CN2921938Y

CN2921938Y - Radiating device

Info

Publication number: CN2921938Y
Application number: CN 200620120558
Authority: CN
Inventors: 庄智远
Original assignee: Individual
Current assignee: Individual
Priority date: 2006-06-22
Filing date: 2006-06-22
Publication date: 2007-07-11
Anticipated expiration: 2016-06-22

Abstract

A radiating device mainly comprises a cool resource device made of a semi-conductor cooling patch, a heat conductive device connected with the hot face of the semi-conductor cooling patch for emitting the heat, while the cold face is connected with a cool conductive device that can transmit the cool resource onto the heat emission articles in the computer case, such that emitting the heat energy produced by the heat emission articles out of the case.

Description

Heat abstractor

Technical field

The utility model is about a kind of computer housing internal heat generation thing that is applied to, for example the heat abstractor of CPU, display card or power supply unit etc. refers to that especially a kind of being used for makes the heat energy of heat object generation conduct the outer heat abstractor of cabinet fast the low-temperature receiver that semiconductor chilling plate produces.

Background technology

Science and technology is maked rapid progress, and the speed that computer calculates is also more and more fast; Have some setbacks because CPU fast turn-around generation high temperature, its high temperature can make the PCU life-span shorten and operate, even cause when (down) machine, so generally all use heat radiator and fan to reduce cpu temperature.

But CPU speed constantly strengthens, the temperature of its generation has not been that general heat radiator or fan enough reduce its temperature, so general so-called water-cooled power converter is arranged at present, referring to shown in Figure 1, make the CPU cooling with water tank 91 and water pipe 92 in CPU radiating fin 93 cocycles, will flow through the hot water cooling of CPU with fan 94.But will effectively lower the temperature, then need large tracts of land heat abstractor and high-power fan just can allow instant water cool off, this will make the big relatively of entire heat dissipation dress volume change.Again, as with compressor air-conditioning refrigeration, its shortcoming is bulky, Heavy Weight and bad installation.

Referring to Fig. 2, be that its shortcoming is there be not temperature regulating device, then because of the extremely cold temperature difference is big, can produces water and reveal damage motherboard 98 with the another kind of embodiment on the semiconductor chilling plate 95 radiation fins 96 direct CPU 97 of storing again.The person of advancing because of semiconductor chilling plate 95 directly places on the CPU, can be because of substrate can't settle with substrate gap is too little, and high heat energy still quilt dispelled the heat nearby, may influence other elements, cause the problem of other hot polymerization collection on the contrary.

Summary of the invention

The utility model provides a heat abstractor, by being combined with heat-transfer device by semiconductor chilling plate low-temperature receiver device, reaches the heat energy that fast heat object is produced and discharges the outer effect of cabinet.

A kind of heat abstractor of the present utility model, mainly semiconductor chilling plate is arranged to be connected with a heat-transfer device and can dispel the heat, the low-temperature receiver of its generation then is sent to heat object via a conduit with low-temperature receiver, and for example CPU, display card or power supply unit etc. shed heat.Its concrete technical scheme is as follows:

A kind of heat abstractor is characterized in that, comprising: a low-temperature receiver device, have a semiconductor chilling plate that can produce a hot side and a huyashi-chuuka (cold chinese-style noodles) by electric current, and this semiconductor chilling plate is positioned at the perforate of the refrigeration bar that a heat-barrier material makes;

One in order to hot type is gone out the heat-transfer device of low-temperature receiver device, contacts with the hot side of above-mentioned semiconductor chilling plate; And

One cold guide apparatus contacts with the huyashi-chuuka (cold chinese-style noodles) of above-mentioned semiconductor chilling plate, and has one and be used for low-temperature receiver is conducted on the above-mentioned heat object conduit with cooling.

Wherein, further comprise a shell, and above-mentioned low-temperature receiver device, heat-transfer device and cold guide apparatus are fixed in this shell, extend on the heat object and the conduit of cold guide apparatus passes above-mentioned shell.

Wherein, the arbitrary device in low-temperature receiver device, heat-transfer device and the cold guide apparatus is fixed in this shell.

Wherein, heat-transfer device has a conducting strip that covers with above-mentioned semiconductor chilling plate hot side contact, and is connected with the high conduction thing that can heat energy be discharged by fan blowing on this conducting strip.

Wherein, the fan of heat-transfer device is positioned in the middle of the high conduction thing, and has a heat pipe in the high conduction thing; This heat pipe one end contacts with conducting strip, and unrolls in the high conduction thing.

Wherein, has a heat radiator on the fan of heat-transfer device.

Wherein, cold guide apparatus has a cool guide sheet that covers with above-mentioned semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) contact, and is connected with a high conduction thing that can low-temperature receiver be blown into above-mentioned conduit one end by a fan on this cool guide sheet.

Wherein, the conduit other end of cold guide apparatus is connected with a conduit fixed block, and this conduit fixed block contacts with heat object.

Wherein, has a heat radiator on the fan of cold guide apparatus.

Wherein, the conduit of cold guide apparatus has a plastic cement pipe that two kinds of low-temperature receivers can be provided simultaneously outward.

The utility model beneficial effect:

By above-mentioned heat abstractor, can the heat that CPU produced be lowered the temperature in the short time, low-temperature receiver is delivered on the CPU with conduit, and heat energy is discharged outside the cabinet, improve computer life-span and effective temperature that reduces CPU in the computer housing greatly.

Heat abstractor provided by the utility model, can overcome general with the bulky bad installation of conventional compression air conditioner air cooling or directly on CPU, install cooling piece, caused the cold water that can produce to reveal the shortcoming of damaging motherboard, perhaps general water cooling plant can't be lowered the temperature immediately or leak and be caused the computer running slow even when the shortcoming of machine.

Below, will structure of the present utility model and effect be described in detail according to the embodiment shown in the drawing.

Description of drawings

Fig. 1: the outside drawing that is a kind of known water-cooled power converter.

Fig. 2: be a kind of known outside drawing that the semiconductor chilling plate radiation fin directly is seated in the object of being lowered the temperature.

Fig. 3: be that major part of the present utility model is separated figure.

Fig. 4: the thin portion exploded view that is heat-transfer device in the utility model, low-temperature receiver device and cold guide apparatus.

Fig. 5: be assembled sectional view of the present utility model.

Fig. 6: the another kind of embodiment synoptic diagram that is heat-transfer device in the utility model.

Fig. 7: be the synoptic diagram that heat-transfer device and cold guide apparatus install a heat radiator again additional in the utility model.

Fig. 8: be the cut-open view that the conduit of cold guide apparatus in the utility model adds a plastic cement pipe outward.

Embodiment

See also Fig. 3 to Fig. 5, heat abstractor provided by the utility model has a shell 10, and a heat-transfer device 20, low-temperature receiver device 30 and a cold guide apparatus 40 have been assembled in its inside.

Shell 10 1 sides offer air intake 12, and the another side offers a heat outlet 13, and then there is an open-work 14 bottom surface.

Heat-transfer device 20 is constituted with a fan 21, a high conduction thing 22 and a conducting strip 23.Heat-transfer device 20 is discharged heat from the heat outlet 13 of shell 10.

Low-temperature receiver device 30 mainly has semiconductor cooling piece 31, and it is set in the perforate 321 of a refrigeration bar 32.311 of the pins of semiconductor chilling plate 31 connect power supply.

Cold guide apparatus 40 is constituted with a fan 41, a high conduction thing 42, a cool guide sheet 43, a conduit 44 and a conduit fixed block 45.The open-work 14 that conduit 44 passes shell 10 conducts to low-temperature receiver and heat object 100 contacted conduit fixed blocks 45.

After semiconductor chilling plate 31 in the utility model in the low-temperature receiver device 30 passes to power supply, produce heat in hot side 312, and huyashi-chuuka (cold chinese-style noodles) 313 generations are cold.Semiconductor chilling plate 31 is set in the perforate 321 of the refrigeration bar 32 that heat-barrier material makes to separate its hot and cold 313 and 312.The conducting strip made from the high conduction metal material on the hot side 312 of semiconductor chilling plate 31 23 is with the covering of contact, and the cool guide sheet 43 that huyashi-chuuka (cold chinese-style noodles) 313 times is made with the high conduction metal material is with the covering of contact.

Conducting strip 23 is connected with high conduction thing 22, and with fan 21 blowings heat is discharged from hot gas outlet 13.

Cool guide sheet 43 is connected with high conduction thing 42, and low-temperature receiver is blown into conduit 44 1 ends with fan 41, the other end of conduit 44 is connecting duct fixed block 45 then, 45 participants of conduit fixed block produce heat object 100 contacts of heat energy, heat energy and conduit fixed block 45 heat conductivities that heat object 100 (for example CPU, display card or power supply unit etc.) is produced offset, and reach the function to heat object 100 fast coolings.Because conduit 44 has unidirectional low-temperature receiver to flow can produce that temperature is cold and hot to offset with hot stimulating food 100, making hot stimulating food 100 can effectively keep constant temperature can be not overheated.

The person of advancing sees also Fig. 6, and the fan 21 of heat-transfer device 20 can be set in the middle of the high conduction thing 22, and establishes a heat pipe 24 in high conduction thing 22; These heat pipe 24 1 ends contact with conducting strip 23, and are unrolling in high conduction thing 22.Utilize the blowing of fan 21, conducting strip 23 is discharged the high heat that semiconductor chilling plate 31 hot sides 312 are produced outside the shell 10 from hot gas outlet 13 fast.

At another embodiment of the utility model shown in Figure 7, it can set up a

heat radiator

26,46 again to increase the usefulness of heat interchange outside the

fan

21 and 41 of heat-transfer device 20 and cold guide apparatus 40.

Shown in Figure 8, outside low-temperature receiver conduit 44, increase the plastic cement pipe 47 that a cold insulation is used, its effect is except cold insulation and prevent the frostbite human body, also can provide two kinds of low-temperature receivers simultaneously.

Shell 10 covers (except being installed on the conduit fixed block 45 on the heat object 100) with the entire heat dissipation device, and its function is the arrangement that allows cross-ventilation and allow more effective gathering of low-temperature receiver and low-temperature receiver conduit transmit, and another function is for can be fixed on other objects.

Only be a kind of preferred embodiment of the present utility model shown in the above drawing, and in practical application, can be provided with many group low-temperature receiver devices 30 and heat-transfer device 20.Also can be connected with cold guide apparatus 40 organizing low-temperature receiver device 30 minutes more; and many conduits 44 are connected to same conduit fixed block 45 to improve radiating efficiency; perhaps each low-temperature receiver device 30 is connected a conduit fixed block 45 respectively with the conduit 44 of cold guide apparatus 40; and can a plurality of heat object be lowered the temperature; the simple and easy change that these are all under the utility model technological thought still belongs in the scope of patent protection.In addition, though the utility model is done narration with computer housing shown in the drawing, also can be applicable to a kind of temperature regulating device of other products.

Claims

1. a heat abstractor is characterized in that, comprising:

One low-temperature receiver device has a semiconductor chilling plate that can produce a hot side and a huyashi-chuuka (cold chinese-style noodles) by electric current, and this semiconductor chilling plate is positioned at the perforate of the refrigeration bar that a heat-barrier material makes;

2. according to the described heat abstractor of claim 1, it is characterized in that: further comprise a shell, and above-mentioned low-temperature receiver device, heat-transfer device and cold guide apparatus are fixed in this shell, extend on the heat object and the conduit of cold guide apparatus passes above-mentioned shell.

3. according to the described heat abstractor of claim 2, it is characterized in that: the arbitrary device in low-temperature receiver device, heat-transfer device and the cold guide apparatus is fixed in this shell.

4. according to the described heat abstractor of claim 1, it is characterized in that: heat-transfer device has a conducting strip that covers with above-mentioned semiconductor chilling plate hot side contact, and is connected with the high conduction thing that can heat energy be discharged by fan blowing on this conducting strip.

5. according to the described heat abstractor of claim 4, it is characterized in that: the fan of heat-transfer device is positioned in the middle of the high conduction thing, and has a heat pipe in the high conduction thing; This heat pipe one end contacts with conducting strip, and unrolls in the high conduction thing.

6. according to the described heat abstractor of claim 4, it is characterized in that: have a heat radiator on the fan of heat-transfer device.

7. according to the described heat abstractor of claim 1, it is characterized in that: cold guide apparatus has a cool guide sheet that covers with above-mentioned semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) contact, and is connected with a high conduction thing that can low-temperature receiver be blown into above-mentioned conduit one end by a fan on this cool guide sheet.

8. according to the described heat abstractor of claim 7, it is characterized in that: the conduit other end of cold guide apparatus is connected with a conduit fixed block, and this conduit fixed block contacts with heat object.

9. according to the described heat abstractor of claim 7, it is characterized in that: have a heat radiator on the fan of cold guide apparatus.

10. according to the described heat abstractor of claim 1, it is characterized in that: the conduit of cold guide apparatus has a plastic cement pipe that two kinds of low-temperature receivers can be provided simultaneously outward.