DE19982290T1 - Wafer-Poliervorrichtung und Verfahren zum Erfassen der Polierrate - Google Patents

Wafer-Poliervorrichtung und Verfahren zum Erfassen der Polierrate

Info

Publication number
DE19982290T1
DE19982290T1 DE19982290T DE19982290T DE19982290T1 DE 19982290 T1 DE19982290 T1 DE 19982290T1 DE 19982290 T DE19982290 T DE 19982290T DE 19982290 T DE19982290 T DE 19982290T DE 19982290 T1 DE19982290 T1 DE 19982290T1
Authority
DE
Germany
Prior art keywords
detecting
polishing
wafer
polishing apparatus
rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19982290T
Other languages
English (en)
Inventor
Takao Inaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP29575598A external-priority patent/JP3082850B2/ja
Priority claimed from JP29571998A external-priority patent/JP3045232B2/ja
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of DE19982290T1 publication Critical patent/DE19982290T1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE19982290T 1998-10-16 1999-10-15 Wafer-Poliervorrichtung und Verfahren zum Erfassen der Polierrate Ceased DE19982290T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP29575598A JP3082850B2 (ja) 1998-10-16 1998-10-16 ウェーハ研磨装置
JP29571998A JP3045232B2 (ja) 1998-10-16 1998-10-16 ウェーハ研磨装置及び研磨量検出方法
PCT/JP1999/005714 WO2000023228A1 (fr) 1998-10-16 1999-10-15 Meuleuse de plaquette et procede de detection de la quantite de meulage

Publications (1)

Publication Number Publication Date
DE19982290T1 true DE19982290T1 (de) 2002-05-29

Family

ID=26560392

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19982290T Ceased DE19982290T1 (de) 1998-10-16 1999-10-15 Wafer-Poliervorrichtung und Verfahren zum Erfassen der Polierrate

Country Status (6)

Country Link
US (1) US6402589B1 (de)
DE (1) DE19982290T1 (de)
GB (1) GB2347102B (de)
MY (1) MY123230A (de)
TW (1) TW411299B (de)
WO (1) WO2000023228A1 (de)

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Publication number Priority date Publication date Assignee Title
JP3916375B2 (ja) * 2000-06-02 2007-05-16 株式会社荏原製作所 ポリッシング方法および装置
US6562185B2 (en) * 2001-09-18 2003-05-13 Advanced Micro Devices, Inc. Wafer based temperature sensors for characterizing chemical mechanical polishing processes
US6741913B2 (en) * 2001-12-11 2004-05-25 International Business Machines Corporation Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system
US6937915B1 (en) 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
US7507148B2 (en) * 2002-09-27 2009-03-24 Sumco Techxiv Corporation Polishing apparatus, polishing head and polishing method
JP2005034959A (ja) * 2003-07-16 2005-02-10 Ebara Corp 研磨装置及びリテーナリング
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
US7622052B1 (en) * 2006-06-23 2009-11-24 Novellus Systems, Inc. Methods for chemical mechanical planarization and for detecting endpoint of a CMP operation
JP4952155B2 (ja) * 2006-09-12 2012-06-13 富士通株式会社 研磨条件予測プログラム、記録媒体、研磨条件予測装置および研磨条件予測方法
JP2008258510A (ja) * 2007-04-07 2008-10-23 Tokyo Seimitsu Co Ltd Ｃｍｐ装置の研磨条件管理装置及び研磨条件管理方法
JP2008277450A (ja) * 2007-04-26 2008-11-13 Tokyo Seimitsu Co Ltd Ｃｍｐ装置の研磨条件管理装置及び研磨条件管理方法
JP5099111B2 (ja) 2009-12-24 2012-12-12 信越半導体株式会社 両面研磨装置
US8968052B2 (en) 2011-10-21 2015-03-03 Strasbaugh Systems and methods of wafer grinding
US9393669B2 (en) 2011-10-21 2016-07-19 Strasbaugh Systems and methods of processing substrates
TW201335983A (zh) * 2012-01-11 2013-09-01 Strasbaugh 處理基材之系統及方法
US9610669B2 (en) 2012-10-01 2017-04-04 Strasbaugh Methods and systems for use in grind spindle alignment
US9457446B2 (en) 2012-10-01 2016-10-04 Strasbaugh Methods and systems for use in grind shape control adaptation
JP5973883B2 (ja) * 2012-11-15 2016-08-23 株式会社荏原製作所 基板保持装置および研磨装置
CN103019045A (zh) * 2012-12-11 2013-04-03 清华大学 一种具有防撞功能的硅片台
US9636797B2 (en) * 2014-02-12 2017-05-02 Applied Materials, Inc. Adjusting eddy current measurements
JP7264039B2 (ja) * 2019-12-19 2023-04-25 株式会社Sumco 研磨ヘッド、化学的機械的研磨装置、および、化学的機械的研磨方法
CN113664694A (zh) * 2021-07-29 2021-11-19 山西烁科晶体有限公司 碳化硅双面抛光中硅面及碳面去除厚度的测定方法

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Publication number Priority date Publication date Assignee Title
JPS5190095A (de) 1975-02-05 1976-08-06
JPS62257742A (ja) * 1986-05-01 1987-11-10 Nec Kyushu Ltd 半導体基板の厚さ測定方法
JPS6445568A (en) * 1987-08-11 1989-02-20 Mitsubishi Metal Corp Automatic dimensioning of lapping machine
JPH01188265A (ja) 1988-01-25 1989-07-27 Hitachi Ltd ラツプ加工装置
JPH04244371A (ja) * 1991-01-31 1992-09-01 Hitachi Ltd ラップ加工機における加工量測定方法
US5205082A (en) 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
JPH06270053A (ja) * 1993-03-25 1994-09-27 Japan Energy Corp 両面ポリシング加工量の自動測定方法及び自動測定装置、並びに自動両面ポリシング加工方法及び加工装置
US5643044A (en) * 1994-11-01 1997-07-01 Lund; Douglas E. Automatic chemical and mechanical polishing system for semiconductor wafers
JP3158934B2 (ja) 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
JPH08288245A (ja) * 1995-04-12 1996-11-01 Sony Corp 研磨装置及び研磨方法
EP0806266A3 (de) * 1996-05-09 1998-12-09 Canon Kabushiki Kaisha Polierverfahren und -vorrichtung zur Verwendung desselben
JP2778593B2 (ja) * 1996-05-31 1998-07-23 日本電気株式会社 研磨終点検出装置
JPH1034529A (ja) * 1996-07-18 1998-02-10 Speedfam Co Ltd 自動定寸装置
JPH1076464A (ja) * 1996-08-30 1998-03-24 Canon Inc 研磨方法及びそれを用いた研磨装置
JP3582554B2 (ja) 1996-12-17 2004-10-27 株式会社東京精密 ウェーハ研磨量測定装置
JPH10230454A (ja) * 1997-02-21 1998-09-02 Tokyo Seimitsu Co Ltd 研磨装置
KR100475845B1 (ko) 1997-04-04 2005-06-17 도쿄 세이미츄 코퍼레이션 리미티드 연마장치
JP2897207B1 (ja) 1997-04-04 1999-05-31 株式会社東京精密 研磨装置
JP2973404B2 (ja) 1997-07-11 1999-11-08 株式会社東京精密 ウェーハ研磨装置
US6261152B1 (en) * 1998-07-16 2001-07-17 Nikon Research Corporation Of America Heterdoyne Thickness Monitoring System
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing

Also Published As

Publication number Publication date
US6402589B1 (en) 2002-06-11
MY123230A (en) 2006-05-31
GB2347102A (en) 2000-08-30
TW411299B (en) 2000-11-11
GB0014585D0 (en) 2000-08-09
GB2347102B (en) 2002-12-11
WO2000023228A1 (fr) 2000-04-27

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8607 Notification of search results after publication
8131 Rejection