DE10026435A1 - Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED - Google Patents
Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LEDInfo
- Publication number
- DE10026435A1 DE10026435A1 DE10026435A DE10026435A DE10026435A1 DE 10026435 A1 DE10026435 A1 DE 10026435A1 DE 10026435 A DE10026435 A DE 10026435A DE 10026435 A DE10026435 A DE 10026435A DE 10026435 A1 DE10026435 A1 DE 10026435A1
- Authority
- DE
- Germany
- Prior art keywords
- phosphor
- radiation
- chlorosilicate
- green
- sio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004020 luminiscence type Methods 0.000 title description 5
- 238000006243 chemical reaction Methods 0.000 title description 4
- RAUZCLNLSNCUCD-UHFFFAOYSA-N [O-][Si]([O-])([O-])Cl.[Mg+2].P.[Ca+2] Chemical compound [O-][Si]([O-])([O-])Cl.[Mg+2].P.[Ca+2] RAUZCLNLSNCUCD-UHFFFAOYSA-N 0.000 title description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000011572 manganese Substances 0.000 claims abstract description 31
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 12
- 229910052693 Europium Inorganic materials 0.000 claims abstract description 11
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 claims abstract description 11
- RLMMPAFGVXFLEB-UHFFFAOYSA-N O[Si](O)(O)Cl.P Chemical compound O[Si](O)(O)Cl.P RLMMPAFGVXFLEB-UHFFFAOYSA-N 0.000 claims abstract description 10
- 230000005855 radiation Effects 0.000 claims description 18
- 230000003595 spectral effect Effects 0.000 claims description 12
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 11
- 230000005284 excitation Effects 0.000 claims description 6
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 claims description 3
- 239000002019 doping agent Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000007858 starting material Substances 0.000 claims description 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 239000008367 deionised water Substances 0.000 claims description 2
- 229910021641 deionized water Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 abstract description 2
- 239000011575 calcium Substances 0.000 description 10
- 239000011777 magnesium Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 6
- GTDCAOYDHVNFCP-UHFFFAOYSA-N chloro(trihydroxy)silane Chemical compound O[Si](O)(O)Cl GTDCAOYDHVNFCP-UHFFFAOYSA-N 0.000 description 5
- 238000000295 emission spectrum Methods 0.000 description 5
- 238000009877 rendering Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 206010001497 Agitation Diseases 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000000695 excitation spectrum Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- VYZCLCPZAJLOBI-UHFFFAOYSA-N calcium magnesium chloro(trioxido)silane Chemical group [Mg+2].[Ca+2].[O-][Si]([O-])([O-])Cl VYZCLCPZAJLOBI-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000010671 solid-state reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (11)
- a) Vermischen der Ausgangsmaterialien des Grundgitters CaCO3, MgO, SiO2 und CaCl2;
- b) Hinzufügen der Ausgangsmaterialen der Dotierstoffe Eu2O3 bzw. MnCO3;
- c) Vermischen aller Materialien und Erhitzen in reduzierender Atmosphäre, wobei die Dotierstoffe das Ca im Grundgerüst ersetzen, so dass ein Leuchtstoff der Sum menformel Ca8-×-yEuxMnyMg(SiO4)4Cl2, entsteht.
- d) Evtl. Waschen mit voll entionisiertem Wasser.
Priority Applications (20)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10026435A DE10026435A1 (de) | 2000-05-29 | 2000-05-29 | Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED |
EP01943068A EP1285467A1 (de) | 2000-05-29 | 2001-05-11 | Weiss emittierende beleuchtungseinheit auf led-basis |
KR1020027016158A KR20030007742A (ko) | 2000-05-29 | 2001-05-11 | Led계 백색광 발광 조명 유닛 |
CN01810321A CN1432198A (zh) | 2000-05-29 | 2001-05-11 | 基于led的发射白色的照明单元 |
PCT/DE2001/001821 WO2001093341A1 (de) | 2000-05-29 | 2001-05-11 | Weiss emittierende beleuchtungseinheit auf led-basis |
CA002410668A CA2410668A1 (en) | 2000-05-29 | 2001-05-11 | Led-based white-emitting illumination unit |
JP2002500458A JP5097999B2 (ja) | 2000-05-29 | 2001-05-11 | クロロシリケート蛍光体 |
US10/296,847 US20030146690A1 (en) | 2000-05-29 | 2001-05-11 | Led-based white-light emitting lighting unit |
PCT/DE2001/001955 WO2001093342A1 (de) | 2000-05-29 | 2001-05-23 | Weiss emittierende beleuchtungseinheit auf led-basis |
CNB018014879A CN1203557C (zh) | 2000-05-29 | 2001-05-23 | 基于发光二极管的发射白光的照明设备 |
JP2002500459A JP4695819B2 (ja) | 2000-05-29 | 2001-05-23 | Ledをベースとする白色発光照明ユニット |
CA002380444A CA2380444A1 (en) | 2000-05-29 | 2001-05-23 | Led-based white-emitting illumination unit |
KR1020027001040A KR100784573B1 (ko) | 2000-05-29 | 2001-05-23 | 발광다이오드에 기반을 둔 백색광을 방출하는 조명 기구 |
EP01943141A EP1206802B1 (de) | 2000-05-29 | 2001-05-23 | Weiss emittierende beleuchtungseinheit auf led-basis |
US10/031,578 US6504179B1 (en) | 2000-05-29 | 2001-05-23 | Led-based white-emitting illumination unit |
DE50113755T DE50113755D1 (de) | 2000-05-29 | 2001-05-23 | Weiss emittierende beleuchtungseinheit auf led-basis |
TW090112781A TW555832B (en) | 2000-05-29 | 2001-05-28 | White-emitting lighting-unit on LED-basis |
TW090112779A TW554030B (en) | 2000-05-29 | 2001-05-28 | Calcium-magnesium-chlorosilicate luminescent material and its application in luminescence-conversion-LED |
US11/022,439 US7002291B2 (en) | 2000-05-29 | 2004-12-22 | LED-based white-emitting illumination unit |
US11/321,822 US7183706B2 (en) | 2000-05-29 | 2005-12-29 | Led-based illumination unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10026435A DE10026435A1 (de) | 2000-05-29 | 2000-05-29 | Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10026435A1 true DE10026435A1 (de) | 2002-04-18 |
Family
ID=7643861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10026435A Withdrawn DE10026435A1 (de) | 2000-05-29 | 2000-05-29 | Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED |
Country Status (9)
Country | Link |
---|---|
US (3) | US20030146690A1 (de) |
EP (1) | EP1285467A1 (de) |
JP (1) | JP5097999B2 (de) |
KR (1) | KR20030007742A (de) |
CN (1) | CN1432198A (de) |
CA (1) | CA2410668A1 (de) |
DE (1) | DE10026435A1 (de) |
TW (1) | TW554030B (de) |
WO (1) | WO2001093341A1 (de) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6759804B2 (en) | 2001-09-27 | 2004-07-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Illumination device with at least one LED as light source |
DE102007028120A1 (de) | 2007-06-19 | 2008-12-24 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Chlorosilikat-Leuchtstoffs und damit hergestellter Leuchtstoff |
DE102008029191A1 (de) * | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung zur Hinterleuchtung eines Displays sowie ein Display mit einer solchen Beleuchtungseinrichtung |
DE102010031237A1 (de) | 2010-07-12 | 2012-01-12 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US8256947B2 (en) | 2006-06-26 | 2012-09-04 | Osram Opto Semiconductors Gmbh | Light-emitting device |
US8979318B2 (en) | 2004-08-05 | 2015-03-17 | Osram Opto Semiconductors Gmbh | Light source with a low color temperature |
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US6596195B2 (en) * | 2001-06-01 | 2003-07-22 | General Electric Company | Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same |
EP1435947B1 (de) * | 2001-10-19 | 2007-08-15 | Ortho-McNeil Pharmaceutical, Inc. | 2-phenyl benzimidazole und imidazo-¬4,5|-pyridine als cds1/chk2-inhibitoren und adjuvantien in der chemotherapie oder strahlungstherapie zur behandlung von krebs |
US7224000B2 (en) | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
US7800121B2 (en) * | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
US7224910B2 (en) * | 2002-10-25 | 2007-05-29 | Gennum Corporation | Direct attach optical receiver module and method of testing |
US6765237B1 (en) * | 2003-01-15 | 2004-07-20 | Gelcore, Llc | White light emitting device based on UV LED and phosphor blend |
DE102004003135A1 (de) | 2003-02-20 | 2004-09-02 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Beschichteter Leuchtstoff und lichtemittierende Vorrichtung mit derartigem Leuchtstoff |
JP2006523245A (ja) * | 2003-03-28 | 2006-10-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 粒子または原材料上に被覆物を形成させる方法および属する製品 |
DE10319091A1 (de) * | 2003-04-28 | 2004-09-09 | Siemens Ag | Leuchtstoff zum Umwandeln einer Primärstrahlung in eine Sekundärstrahlung |
US7484860B2 (en) * | 2003-07-02 | 2009-02-03 | S.C. Johnson & Son, Inc. | Combination white light and colored LED light device with active ingredient emission |
US6933535B2 (en) * | 2003-10-31 | 2005-08-23 | Lumileds Lighting U.S., Llc | Light emitting devices with enhanced luminous efficiency |
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US7837348B2 (en) | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
US7427366B2 (en) | 2004-07-06 | 2008-09-23 | Sarnoff Corporation | Efficient, green-emitting phosphors, and combinations with red-emitting phosphors |
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2000
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2001
- 2001-05-11 KR KR1020027016158A patent/KR20030007742A/ko not_active Application Discontinuation
- 2001-05-11 CA CA002410668A patent/CA2410668A1/en not_active Abandoned
- 2001-05-11 WO PCT/DE2001/001821 patent/WO2001093341A1/de not_active Application Discontinuation
- 2001-05-11 CN CN01810321A patent/CN1432198A/zh active Pending
- 2001-05-11 US US10/296,847 patent/US20030146690A1/en not_active Abandoned
- 2001-05-11 EP EP01943068A patent/EP1285467A1/de not_active Withdrawn
- 2001-05-11 JP JP2002500458A patent/JP5097999B2/ja not_active Expired - Lifetime
- 2001-05-28 TW TW090112779A patent/TW554030B/zh not_active IP Right Cessation
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2004
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Cited By (10)
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US6759804B2 (en) | 2001-09-27 | 2004-07-06 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Illumination device with at least one LED as light source |
US8979318B2 (en) | 2004-08-05 | 2015-03-17 | Osram Opto Semiconductors Gmbh | Light source with a low color temperature |
US8256947B2 (en) | 2006-06-26 | 2012-09-04 | Osram Opto Semiconductors Gmbh | Light-emitting device |
DE102007028120A1 (de) | 2007-06-19 | 2008-12-24 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Chlorosilikat-Leuchtstoffs und damit hergestellter Leuchtstoff |
DE102008029191A1 (de) * | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung zur Hinterleuchtung eines Displays sowie ein Display mit einer solchen Beleuchtungseinrichtung |
EP2238503A1 (de) * | 2008-01-31 | 2010-10-13 | OSRAM Opto Semiconductors GmbH | Beleuchtungseinrichtung zur hinterleuchtung eines displays sowie ein display mit einer solchen beleuchtungseinrichtung |
DE102010031237A1 (de) | 2010-07-12 | 2012-01-12 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
WO2012007369A1 (de) | 2010-07-12 | 2012-01-19 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement |
US9269866B2 (en) | 2010-07-12 | 2016-02-23 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
US9564560B2 (en) | 2010-07-12 | 2017-02-07 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
Also Published As
Publication number | Publication date |
---|---|
KR20030007742A (ko) | 2003-01-23 |
US7183706B2 (en) | 2007-02-27 |
US20050104503A1 (en) | 2005-05-19 |
TW554030B (en) | 2003-09-21 |
US20060103291A1 (en) | 2006-05-18 |
JP2003535477A (ja) | 2003-11-25 |
US7002291B2 (en) | 2006-02-21 |
WO2001093341A1 (de) | 2001-12-06 |
CA2410668A1 (en) | 2002-11-27 |
US20030146690A1 (en) | 2003-08-07 |
CN1432198A (zh) | 2003-07-23 |
EP1285467A1 (de) | 2003-02-26 |
JP5097999B2 (ja) | 2012-12-12 |
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