DE1071170B - - Google Patents
Info
- Publication number
- DE1071170B DE1071170B DENDAT1071170D DE1071170DA DE1071170B DE 1071170 B DE1071170 B DE 1071170B DE NDAT1071170 D DENDAT1071170 D DE NDAT1071170D DE 1071170D A DE1071170D A DE 1071170DA DE 1071170 B DE1071170 B DE 1071170B
- Authority
- DE
- Germany
- Prior art keywords
- insulating
- lie
- components
- marked
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000002105 Tongue Anatomy 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 241000220450 Cajanus cajan Species 0.000 claims 1
- 210000003800 Pharynx Anatomy 0.000 claims 1
- 235000015115 caffè latte Nutrition 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 101700050171 tutl Proteins 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 4
- 240000006240 Linum usitatissimum Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000001747 exhibiting Effects 0.000 description 1
- 210000000056 organs Anatomy 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Publications (1)
Publication Number | Publication Date |
---|---|
DE1071170B true DE1071170B (da) | 1959-12-17 |
Family
ID=595917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DENDAT1071170D Pending DE1071170B (da) |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE1071170B (da) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4688867A (en) * | 1985-01-19 | 1987-08-25 | Allied Corporation | Circuit board with integral positioning means |
EP0761075A1 (en) * | 1994-05-25 | 1997-03-12 | James Cook University of North Queensland | Printed circuit board socket |
EP0797379A3 (de) * | 1996-03-18 | 1998-01-07 | KRONE Aktiengesellschaft | Leiterplatte und Verfahren zum lagegegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte |
EP2117285A1 (de) * | 2008-04-29 | 2009-11-11 | Siemens Aktiengesellschaft Österreich | Schaltungsträger zur Aufnahme eines Ferrit-Bauelements |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB758688A (en) * | 1953-04-07 | 1956-10-10 | T S Skillman And Company Pty L | Improvements in printed circuit arrangements |
US2777039A (en) * | 1954-06-29 | 1957-01-08 | Standard Coil Prod Co Inc | Resistor elements adapted for use in connection with printed circuits |
GB784709A (en) * | 1953-08-13 | 1957-10-16 | Standard Coil Prod Co Inc | Fixed frequency amplifier |
-
0
- DE DENDAT1071170D patent/DE1071170B/de active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB758688A (en) * | 1953-04-07 | 1956-10-10 | T S Skillman And Company Pty L | Improvements in printed circuit arrangements |
GB784709A (en) * | 1953-08-13 | 1957-10-16 | Standard Coil Prod Co Inc | Fixed frequency amplifier |
US2777039A (en) * | 1954-06-29 | 1957-01-08 | Standard Coil Prod Co Inc | Resistor elements adapted for use in connection with printed circuits |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4688867A (en) * | 1985-01-19 | 1987-08-25 | Allied Corporation | Circuit board with integral positioning means |
EP0761075A1 (en) * | 1994-05-25 | 1997-03-12 | James Cook University of North Queensland | Printed circuit board socket |
EP0761075A4 (en) * | 1994-05-25 | 1998-09-23 | Univ James Cook | PCB SOCKET |
EP0797379A3 (de) * | 1996-03-18 | 1998-01-07 | KRONE Aktiengesellschaft | Leiterplatte und Verfahren zum lagegegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte |
US5999412A (en) * | 1996-03-18 | 1999-12-07 | Krone Aktiengesellschaft | Printed-circuit board and method for the precise assembly and soldering of electronic components on the surface of the printed-circuit board |
EP2117285A1 (de) * | 2008-04-29 | 2009-11-11 | Siemens Aktiengesellschaft Österreich | Schaltungsträger zur Aufnahme eines Ferrit-Bauelements |
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