AU4449197A - Wafer gripping device - Google Patents

Wafer gripping device

Info

Publication number
AU4449197A
AU4449197A AU44491/97A AU4449197A AU4449197A AU 4449197 A AU4449197 A AU 4449197A AU 44491/97 A AU44491/97 A AU 44491/97A AU 4449197 A AU4449197 A AU 4449197A AU 4449197 A AU4449197 A AU 4449197A
Authority
AU
Australia
Prior art keywords
gripping device
wafer gripping
wafer
gripping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU44491/97A
Inventor
Christian Balg
Jakob Blattner
Bernhard Strasser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Staeubli AG
Original Assignee
Staeubli AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH02458/96A external-priority patent/CH697146A5/en
Application filed by Staeubli AG filed Critical Staeubli AG
Publication of AU4449197A publication Critical patent/AU4449197A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU44491/97A 1996-10-09 1997-10-08 Wafer gripping device Abandoned AU4449197A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CH2458/96 1996-10-09
CH02458/96A CH697146A5 (en) 1996-10-09 1996-10-09 Gripping device for handling wafers.
US08889150 1997-07-07
US08/889,150 US6092971A (en) 1996-10-09 1997-07-07 Wafer gripping device adapted to swivel wafers taken from a horizontal position in a storage container
PCT/CH1997/000383 WO1998015971A1 (en) 1996-10-09 1997-10-08 Wafer gripping device

Publications (1)

Publication Number Publication Date
AU4449197A true AU4449197A (en) 1998-05-05

Family

ID=25690499

Family Applications (1)

Application Number Title Priority Date Filing Date
AU44491/97A Abandoned AU4449197A (en) 1996-10-09 1997-10-08 Wafer gripping device

Country Status (4)

Country Link
KR (1) KR100521725B1 (en)
AU (1) AU4449197A (en)
DE (1) DE19781101D2 (en)
WO (1) WO1998015971A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH693726A5 (en) * 1998-07-09 2003-12-31 Tec Sem Ag Apparatus and method for providing a full wafer stack.
KR100564544B1 (en) * 1999-01-14 2006-03-28 삼성전자주식회사 Wafer loading boat
KR102620419B1 (en) 2021-09-03 2024-01-02 이현오 Insulation gripper for transporting semiconductor wafers

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2656599B1 (en) * 1989-12-29 1992-03-27 Commissariat Energie Atomique DEVICE FOR STORING FLAT OBJECTS IN A CASSETTE WITH INTERMEDIATE SHELVES.
US5615988A (en) * 1995-07-07 1997-04-01 Pri Automation, Inc. Wafer transfer system having rotational capability

Also Published As

Publication number Publication date
KR20000048997A (en) 2000-07-25
DE19781101D2 (en) 1999-12-02
WO1998015971A1 (en) 1998-04-16
KR100521725B1 (en) 2005-10-17

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