CN86101702A - Waxy-liquid adhesive - Google Patents
Waxy-liquid adhesive Download PDFInfo
- Publication number
- CN86101702A CN86101702A CN 86101702 CN86101702A CN86101702A CN 86101702 A CN86101702 A CN 86101702A CN 86101702 CN86101702 CN 86101702 CN 86101702 A CN86101702 A CN 86101702A CN 86101702 A CN86101702 A CN 86101702A
- Authority
- CN
- China
- Prior art keywords
- polishing
- silicon chip
- waxy
- carrier
- liquid adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Mechanical Treatment Of Semiconductor (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention is used for silicon wafer polishing production silicon chip is bonded in a kind of Waxy-liquid adhesive on the polishing carrier.
It is formulated at normal temperatures and pressures in proportion by trieline, rosin and softening agent.Can be bonded at silicon chip on the polishing carrier with it, at 50 ℃, 12kg/cm
2Pressure down during polishing silicon chip do not move, when polishing back carrier was cooled to-5 ℃, the silicon chip that is bonded on the polishing carrier was easy to take off.Be easy to the liquid wax on the silicon chip is cleaned with trichloroethylene steam.Be applicable on the extensive polished silicon slice production line and use.
Description
The invention belongs to silicon chip and be processed with a kind of novel Waxy-liquid adhesive that wax polishing is used.
Need to use a kind of caking agent of bonding silicon chip in the silicon wafer polishing technology.It entirely is bonded at some silicon chips on the garden shape pie alloy polishing carrier, then the polishing carrier that is stained with silicon chip is put into polishing machine silicon chip is polished.Polish temperature is about 50 ℃, and pressure is 12kg/cm
2The silicon chip that requirement is bonded on the polishing carrier must not become flexible.After having polished, the polishing carrier that is stained with silicon chip is taken out, again silicon chip is taken off from polishing carrier.
The caking agent that uses in the silicon wafer polishing technology mostly was solid state wax in the past.Its shortcoming is more, and main drawback is that the entire operation process all realizes that speed is slow by hand, and efficient is low, and quality of finish is not easy to guarantee.Use on the incompatibility large-scale production line.
China's silicon wafer polishing adopts the liquid wax of external import as caking agent in recent years.Liquid wax is sprinkling upon on the polishing carrier, after silicon chip glues, puts into the polishing machine polishing, after having thrown polishing carrier is put into the refrigerator cooling, after temperature dropped to-5 ℃, silicon chip was easy to take off, and was easy to liquid cured the cleaning on the silicon chip with trichloroethylene steam again.Therefore Waxy-liquid adhesive is suitable for using on the extensive silicon wafer polishing production line.But the liquid wax of import costs an arm and a leg, and formality is various, is difficult for guaranteeing to produce.
This Waxy-liquid adhesive provided by the invention, its purpose are to solve the bonding problem of silicon chip in the silicon wafer polishing scale operation, and the import substitution Waxy-liquid adhesive is saved foreign exchange.
Compound method of the present invention is as follows:
With trieline and rosin in 1(ml): ratio 1(g) is put into molten device, and molten device is airtight, avoids the trieline volatilization to run away.With the quiet room temperature that is placed on of molten device is in 23 °～25 ℃ the room, allows rosin dissolve.
When rosin dissolves fully behind trieline, again softening agent phosphorus benzene bis-acid potassium dibutylester and phosphorus benzene bis-acid potassium dioctyl ester are added the trieline rosin solution according to the ratio with rosin 1～3%, stir while add.
After adding softening agent, be in 23 °～25 ℃ the room with the quiet room temperature that is placed on of the trieline rosin solution that is added with softening agent.After spending 3～4 hours, the trieline rosin solution becomes the caking agent that translucent brown liquid promptly can be used as silicon wafer polishing.
Trieline (C
2HCe
3), rosin and phosphorus benzene bis-acid potassium dibutylester, (C
6H
4(COOC
4H
9)
2) phosphorus benzene bis-acid potassium dioctyl ester (C
6H
4(COOC
8H
17)
2) between ratio be: 100(ml): 100(g): 2(g): 2(g).
Waxy-liquid adhesive provided by the invention, proportion are 1.23g/Cm
3Viscosity is 8.6 centistokes, and is not movable in 15 °～70 ℃ bonding silicon chip jails, is easy to make silicon chip to come off from carrier in time below-5 ℃, is easy to the liquid wax on the silicon chip is cleaned with trichloroethylene steam.Be suitable for fully using on the extensive silicon wafer polishing production line.And and raw material abundance are made simply low price (5 yuan/liter).
Waxy-liquid adhesive provided by the invention, not being only applicable to silicon chip has on the wax polishing production line as caking agent, and is equally applicable to that similarly other has on the wax polishing production line as caking agent with silicon wafer polishing.
Claims (2)
1, a kind of Waxy-liquid adhesive by solvent and solute preparation is characterized in that solvent is a trieline, and solute is that rosin ， And is added with softening agent, phosphorus benzene bis-acid potassium dibutylester and phosphorus benzene bis-acid potassium dioctyl ester.
2, Waxy-liquid adhesive according to claim 1 is characterized in that trieline, rosin and phosphorus benzene bis-acid potassium dibutylester, the ratio of phosphorus benzene bis-acid potassium dioctyl ester is 100(ml): 100(g): 2(g): 2(g).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN86101702A CN86101702B (en) | 1986-03-12 | 1986-03-12 | Waxy-liquid adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN86101702A CN86101702B (en) | 1986-03-12 | 1986-03-12 | Waxy-liquid adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN86101702A true CN86101702A (en) | 1986-09-10 |
| CN86101702B CN86101702B (en) | 1988-12-14 |
Family
ID=4801489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN86101702A Expired CN86101702B (en) | 1986-03-12 | 1986-03-12 | Waxy-liquid adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN86101702B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107011839A (en) * | 2016-01-28 | 2017-08-04 | 北京保利世达科技有限公司 | A kind of liquid wax and preparation method thereof |
| CN115106914A (en) * | 2022-05-25 | 2022-09-27 | 无锡海力自控工程有限公司 | Sticking polishing process of monocrystalline thin silicon wafer |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5076723B2 (en) | 2007-08-09 | 2012-11-21 | 富士通株式会社 | Polishing apparatus, substrate and method for manufacturing electronic apparatus |
-
1986
- 1986-03-12 CN CN86101702A patent/CN86101702B/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107011839A (en) * | 2016-01-28 | 2017-08-04 | 北京保利世达科技有限公司 | A kind of liquid wax and preparation method thereof |
| CN115106914A (en) * | 2022-05-25 | 2022-09-27 | 无锡海力自控工程有限公司 | Sticking polishing process of monocrystalline thin silicon wafer |
| CN115106914B (en) * | 2022-05-25 | 2024-06-04 | 弘元绿色能源股份有限公司 | Pasting and polishing process of monocrystalline silicon wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN86101702B (en) | 1988-12-14 |
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| CF01 | Termination of patent right due to non-payment of annual fee |