito ed antigastrica. | |
AT385775B (de) | Korrosionsfeste hartmetall-legierung | |
IT1185279B (it) | Perfezionato nastro per placcatura elettrolitica e metodo per usare il medesimo | |
IT1201429B (it) | Procedimento per ottenere interferon leucocitario alfa-2 dell'uomo | |
DK115486D0 (da) | Benzoyl-urinstoffer med insekticid aktivitet | |
RO91273A (ro) | Compozitie erbicida cu activitate prelungita | |
GB8611054D0 (en) | Measuring activity of constituent of medium | |
DK492386A (da) | Bicycliske imider med psykotrop aktivitet | |
ZA864667B (en) | Rhodium based amorphous metal alloys and use thereof as halogen electrodes | |
GB2185254B (en) | Benzamide and nicotinamide radiosensitizers | |
RO91525A (ro) | Compozitie erbicida cu activitate prelungita | |
ATA43185A (de) | Reis- und knoedelkochtopf | |
KR860012914U (ko) | 착즙기의 감속장치 | |
ES287081Y (es) | Compresa inadherente y transpirable |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |