DE3650186D1 - Halbleiteranordnung und Verfahren zu deren Herstellung. - Google Patents
Halbleiteranordnung und Verfahren zu deren Herstellung.Info
- Publication number
- DE3650186D1 DE3650186D1 DE3650186T DE3650186T DE3650186D1 DE 3650186 D1 DE3650186 D1 DE 3650186D1 DE 3650186 T DE3650186 T DE 3650186T DE 3650186 T DE3650186 T DE 3650186T DE 3650186 D1 DE3650186 D1 DE 3650186D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
- H01L27/0705—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type
- H01L27/0711—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with bipolar transistors and diodes, or capacitors, or resistors
- H01L27/0716—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with bipolar transistors and diodes, or capacitors, or resistors in combination with vertical bipolar transistors and diodes, or capacitors, or resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53271—Conductive materials containing semiconductor material, e.g. polysilicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60016140A JPS61174762A (ja) | 1985-01-30 | 1985-01-30 | 半導体装置およびその製造方法 |
JP60016139A JPS61174761A (ja) | 1985-01-30 | 1985-01-30 | 半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3650186D1 true DE3650186D1 (de) | 1995-02-09 |
DE3650186T2 DE3650186T2 (de) | 1995-05-24 |
Family
ID=26352396
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3650186T Expired - Lifetime DE3650186T2 (de) | 1985-01-30 | 1986-01-29 | Halbleiteranordnung und Verfahren zu deren Herstellung. |
DE8686101172T Expired - Lifetime DE3672030D1 (de) | 1985-01-30 | 1986-01-29 | Halbleitervorrichtung und methode zu deren herstellung. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686101172T Expired - Lifetime DE3672030D1 (de) | 1985-01-30 | 1986-01-29 | Halbleitervorrichtung und methode zu deren herstellung. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4907059A (de) |
EP (3) | EP0192093B1 (de) |
DE (2) | DE3650186T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02101747A (ja) * | 1988-10-11 | 1990-04-13 | Toshiba Corp | 半導体集積回路とその製造方法 |
JP2632420B2 (ja) * | 1989-02-23 | 1997-07-23 | 三菱電機株式会社 | 半導体集積回路 |
US4999518A (en) * | 1989-12-08 | 1991-03-12 | International Business Machines Corp. | MOS switching circuit having gate enhanced lateral bipolar transistor |
US5097305A (en) * | 1991-02-19 | 1992-03-17 | Synaptics Corporation | Integrating photosensor and imaging system having wide dynamic range |
US5260592A (en) * | 1991-02-19 | 1993-11-09 | Synaptics, Incorporated | Integrating photosensor and imaging system having wide dynamic range with varactors |
US5324958A (en) * | 1991-02-19 | 1994-06-28 | Synaptics, Incorporated | Integrating imaging systgem having wide dynamic range with sample/hold circuits |
GB2254487B (en) * | 1991-03-23 | 1995-06-21 | Sony Corp | Full CMOS type static random access memories |
GB2263018B (en) * | 1991-03-23 | 1995-06-21 | Sony Corp | Static random access memories |
US5101257A (en) * | 1991-07-01 | 1992-03-31 | Motorola, Inc. | Semiconductor device having merged bipolar and MOS transistors and process for making the same |
JP2965783B2 (ja) * | 1991-07-17 | 1999-10-18 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
US5212399A (en) * | 1991-08-15 | 1993-05-18 | Micron Technology, Inc. | Low cost polysilicon active p-channel load |
EP0585059B1 (de) * | 1992-08-21 | 1999-05-12 | STMicroelectronics, Inc. | Verfahren zur Herstellung einer Halbleiter-Speicherstruktur vom vertikalen Typ und nach dem Verfahren hergestellte Struktur |
TW230266B (de) * | 1993-01-26 | 1994-09-11 | American Telephone & Telegraph |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2133258A1 (de) * | 1971-07-05 | 1973-01-25 | Licentia Gmbh | Feldeffekttransistor aus einem halbleiterkoerper |
US3753807A (en) * | 1972-02-24 | 1973-08-21 | Bell Canada Northern Electric | Manufacture of bipolar semiconductor devices |
GB1441928A (en) * | 1972-12-18 | 1976-07-07 | Rca Corp | Peak detector |
US4013489A (en) * | 1976-02-10 | 1977-03-22 | Intel Corporation | Process for forming a low resistance interconnect in MOS N-channel silicon gate integrated circuit |
US4333099A (en) * | 1978-02-27 | 1982-06-01 | Rca Corporation | Use of silicide to bridge unwanted polycrystalline silicon P-N junction |
SE444484B (sv) * | 1979-02-26 | 1986-04-14 | Rca Corp | Integrerad kretsanordning innefattande bl a en minnescell med en forsta och en andra inverterare |
JPS55134962A (en) * | 1979-04-09 | 1980-10-21 | Toshiba Corp | Semiconductor device |
JPS56125867A (en) * | 1980-03-10 | 1981-10-02 | Nec Corp | Semiconductor device |
GB2098799B (en) * | 1981-05-20 | 1985-08-21 | Nippon Electric Co | Multi-level interconnection system for integrated circuits |
EP0067661A1 (de) * | 1981-06-15 | 1982-12-22 | Kabushiki Kaisha Toshiba | Halbleiteranordnung und Verfahren zu seiner Herstellung |
US4613886A (en) * | 1981-07-09 | 1986-09-23 | Intel Corporation | CMOS static memory cell |
JPS5816564A (ja) * | 1981-07-09 | 1983-01-31 | インテル・コ−ポレ−シヨン | 相補形金属−酸化膜−半導体スタテイツクメモリセル |
JPH0783252B2 (ja) * | 1982-07-12 | 1995-09-06 | 株式会社日立製作所 | 半導体集積回路装置 |
US4487458A (en) * | 1982-09-28 | 1984-12-11 | Eaton Corporation | Bidirectional source to source stacked FET gating circuit |
JPS59188959A (ja) * | 1983-04-11 | 1984-10-26 | Hitachi Ltd | 半導体集積回路装置及びマイクロコンピュータ |
-
1986
- 1986-01-29 EP EP86101172A patent/EP0192093B1/de not_active Expired - Lifetime
- 1986-01-29 EP EP89116769A patent/EP0349021B1/de not_active Expired - Lifetime
- 1986-01-29 EP EP19890116770 patent/EP0349022A3/de not_active Withdrawn
- 1986-01-29 DE DE3650186T patent/DE3650186T2/de not_active Expired - Lifetime
- 1986-01-29 DE DE8686101172T patent/DE3672030D1/de not_active Expired - Lifetime
-
1988
- 1988-02-05 US US07/154,528 patent/US4907059A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3672030D1 (de) | 1990-07-19 |
EP0349022A3 (de) | 1991-07-24 |
EP0192093B1 (de) | 1990-06-13 |
DE3650186T2 (de) | 1995-05-24 |
EP0349021B1 (de) | 1994-12-28 |
EP0349021A3 (de) | 1991-07-24 |
US4907059A (en) | 1990-03-06 |
EP0349021A2 (de) | 1990-01-03 |
EP0349022A2 (de) | 1990-01-03 |
EP0192093A1 (de) | 1986-08-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3769400D1 (de) | Verkapselte halbleiteranordnung und verfahren zu deren herstellung. | |
DE3679087D1 (de) | Halbleitervorrichtung und verfahren zu seiner herstellung. | |
DE3586822D1 (de) | Halbleiteranordnung und verfahren zu deren herstellung. | |
DE3671259D1 (de) | Kettengewirkte raeumliche konstruktion und verfahren und vorrichtung zu deren herstellung. | |
DE68922254D1 (de) | Halbleiterspeicher und Verfahren zu deren Herstellung. | |
DE3381711D1 (de) | Halbleiteranordnung und verfahren zu deren herstellung. | |
DE3689735D1 (de) | Verfahren und Gerät zur Herstellung von Halbleitervorrichtungen. | |
DE3675741D1 (de) | Vernetzte copolyamidimide und verfahren zu deren herstellung. | |
DE3587798D1 (de) | SoI-Halbleiteranordnung und Verfahren zu ihrer Herstellung. | |
DE3854455D1 (de) | Halbleiteranordnung und Verfahren zu ihrer Herstellung. | |
DE3684085D1 (de) | Reinigungsmittelzusammensetzung und verfahren zu deren herstellung. | |
DE3763993D1 (de) | Leichtisolierplatten und verfahren zu deren herstellung. | |
DE3680859D1 (de) | Chinolinderivate und verfahren zu deren herstellung. | |
DE69207285D1 (de) | Isoliertes Trägerelement für Halbleitervorrichtung und Verfahren zu deren Herstellung | |
DE3852782D1 (de) | Mit Harz eingekapselte Halbleiteranordnung und Verfahren zu deren Herstellung. | |
DE3667259D1 (de) | Orientierte elastomerfolie und verfahren zu deren herstellung. | |
DE3681938D1 (de) | Halbleitersensor und verfahren zu seiner herstellung. | |
DE3588050D1 (de) | Halbleiterspeichervorrichtung und Verfahren zu deren Herstellung. | |
DE3782952D1 (de) | Supraleitende dipolmagnete und verfahren zu deren herstellung. | |
DE3686597D1 (de) | Uricase und verfahren zu deren herstellung. | |
DE3682955D1 (de) | Einrichtung zur ozonerzeugung und verfahren zu deren betrieb. | |
DE3484825D1 (de) | Halbleiterlaser-vorrichtung und verfahren zu deren herstellung. | |
DE3670911D1 (de) | Elektrochemisches geraet und verfahren zu seiner herstellung. | |
DE3683986D1 (de) | Dreidimensionale planare epitaxiale halbleiterstrukturen und verfahren zu deren herstellung. | |
DE3650186D1 (de) | Halbleiteranordnung und Verfahren zu deren Herstellung. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |