DE3586944D1 - Vorrichtung zum abtrennen von halbleiterscheiben. - Google Patents

Vorrichtung zum abtrennen von halbleiterscheiben.

Info

Publication number
DE3586944D1
DE3586944D1 DE8585116581T DE3586944T DE3586944D1 DE 3586944 D1 DE3586944 D1 DE 3586944D1 DE 8585116581 T DE8585116581 T DE 8585116581T DE 3586944 T DE3586944 T DE 3586944T DE 3586944 D1 DE3586944 D1 DE 3586944D1
Authority
DE
Germany
Prior art keywords
separating semiconductor
semiconductor discs
discs
separating
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585116581T
Other languages
English (en)
Other versions
DE3586944T2 (de
Inventor
Takatoshi Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp, Disco Abrasive Systems Ltd filed Critical Disco Corp
Application granted granted Critical
Publication of DE3586944D1 publication Critical patent/DE3586944D1/de
Publication of DE3586944T2 publication Critical patent/DE3586944T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H01L21/14—Treatment of the complete device, e.g. by electroforming to form a barrier
    • H01L21/145—Ageing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27B—SAWS FOR WOOD OR SIMILAR MATERIAL; COMPONENTS OR ACCESSORIES THEREFOR
    • B27B31/00—Arrangements for conveying, loading, turning, adjusting, or discharging the log or timber, specially designed for saw mills or sawing machines
    • B27B31/06—Adjusting equipment, e.g. using optical projection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Health & Medical Sciences (AREA)
  • Gerontology & Geriatric Medicine (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE8585116581T 1984-12-27 1985-12-27 Vorrichtung zum abtrennen von halbleiterscheiben. Expired - Lifetime DE3586944T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27412684 1984-12-27
JP10403085 1985-05-17

Publications (2)

Publication Number Publication Date
DE3586944D1 true DE3586944D1 (de) 1993-02-11
DE3586944T2 DE3586944T2 (de) 1993-05-06

Family

ID=26444588

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585116581T Expired - Lifetime DE3586944T2 (de) 1984-12-27 1985-12-27 Vorrichtung zum abtrennen von halbleiterscheiben.

Country Status (4)

Country Link
US (1) US4688540A (de)
EP (1) EP0186201B1 (de)
KR (1) KR900001232B1 (de)
DE (1) DE3586944T2 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3735449A1 (de) * 1987-10-20 1989-05-03 Convac Gmbh Fertigungssystem fuer halbleitersubstrate
JPH01143211A (ja) * 1987-11-27 1989-06-05 Takatori Haitetsuku:Kk ウエハーに対する保護テープの貼付け切り抜き方法および装置
JPH0612768B2 (ja) * 1990-05-18 1994-02-16 信越半導体株式会社 内周刃スライサーによる単結晶インゴットの切断方法及び装置
JP2759165B2 (ja) * 1992-04-28 1998-05-28 カシオ計算機株式会社 ウェハ載置用シート拡張方法およびその装置
US5398458A (en) * 1992-11-19 1995-03-21 Craftsman Marble, Granite & Tile Co. Process of manufacturing stone tile mosaics and apparatus therefor
DE69534098T2 (de) * 1994-01-18 2006-02-09 Dynatex International (Inc.), Santa Rosa Verfahren und vorrichtung zum anritzen und/oder brechen von halbleiterplättchen
GB2300137B (en) * 1995-04-28 1997-06-18 Neu Dynamics Corp Carrier strip trimming
US5839337A (en) * 1995-04-28 1998-11-24 Neu; H. Karl Semiconductor carrier strip trimming apparatus
JP3223421B2 (ja) * 1996-08-13 2001-10-29 株式会社東京精密 ダイシング装置
US6250192B1 (en) * 1996-11-12 2001-06-26 Micron Technology, Inc. Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
US6493934B2 (en) 1996-11-12 2002-12-17 Salman Akram Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
US6006739A (en) * 1996-11-12 1999-12-28 Micron Technology, Inc. Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
TW418505B (en) 1997-07-02 2001-01-11 Disco Corp Device and method for precise cutting
JP3203364B2 (ja) * 1997-12-01 2001-08-27 株式会社東京精密 アライメント方法及びその装置
US6357330B1 (en) * 1999-01-07 2002-03-19 Intel Corporation Method and apparatus for cutting a wafer
JP4509243B2 (ja) * 1999-03-04 2010-07-21 株式会社ディスコ 積層被加工物の切削方法
JP4447074B2 (ja) * 1999-06-21 2010-04-07 株式会社ディスコ 切削装置
JP4394210B2 (ja) * 1999-09-08 2010-01-06 株式会社ディスコ 切削方法
JP4347960B2 (ja) * 1999-09-14 2009-10-21 株式会社ディスコ ダイシング方法
JP2001196328A (ja) * 2000-01-12 2001-07-19 Disco Abrasive Syst Ltd Ｃｓｐ基板の分割方法
DE10019054C1 (de) * 2000-04-18 2001-12-13 Kronotec Ag Verfahren zum Zuschneiden von Paneelen oder dergleichen
JP2002237472A (ja) * 2001-02-07 2002-08-23 Disco Abrasive Syst Ltd 被加工物の切削方法
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
US7267037B2 (en) * 2001-05-05 2007-09-11 David Walter Smith Bidirectional singulation saw and method
US20020185121A1 (en) * 2001-06-06 2002-12-12 Farnworth Warren M. Group encapsulated dicing chuck
US20030056628A1 (en) * 2001-09-27 2003-03-27 Eli Razon Coaxial spindle cutting saw
JP2003124155A (ja) * 2001-10-12 2003-04-25 Disco Abrasive Syst Ltd 切削装置
JP2003151920A (ja) * 2001-11-09 2003-05-23 Disco Abrasive Syst Ltd 切削機における被加工物位置合わせ方法
JP2004146727A (ja) * 2002-10-28 2004-05-20 Tokyo Seimitsu Co Ltd ウェーハの搬送方法
DE10253250B4 (de) * 2002-11-15 2004-09-30 Uni-Tek System Inc. Automatisches Präzisionsausrichtungsverfahren für eine Halbleiterwaferschneidevorrichtung
TWI249762B (en) * 2003-12-03 2006-02-21 Ind Tech Res Inst Sheet cutting device
JP4481667B2 (ja) * 2004-02-02 2010-06-16 株式会社ディスコ 切削方法
US7281535B2 (en) * 2004-02-23 2007-10-16 Towa Intercon Technology, Inc. Saw singulation
US7804043B2 (en) * 2004-06-15 2010-09-28 Laserfacturing Inc. Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser
SG120197A1 (en) * 2004-08-23 2006-03-28 Rokko Systems Pte Ltd Supply mechanism for the chuck of an integrated circuit dicing device
KR101299322B1 (ko) * 2004-08-23 2013-08-26 록코 시스템즈 피티이 리미티드 집적 회로 다이싱 장치의 척용 공급 메카니즘
US7731798B2 (en) * 2004-12-01 2010-06-08 Ultratech, Inc. Heated chuck for laser thermal processing
JP2007206783A (ja) * 2006-01-31 2007-08-16 Disco Abrasive Syst Ltd メモリーカード成型装置及びメモリーカードの成型方法
WO2008142670A2 (en) * 2007-05-22 2008-11-27 Assaf Malul Repetitive stroke work system
SG142402A1 (en) * 2008-05-02 2009-11-26 Rokko Ventures Pte Ltd Apparatus and method for multiple substrate processing
US11406791B2 (en) 2009-04-03 2022-08-09 Scientia Vascular, Inc. Micro-fabricated guidewire devices having varying diameters
JP5751709B2 (ja) * 2008-12-08 2015-07-22 サイエンティア バスキュラー エルエルシー 製品に切り込みを形成するためのマイクロカット装置
US10363389B2 (en) 2009-04-03 2019-07-30 Scientia Vascular, Llc Micro-fabricated guidewire devices having varying diameters
US9950137B2 (en) 2009-04-03 2018-04-24 Scientia Vascular, Llc Micro-fabricated guidewire devices formed with hybrid materials
US9616195B2 (en) 2009-04-03 2017-04-11 Scientia Vascular, Llc Micro-fabricated catheter devices having varying diameters
CN102729339B (zh) * 2011-04-01 2014-11-26 涂政德 滚切机及滚切方法
US20130217310A1 (en) * 2012-02-21 2013-08-22 Chih-hao Chen Wafer Processing Equipment
JP5115671B1 (ja) * 2012-05-30 2013-01-09 富士ゼロックス株式会社 ウエハ切断装置、半導体素子の製造方法
US9508570B2 (en) * 2013-10-21 2016-11-29 Asm Technology Singapore Pte Ltd Singulation apparatus and method
CN104647615A (zh) * 2013-11-15 2015-05-27 台湾暹劲股份有限公司 晶圆切割装置及其切割方法
EP3164250B1 (de) * 2014-07-02 2018-09-12 Panotec SRL Schneidvorrichtung zum schneiden von relativ harten werkstoffen wie papier, karton, kunstoff- oder kompositefolien
US11052228B2 (en) 2016-07-18 2021-07-06 Scientia Vascular, Llc Guidewire devices having shapeable tips and bypass cuts
US11207502B2 (en) 2016-07-18 2021-12-28 Scientia Vascular, Llc Guidewire devices having shapeable tips and bypass cuts
US10821268B2 (en) 2016-09-14 2020-11-03 Scientia Vascular, Llc Integrated coil vascular devices
US11452541B2 (en) 2016-12-22 2022-09-27 Scientia Vascular, Inc. Intravascular device having a selectively deflectable tip
AU2018273992B2 (en) 2017-05-26 2023-11-16 Scientia Vascular, Inc. Micro-fabricated medical device having a non-helical cut arrangement
JP7028607B2 (ja) * 2017-11-06 2022-03-02 株式会社ディスコ 切削装置
US11305095B2 (en) 2018-02-22 2022-04-19 Scientia Vascular, Llc Microfabricated catheter having an intermediate preferred bending section
US10703016B2 (en) 2018-06-20 2020-07-07 Texas Instruments Incorporated Semiconductor sawing method and system
US12011555B2 (en) 2019-01-15 2024-06-18 Scientia Vascular, Inc. Guidewire with core centering mechanism

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2187299A (en) * 1935-08-13 1940-01-16 Burkhardt Otto Wilhelm Dressing of individual blocks of stone
FR1240358A (fr) * 1959-04-10 1960-09-02 Intermetall Procédé de découpage de matériaux semi-conducteurs et éléments conformes à ceux obtenus
US3289662A (en) * 1964-02-04 1966-12-06 Swenson Granite Co Inc John Dual head sawing machine
US4328553A (en) * 1976-12-07 1982-05-04 Computervision Corporation Method and apparatus for targetless wafer alignment
CH635769A5 (fr) * 1980-03-10 1983-04-29 Far Fab Assortiments Reunies Installation pour le sciage de plaques et dispositif de manutention pour une telle installation.

Also Published As

Publication number Publication date
US4688540A (en) 1987-08-25
EP0186201A3 (en) 1989-04-12
EP0186201B1 (de) 1992-12-30
KR900001232B1 (ko) 1990-03-05
EP0186201A2 (de) 1986-07-02
DE3586944T2 (de) 1993-05-06
KR860005430A (ko) 1986-07-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition