DE3650544D1 - Bleibasislegierungen und Verwendung zum Herabsetzen der Elektromigrationsaktivität - Google Patents

Bleibasislegierungen und Verwendung zum Herabsetzen der Elektromigrationsaktivität

Info

Publication number
DE3650544D1
DE3650544D1 DE3650544T DE3650544T DE3650544D1 DE 3650544 D1 DE3650544 D1 DE 3650544D1 DE 3650544 T DE3650544 T DE 3650544T DE 3650544 T DE3650544 T DE 3650544T DE 3650544 D1 DE3650544 D1 DE 3650544D1
Authority
DE
Germany
Prior art keywords
activity
base alloys
lead base
reduce electromigration
electromigration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3650544T
Other languages
English (en)
Other versions
DE3650544T2 (de
Inventor
David Perry Fouts
Devandra Gupta
Paul Siu-Chung Ho
Jasvir Singh Jaspal
James Robert Lloyd
James Michael Oberschmidt
Kris Venkatraman Skikrishnan
Michael James Sullivan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE3650544D1 publication Critical patent/DE3650544D1/de
Application granted granted Critical
Publication of DE3650544T2 publication Critical patent/DE3650544T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C11/00—Alloys based on lead
    • C22C11/06—Alloys based on lead with tin as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE3650544T 1985-04-12 1986-04-04 Bleibasislegierungen und Verwendung zum Herabsetzen der Elektromigrationsaktivität Expired - Fee Related DE3650544T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/722,631 US4622205A (en) 1985-04-12 1985-04-12 Electromigration lifetime increase of lead base alloys

Publications (2)

Publication Number Publication Date
DE3650544D1 true DE3650544D1 (de) 1996-08-29
DE3650544T2 DE3650544T2 (de) 1997-02-06

Family

ID=24902685

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3650544T Expired - Fee Related DE3650544T2 (de) 1985-04-12 1986-04-04 Bleibasislegierungen und Verwendung zum Herabsetzen der Elektromigrationsaktivität

Country Status (5)

Country Link
US (1) US4622205A (de)
EP (1) EP0198353B1 (de)
JP (1) JPS61238932A (de)
CA (1) CA1257786A (de)
DE (1) DE3650544T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011658A (en) * 1989-05-31 1991-04-30 International Business Machines Corporation Copper doped low melt solder for component assembly and rework
JP2891432B2 (ja) * 1989-12-27 1999-05-17 田中電子工業株式会社 半導体材料の接続方法，それに用いる接続材料及び半導体装置
US5066544A (en) * 1990-08-27 1991-11-19 U.S. Philips Corporation Dispersion strengthened lead-tin alloy solder
US5614328A (en) * 1995-01-19 1997-03-25 The Furukawa Electric Co. Ltd. Reflow-plated member and a manufacturing method therefor
CN1298455A (zh) * 1998-04-28 2001-06-06 西德马公司 还原金属氧化物的方法及其装置
DE69909964T2 (de) * 1999-04-28 2004-04-15 Federal-Mogul Wiesbaden Gmbh & Co. Kg Mehrschichtenmaterial für Gleitelemente und Verfahren zur Herstellung
DE19953670A1 (de) * 1999-11-08 2001-05-23 Euromat Gmbh Lotlegierung
US6489229B1 (en) 2001-09-07 2002-12-03 Motorola, Inc. Method of forming a semiconductor device having conductive bumps without using gold
US6811892B2 (en) * 2002-08-22 2004-11-02 Delphi Technologies, Inc. Lead-based solder alloys containing copper
US6630251B1 (en) * 2002-09-23 2003-10-07 Delphi Technologies, Inc. Leach-resistant solder alloys for silver-based thick-film conductors
US20060273450A1 (en) * 2005-06-02 2006-12-07 Intel Corporation Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor
JP5058766B2 (ja) * 2007-12-07 2012-10-24 山陽特殊製鋼株式会社 鉛フリー接合用材料を用いてはんだ付けしてなる電子機器
US10323299B2 (en) * 2015-07-15 2019-06-18 Iowa State University Research Foundation, Inc. Recovering rare earth metals from magnet scrap
CN108857135A (zh) * 2018-03-12 2018-11-23 深圳市鑫富锦新材料有限公司 一种混合合金焊料膏

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB552330A (en) * 1941-12-11 1943-04-01 Alan Richard Powell Improvements in or relating to soft solders
GB721881A (en) * 1950-09-29 1955-01-12 Gunther Laubmeyer Improvements in methods of soldering and solder therefor
DE1204500B (de) * 1960-08-02 1965-11-04 Dr G Laubmeyer Verwendung von Zinn-Blei-Legierungen als Weichlot zum automatischen Tauchloeten
US3600164A (en) * 1968-04-16 1971-08-17 Gen Motors Corp Heat treatable creep resistant solder
GB1357073A (en) * 1972-08-02 1974-06-19 Asahi Glass Co Ltd Process for soldering difficultly-solderable material having oxide surface
JPS5266856A (en) * 1975-12-02 1977-06-02 Kokusai Denshin Denwa Co Ltd Method of connecting fine wire
JPS5838693A (ja) * 1981-08-31 1983-03-07 Pioneer Electronic Corp プリント基板の半田付方法
JPS5838694A (ja) * 1981-08-31 1983-03-07 Toshiba Corp 半導体ダイボンデイング用はんだ
JPS58151037A (ja) * 1982-03-02 1983-09-08 Mitsubishi Metal Corp 半導体装置用ｐｂ合金ろう材
JPS58200546A (ja) * 1982-05-19 1983-11-22 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
EP0198353B1 (de) 1996-07-24
US4622205A (en) 1986-11-11
CA1257786A (en) 1989-07-25
DE3650544T2 (de) 1997-02-06
EP0198353A3 (en) 1988-09-14
JPS61238932A (ja) 1986-10-24
JPH0327317B2 (de) 1991-04-15
EP0198353A2 (de) 1986-10-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee