DE3578262D1 - Elektrode eines halbleiterbauelements und verfahren zu ihrer herstellung. - Google Patents

Elektrode eines halbleiterbauelements und verfahren zu ihrer herstellung.

Info

Publication number
DE3578262D1
DE3578262D1 DE8585102349T DE3578262T DE3578262D1 DE 3578262 D1 DE3578262 D1 DE 3578262D1 DE 8585102349 T DE8585102349 T DE 8585102349T DE 3578262 T DE3578262 T DE 3578262T DE 3578262 D1 DE3578262 D1 DE 3578262D1
Authority
DE
Germany
Prior art keywords
electrode
production
semiconductor component
semiconductor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585102349T
Other languages
English (en)
Inventor
Yoshihiro C O Patent D Kishita
Motoki C O Patent Div Furukawa
Tatsuro C O Patent Divi Mitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3578262D1 publication Critical patent/DE3578262D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66848Unipolar field-effect transistors with a Schottky gate, i.e. MESFET
    • H01L29/66856Unipolar field-effect transistors with a Schottky gate, i.e. MESFET with an active layer made of a group 13/15 material
    • H01L29/66863Lateral single gate transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/3213Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32131Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by physical means only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/47Schottky barrier electrodes
    • H01L29/475Schottky barrier electrodes on AIII-BV compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE8585102349T 1984-03-02 1985-03-01 Elektrode eines halbleiterbauelements und verfahren zu ihrer herstellung. Expired - Lifetime DE3578262D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59038629A JPS60183726A (ja) 1984-03-02 1984-03-02 半導体装置の電極パタ−ンの形成方法

Publications (1)

Publication Number Publication Date
DE3578262D1 true DE3578262D1 (de) 1990-07-19

Family

ID=12530530

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585102349T Expired - Lifetime DE3578262D1 (de) 1984-03-02 1985-03-01 Elektrode eines halbleiterbauelements und verfahren zu ihrer herstellung.

Country Status (4)

Country Link
US (1) US4650543A (de)
EP (1) EP0156185B1 (de)
JP (1) JPS60183726A (de)
DE (1) DE3578262D1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117868A (ja) * 1984-11-14 1986-06-05 Toshiba Corp 半導体装置及びその製造方法
US4965218A (en) * 1985-10-21 1990-10-23 Itt Corporation Self-aligned gate realignment employing planarizing overetch
US4735913A (en) * 1986-05-06 1988-04-05 Bell Communications Research, Inc. Self-aligned fabrication process for GaAs MESFET devices
US4849376A (en) * 1987-01-12 1989-07-18 Itt A Division Of Itt Corporation Gallium Arsenide Technology Center Self-aligned refractory gate process with self-limiting undercut of an implant mask
US4824803A (en) * 1987-06-22 1989-04-25 Standard Microsystems Corporation Multilayer metallization method for integrated circuits
JPH01109770A (ja) * 1987-10-22 1989-04-26 Mitsubishi Electric Corp 半導体装置の製造方法
US4935805A (en) * 1988-05-16 1990-06-19 Eaton Corporation T-type undercut electrical contact on a semiconductor substrate
US4923827A (en) * 1988-05-16 1990-05-08 Eaton Corporation T-type undercut electrical contact process on a semiconductor substrate
ATE86797T1 (de) * 1988-12-16 1993-03-15 Siemens Ag Verfahren zur selbstjustierten herstellung von kontakten zwischen in uebereinander angeordneten verdrahtungsebenen einer integrierten schaltung enthaltenen leiterbahnen.
US5153754A (en) * 1989-06-30 1992-10-06 General Electric Company Multi-layer address lines for amorphous silicon liquid crystal display devices
US5126007A (en) * 1990-11-16 1992-06-30 At&T Bell Laboratories Method for etching a pattern in layer of gold
EP0499979A3 (en) * 1991-02-16 1993-06-09 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
JP2794499B2 (ja) 1991-03-26 1998-09-03 株式会社半導体エネルギー研究所 半導体装置の作製方法
US5168071A (en) * 1991-04-05 1992-12-01 At&T Bell Laboratories Method of making semiconductor devices
US5212147A (en) * 1991-05-15 1993-05-18 Hewlett-Packard Company Method of forming a patterned in-situ high Tc superconductive film
JP2845303B2 (ja) 1991-08-23 1999-01-13 株式会社 半導体エネルギー研究所 半導体装置とその作製方法
JPH07161659A (ja) * 1993-12-07 1995-06-23 Nec Corp 半導体装置およびその製造方法
US6057604A (en) * 1993-12-17 2000-05-02 Stmicroelectronics, Inc. Integrated circuit contact structure having gate electrode protection for self-aligned contacts with zero enclosure
US5843289A (en) * 1996-01-22 1998-12-01 Etex Corporation Surface modification of medical implants
AU1448301A (en) * 1999-11-01 2001-05-14 Bmc Industries, Inc. Metal composite articles and method of manufacture
US6365057B1 (en) 1999-11-01 2002-04-02 Bmc Industries, Inc. Circuit manufacturing using etched tri-metal media
US6409930B1 (en) 1999-11-01 2002-06-25 Bmc Industries, Inc. Lamination of circuit sub-elements while assuring registration
US6468439B1 (en) 1999-11-01 2002-10-22 Bmc Industries, Inc. Etching of metallic composite articles
DE102004019588A1 (de) * 2004-04-22 2005-11-17 Osram Opto Semiconductors Gmbh Verfahren zur Strukturierung von zumindest einer Schicht sowie elektrisches Bauelement mit Strukturen aus der Schicht
US20070155899A1 (en) * 2005-12-21 2007-07-05 Ips Corporation Elastic methacrylate compositions
US20070155879A1 (en) * 2005-12-22 2007-07-05 Ips Corporation Adhesive compositions for bonding metals
JP2008179466A (ja) * 2007-01-26 2008-08-07 Ss Pharmaceut Co Ltd 錠剤搬送装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3994758A (en) * 1973-03-19 1976-11-30 Nippon Electric Company, Ltd. Method of manufacturing a semiconductor device having closely spaced electrodes by perpendicular projection
JPS5279664A (en) * 1975-12-25 1977-07-04 Mitsubishi Electric Corp Forming method for electrodes of semiconductor devices
US4272348A (en) * 1978-11-20 1981-06-09 International Business Machines Corporation Bubble device fabrication
US4301233A (en) * 1980-05-29 1981-11-17 Eaton Corporation Beam lead Schottky barrier diode for operation at millimeter and submillimeter wave frequencies
JPS57128071A (en) * 1981-01-30 1982-08-09 Fujitsu Ltd Field-effect type semiconductor device and manufacture thereof
JPS5886724A (ja) * 1981-11-18 1983-05-24 Nec Corp 電極および配線の製造方法

Also Published As

Publication number Publication date
EP0156185A1 (de) 1985-10-02
JPS60183726A (ja) 1985-09-19
US4650543A (en) 1987-03-17
EP0156185B1 (de) 1990-06-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee