CN202562127U - Cold-heat exchange device with refrigeration chip with high thermal conductivity - Google Patents
Cold-heat exchange device with refrigeration chip with high thermal conductivity Download PDFInfo
- Publication number
- CN202562127U CN202562127U CN2012201752609U CN201220175260U CN202562127U CN 202562127 U CN202562127 U CN 202562127U CN 2012201752609 U CN2012201752609 U CN 2012201752609U CN 201220175260 U CN201220175260 U CN 201220175260U CN 202562127 U CN202562127 U CN 202562127U
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- cold
- copper foil
- layer
- cooling chip
- fin
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Abstract
The utility model provides a cold-heat exchange device with a refrigeration chip with high thermal conductivity. The cold-heat exchange device comprises a refrigeration chip, a first conductive module and a second conductive module, wherein the refrigeration chip comprises an aluminum nitride layer, a metallic film coated on the aluminum nitride layer and a copper foil layer formed on the metallic film, as well as a P-type semiconductor and an N-type semiconductor which are both fixed on the copper foil layer, wherein the first conductive module comprises a first base pasted on the cold end face of the refrigeration chip, a first fin fixed on the first base, and a first fan fixed on the first fin; and the second conductive module comprise a second base pasted on the hot end face of the refrigeration chip, a superconductive tube fixed on the second base, a second fin sleeved on the superconductive tube, and a second fan arranged on the second fin. By adopting the structure provided by the utility model, the refrigeration (heating) effect of the cold-heat exchange device can be improved.
Description
Technical field
The utility model is relevant with cooling chip, relevant especially a kind of temperature conduction device with high thermal conductivity coefficient cooling chip.
Background technology
The tradition aircondition need use refrigerant, yet refrigerant can bring the serious environmental pollution problem on making and reclaiming, and has therefore occurred utilizing thermoelectric cooling chip (Thermoelectric Cooling Chip) to replace the idea of the air conditioner that uses refrigerant.
Because thermoelectric cooling chip (hereinafter to be referred as cooling chip) has that volume is little, noiselessness, do not use advantages such as refrigerant, nuisanceless environmental protection; So application example of existing many thermoelectric cooling chips; Many insiders actively research and development utilize thermoelectric cooling chip and the cold circulator principles can be in order to the air conditioner of replacement refrigerant; It consists predominantly of thermoelectric cooling chip, cold circulator, the diffusing recycle unit of heat and temperature controller, and is cold by the thermoelectric cooling chip generation, transfers to fin with cold storage through cold guide plate via cold circulator again; Set required temperature with temperature controller again; Through fan the cold blowing that fin stores is sent, the heat that cooling chip produces is then cooled off eliminating by the heat radiation recycle unit, so as to reaching the cold degree that sets.
More than described with thermoelectric cooling chip and replaced traditional air conditioner; And utilize compressor and condenser etc. to reach cooling effect; But the refrigeration of its thermoelectric cooling chip and radiating effect are not good, and main cause is that the surface of thermoelectric cooling chip is made up of pottery mostly; Because the thermal conductivity factor of pottery is low excessively; The heat that makes thermoelectric cooling chip produce can't conduct to other radiator apace through pottery, causes the temperature of this thermoelectric cooling chip can't be reduced to desired temperature, makes the cold or heat extraction of the row of aircondition all can't reach desired temperature.
The utility model content
In view of this, the main purpose of the utility model is to provide a kind of cold-heat-exchanging exchange system with high thermal conductivity coefficient cooling chip, and this switch can promote refrigeration (heat) effect of cold-heat-exchanging exchange system.
For achieving the above object; The utility model provides a kind of cold-heat-exchanging exchange system with high thermal conductivity coefficient cooling chip; This switch comprises cooling chip, the first conduction module and the second conduction module with cold junction face and hot junction face; Cooling chip comprises first aln layer and second aln layer, first metallic film and second metallic film, first copper foil layer and second copper foil layer and mutual most P-type semiconductors and most N-type semiconductors of arranging; First metallic film is coated on first aln layer, and second metallic film is coated on second aln layer, and first copper foil layer is formed on first metallic film; Second copper foil layer is formed on second metallic film; P-type semiconductor and N-type semiconductor are fixed between first copper foil layer and second copper foil layer, and wherein, first aln layer and the second aln layer correspondence are positioned at the opposite side of P-type semiconductor and N-type semiconductor; The first conduction module comprises first pedestal that amplexiforms on the cold junction face of cooling chip, be fixed on first fin more than two, and first fan of device on first fin of first pedestal; The second conduction module comprises second pedestal, two the above superconducting pipes that are fixed on second pedestal that amplexiform on the face of the hot junction of cooling chip, be socketed in second fin more than two on the superconducting pipe, and second fan of device on second fin.
Further; Said cooling chip also comprises first soldering-tin layer and second soldering-tin layer; This first soldering-tin layer is coated on said first copper foil layer; This second soldering-tin layer is coated on said second copper foil layer, and said P-type semiconductor and said N-type semiconductor are combined on this first soldering-tin layer and this second soldering-tin layer.
Further, said first metallic film and said second metallic film are respectively the titanium film.
Further; This switch also comprises Windshield and the back wind scooper that mutual cover closes; This Windshield has the preceding air intake vent of corresponding said first fan and the front air outlet of corresponding said first fin, and this back wind scooper has the back air intake vent of corresponding said second fan and the back air outlet of corresponding said second fin.
Further; This switch comprises that also supporting seat reaches supporting seat down; Should go up the said first conduction module of supporting seat mask so that this first conduction module is fixed on the said Windshield, this time supporting seat mask said second conducts module so that this second conduction module is fixed on the wind scooper of said back.
Compared to prior art, the cooling chip of the utility model replaces existing ceramic wafer with the aluminium nitride laminate, because the thermal conductivity factor of aluminium nitride is much larger than the thermal conductivity factor of pottery; Therefore, the cooling chip of the utility model can conduct to cold (heat) on other conduction object, to continue to reduce the temperature of cooling chip apace; And reach required refrigeration temperature, still, because of the density height of aluminium nitride; Cause Copper Foil can't direct forming on aln layer, therefore, the utility model forms metallic film (like the titanium film) on the surface of aluminium nitride earlier; Copper Foil is formed on the metallic film, completion has the high thermal conductivity coefficient cooling chip in view of the above again; In addition; Compared to the existing aircondition that needs the assemblies such as compressor of the big electric weight of use; The cold-heat-exchanging exchange system of the utility model only need provide electric power in a small amount (supplying cooling chip and fan) to operate, and can save a large amount of energy and the electricity charge, more meets the feature of environmental protection and economy.
Description of drawings
Fig. 1 is the schematic perspective view of the cold-heat-exchanging exchange system of the utility model;
Fig. 2 is the perspective exploded view of the cold-heat-exchanging exchange system of the utility model;
Fig. 3 is the combination cross-sectional schematic of the cooling chip of the utility model;
Fig. 4 is the perspective exploded view of the cold-heat-exchanging exchange system application implementation of the utility model;
Fig. 5 is the schematic perspective view of the cold-heat-exchanging exchange system application implementation of the utility model;
Use sketch map when Fig. 6 is the cold-heat-exchanging exchange system application implementation of the utility model.
Description of reference numerals
1 cold-heat-exchanging exchange system, 10 cooling chips
11 cold junction faces, 12 hot junction faces
The 11a first aln layer 11b second aln layer
The 12a first metallic film 12b second metallic film
The 13a first copper foil layer 13b second copper foil layer
The 14a first soldering-tin layer 14b second soldering-tin layer
15a P-type semiconductor 15b N-type semiconductor
20 first conduction modules, 21 first pedestals
22 first fins, 23 first fans
30 second conduction modules, 31 second pedestals
32 superconducting pipes, 33 second fins
34 second fans, 40 Windshields
50 back wind scoopers, 51 back air intake vents
Supporting seat in the 52 back air-out 60
70 times supporting seat 131a first Copper Foil conductors
The 131b second Copper Foil conductor
The specific embodiment
Detailed description of relevant the utility model and technology contents, with the conjunction with figs. explanation as follows, yet appended accompanying drawing is not to be used to limit to the utility model only as illustrative purposes.
Please, be respectively the schematic perspective view and the perspective exploded view of the cold-heat-exchanging exchange system of the utility model with reference to Fig. 1 and Fig. 2; The cold-heat-exchanging exchange system 1 of the utility model comprises that the cooling chip 10, first with cold junction face 11 and hot junction face 12 conducts module 20, reaches the second conduction module 30.In the present embodiment; This cold-heat-exchanging exchange system 1 comprises two cooling chips 10 and corresponding two the first conduction modules 20 and the second conduction module 30; During actual enforcement; The quantity of this cooling chip 10, the first conduction module 20 and the second conduction module 30 does not limit, visual actual demand and adjusting.
This first conduction module 20 comprises amplexiforms at first pedestal 21 on the cold junction face 11 of this cooling chip 10, first fin 22 more than two that is fixed on this first pedestal 21, and first fan 23 of device on this first fin 22.
This second conduction module 30 comprise amplexiform at second pedestal 31 on the hot junction of this cooling chip 10 face 12, be fixed on the above superconducting pipe of two of this second pedestal 31 32, be socketed in second fin 33 more than two on this superconducting pipe 32, and second fan 34 of device on this second fin 33.
The more detailed explanation of the structure of this cooling chip 10 and method for making thereof as follows.
Please with reference to Fig. 3, be the combination cross-sectional schematic of the cooling chip of the utility model; This cooling chip 10 comprises the first aln layer 11a and the second aln layer 11b, the first metallic film 12a and the second metallic film 12b, the first copper foil layer 13a and the second copper foil layer 13b, the first soldering-tin layer 14a and the second soldering-tin layer 14b, most P-type semiconductor 15a and most N-type semiconductor 15b.
This first aln layer 11a and second aln layer 11b (the Aluminium nitride; AlN) be a kind of ceramics insulator; Its thermal conductivity factor is greatly about 180～240W/M.K; Because the purity of aluminium nitride is high, particle diameter is little, be evenly distributed, and has good ejection formation performance, so have higher heat-transfer capability compared to general pottery.
This first metallic film 12a is coated on this first aln layer 11a, and this second metallic film 12b is coated on this second aln layer 11b.Preferably; This first metallic film 12a and this second metallic film 12b can be respectively the titanium film; By the setting of this first metallic film 12a and this second metallic film 12b, can be beneficial to this first copper foil layer 13a and the second copper foil layer 13b are respectively formed on the density high first metallic film 12a and the second metallic film 12b.
This first copper foil layer 13a is formed on this first metallic film 12a, and this second copper foil layer 13b is formed on this second metallic film 12b.During actual enforcement; This first copper foil layer 13a comprises the spaced first Copper Foil conductor 131a more than two; This second copper foil layer 13b comprises the spaced second Copper Foil conductor 131b more than two, and this first Copper Foil conductor 131a and the setting of the second Copper Foil conductor 131b interleaved.
In addition, mutual most P-type semiconductor 15a and most N-type semiconductor 15b that arrange are fixed between this first copper foil layer 13a and this second copper foil layer 13b (the first soldering-tin layer 14a and the second soldering-tin layer 14b).By this first soldering-tin layer 14a is coated on this first copper foil layer 13a; This second soldering-tin layer 14b is coated on this second copper foil layer 13b; After treating this first soldering-tin layer 14a of fusion and this second soldering-tin layer 14b, this P-type semiconductor 15a and N-type semiconductor 15b promptly are combined on this first soldering-tin layer 14a and this second soldering-tin layer 14b.In view of the above, this first aln layer 11a and this second aln layer 11b correspondence are positioned at the opposite side of this P-type semiconductor 15a and this N-type semiconductor 15b, to amplexiform other thermal conductor as the face of connecting.
Please be respectively the perspective exploded view and the schematic perspective view of the cold-heat-exchanging exchange system application implementation of the utility model in addition with reference to Fig. 4 and Fig. 5.Before and after also can comprising during cold-heat-exchanging exchange system 1 practical application of the utility model each other the Windshield 40 that closes of cover and back wind scooper 50, and up and down each other the last supporting seat 60 of butt and under supporting seat 70.
This Windshield 40 has to preceding air intake vent 41 that should first fan 23 and to front air outlet 42 that should first fin 22.This back wind scooper 50 has to back air intake vent 51 that should second fan 34 and to back air outlet 52 that should second fin 33.In addition, supporting seat 60 masks, the first conduction module 20 on this is so that the first conduction module 20 is fixed on this Windshield 40, and this time supporting seat 70 masks second conduct module 30 so that the second conduction module 30 is fixed on this back wind scooper 50.
Then, please with reference to Fig. 6, the use sketch map during for the cold-heat-exchanging exchange system application implementation of the utility model.The cold-heat-exchanging exchange system of the utility model can be applicable on the equipment such as air conditioner, ice cream maker, reach in freezer or automobile air, during actual enforcement not as limit.
The cold-heat-exchanging exchange system of present embodiment is used on the refrigerator.During use, first pedestal 21 of this first conduction module 20 amplexiforms the cold junction face 11 of this cooling chip 10 and takes away the cold of this cooling chip 10, and conducts to this first fin 22; Simultaneously, cool exterior air from should before air intake vent 41 flow in this first conduction module 20, flow into this first fin 22 via the guiding of this first fan 23, again the cold belt of this first fin 22 is walked and is flowed into this front air outlet 42; In view of the above, take away cold (cooling effect) of this first conduction module 20 constantly, and utilize first fan 23 to be blown into front air outlet 42, can make the inside of this refrigerator reach desired cold degree to flow into the inside of refrigerator.
On the other hand; Second pedestal 31 of this second conduction module 30 amplexiforms the hot junction face 12 of this cooling chip 10 and takes away the heat of this cooling chip 10; And conduct to this superconducting pipe 32, via the conduction of this superconducting pipe 32 heat is conducted to this second fin 33 apace, simultaneously; Cool exterior air flows in this second guided modes 30 from this back air intake vent 51; Flow into this second fin 33 via the guiding of this second fan 34, the forced draft that this second fan 34 produces can promptly be taken away the heat of this second fin 33, and should flow out by back air outlet 52 certainly; In view of the above, take away the heat (radiating effect) of this second conduction module 30 constantly, so that this cooling chip 10 produces cooling effect sustainably, the inside that reaches refrigerator then reaches desired cold degree.
What deserves to be mentioned is that this cold-heat-exchanging exchange system 1 can contact according to user demand two above cooling chips 10, the first conduction module 20 and the second conduction module 30 are to reach better refrigeration (or pyrogenicity) effect.
The above is merely the specifying of preferred embodiment of the utility model, is not the protection domain in order to limitation the utility model, and other any equivalent transformation all should belong to the application's claim scope.
Claims (5)
1. the cold-heat-exchanging exchange system with high thermal conductivity coefficient cooling chip is characterized in that, this switch comprises:
Have the cooling chip of cold junction face and hot junction face, comprising:
First aln layer and second aln layer;
First metallic film and second metallic film, this first metallic film are coated on this first aln layer, and this second metallic film is coated on this second aln layer;
First copper foil layer and second copper foil layer, this first copper foil layer are formed on this first metallic film, and this second copper foil layer is formed on this second metallic film; And
A most P-type semiconductor and most N-type semiconductors are arranged alternately and are fixed between this first copper foil layer and this second copper foil layer, and wherein, this first aln layer and this second aln layer correspondence are positioned at the opposite side of this P-type semiconductor and this N-type semiconductor;
The first conduction module comprises and amplexiforms at first pedestal on the cold junction face of this cooling chip, first fin more than two that is fixed on this first pedestal, and first fan of device on this first fin; And
The second conduction module, comprise amplexiform second pedestal on the face of the hot junction of this cooling chip, be fixed on this second pedestal two above superconducting pipes, be socketed in second fin more than two on this superconducting pipe, and second fan of device on this second fin.
2. the cold-heat-exchanging exchange system with high thermal conductivity coefficient cooling chip as claimed in claim 1; It is characterized in that; Said cooling chip also comprises first soldering-tin layer and second soldering-tin layer; This first soldering-tin layer is coated on said first copper foil layer, and this second soldering-tin layer is coated on said second copper foil layer, and said P-type semiconductor and said N-type semiconductor are combined on this first soldering-tin layer and this second soldering-tin layer.
3. the cold-heat-exchanging exchange system with high thermal conductivity coefficient cooling chip as claimed in claim 1 is characterized in that, said first metallic film and said second metallic film are respectively the titanium film.
4. the cold-heat-exchanging exchange system with high thermal conductivity coefficient cooling chip as claimed in claim 1; It is characterized in that; This switch also comprises Windshield and the back wind scooper that mutual cover closes; This Windshield has the preceding air intake vent of corresponding said first fan and the front air outlet of corresponding said first fin, and this back wind scooper has the back air intake vent of corresponding said second fan and the back air outlet of corresponding said second fin.
5. the cold-heat-exchanging exchange system with high thermal conductivity coefficient cooling chip as claimed in claim 4; It is characterized in that; This switch comprises that also supporting seat reaches supporting seat down; Should go up the said first conduction module of supporting seat mask so that this first conduction module is fixed on the said Windshield, this time supporting seat mask said second conducts module so that this second conduction module is fixed on the wind scooper of said back.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201752609U CN202562127U (en) | 2012-04-23 | 2012-04-23 | Cold-heat exchange device with refrigeration chip with high thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201752609U CN202562127U (en) | 2012-04-23 | 2012-04-23 | Cold-heat exchange device with refrigeration chip with high thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202562127U true CN202562127U (en) | 2012-11-28 |
Family
ID=47211777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201752609U Expired - Fee Related CN202562127U (en) | 2012-04-23 | 2012-04-23 | Cold-heat exchange device with refrigeration chip with high thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202562127U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103375938A (en) * | 2012-04-23 | 2013-10-30 | 林义民 | Refrigeration chip with high heat conduction coefficient and manufacturing method and product thereof |
| CN109390452A (en) * | 2018-10-17 | 2019-02-26 | 广东远合工程科技有限公司 | A kind of great power LED ferromagnetic composite ceramic-based heat-radiating substrate of carbon fiber coining |
-
2012
- 2012-04-23 CN CN2012201752609U patent/CN202562127U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103375938A (en) * | 2012-04-23 | 2013-10-30 | 林义民 | Refrigeration chip with high heat conduction coefficient and manufacturing method and product thereof |
| CN109390452A (en) * | 2018-10-17 | 2019-02-26 | 广东远合工程科技有限公司 | A kind of great power LED ferromagnetic composite ceramic-based heat-radiating substrate of carbon fiber coining |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121128 Termination date: 20170423 |